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Research Papers

Analysis and Design of Wire Transport System in Microwire-Electronic Discharge Machining

[+] Author and Article Information
P. W. Wang

Assistant Professor
e-mail: meewpw@cc.hfu.edu.tw

C. S. Yang

Graduate Research Assistant
Department of Mechatronic Engineering,
Huafan University,
New Taipei City,
Taiwan 22301, ROC

Contributed by the Manufacturing Engineering Division of ASME for publication in the JOURNAL OF MICRO- AND NANO-MANUFACTURING. Manuscript received September 19, 2012; final manuscript received March 31, 2013; published online May 7, 2013. Assoc. Editor: Hitoshi Ohmori.

J. Micro Nano-Manuf 1(2), 021006 (May 07, 2013) (9 pages) Paper No: JMNM-12-1062; doi: 10.1115/1.4024266 History: Received September 19, 2012; Revised March 31, 2013

A dynamic model for analyzing the wire transport system of micro w-EDM (wire electronic discharge machining) is proposed. Based on the model, two mechanisms are proposed to stabilize the wire tension. The first mechanism is the active wire feed apparatus where the wire spool is fed by a motor actively, instead of passively pulled by the windup motor. Hence, the inertia loading of the wire spool can be isolated from the system. The second mechanism is mounting a multilayer damped vibration absorber (MDVA) on the system. As the wire tension variation occurs, the MDVA oscillates to attenuate the wire tension variation. The performances of both mechanisms on the wire tension variation are theoretically investigated and experimentally validated through corner cutting on the 1.0 mm thickness tungsten carbide. Results show that the wire tension variation can be reduced from 10.3 gf to 3.3 gf after mounting the active wire feed apparatus and the oscillation frequency is increased from 13 Hz to 21 Hz. The wire tension variation can be further reduced to 1.9 gf after mounting the MDVA on the system and the high frequency perturbation is significantly attenuated. The 30-deg corner cutting shows that the corner error are significantly reduced from 26.0 μm to 12.0 μm; the standard deviation of kerf is reduced from 4.34 μm to 0.96 μm, and the surface roughness Ra is reduced from 1.15 μm to 0.63 μm after employing both developed mechanisms.

Copyright © 2013 by ASME
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References

Figures

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Fig. 1

Typical wire transport system of wire-EDM

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Fig. 2

Illustration of active wire feed apparatus

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Fig. 3

Illustration of MDVA

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Fig. 4

Illustration of the developed wire transport system

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Fig. 5

(a) Illustration of the typical wire transport system and (b) MDOF model of Fig. 5(a)

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Fig. 6

(a) Illustration of the wire transport system with active wire feed unit and (b) MDOF model of Fig. 6(a)

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Fig. 7

(a) Illustration of the developed wire transport system and (b) MDOF model of Fig. 7(a)

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Fig. 8

Frequency responses of the three wire transport systems

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Fig. 9

Fundamental frequency of the system with respect to different MDVA spring constant

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Fig. 10

Modal loss factor of the system with respect to different MDVA spring constant

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Fig. 11

Illustration of the experimental apparatus

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Fig. 12

Wire tension of original system and active wire feed apparatus

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Fig. 13

Wire tension of active wire feed system and new system

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Fig. 14

Monitoring voltage of wire electrode using original system

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Fig. 15

Monitoring voltage of wire electrode using the new system

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Fig. 16

Surface profile obtained using original and new systems: (a) Original wire transport system and (b) developed wire transport system

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Fig. 17

Geometrical accuracy of 30 deg inner corner: (a) Original wire transport system and (b) developed wire transport system

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Fig. 18

Geometrical accuracy of 60 deg inner corner: (a) Original wire transport system and (b) developed wire transport system

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Fig. 19

Geometrical accuracy of 90 deg inner corner

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