Research Papers

Excimer Laser Micromachining Using Binary Mask Projection for Large Area Patterning With Single Micrometer Features

[+] Author and Article Information
Govind Dayal, S. Anantha Ramakrishna

Department of Physics,
Indian Institute of Technology Kanpur,
Kanpur 208016, India

Syed Nadeem Akhtar

Department of Mechanical Engineering,
Indian Institute of Technology Kanpur,
Kanpur 208016, India

J. Ramkumar

Department of Mechanical Engineering,
Indian Institute of Technology Kanpur,
Kanpur 208016, India
e-mail: jrkumar@iitk.ac.in

1Corresponding author.

Contributed by the Manufacturing Engineering Division of ASME for publication in the JOURNAL OF MICRO- AND Nano-Manufacturing. Manuscript received July 3, 2012; final manuscript received June 20, 2013; published online August 9, 2013. Assoc. Editor: Ashutosh Sharma.

J. Micro Nano-Manuf 1(3), 031002 (Aug 09, 2013) (7 pages) Paper No: JMNM-12-1037; doi: 10.1115/1.4024880 History: Received July 03, 2012; Revised June 20, 2013

Excimer laser micromachining using binary mask projection has been investigated for rapid patterning of single micrometer features over large areas of various substrates. Simple limit for depth of focus that determines the depth to width aspect ratios is given and verified for different materials. Binary mask projection technique is found to conformally reproduce the mask features from the millimetre to the micrometer scale under proper focusing conditions. Large arrays of 1 μm and 15 μm holes on Kapton are made with high resolution and uniform periodicity. Material removal rate (MRR) for the laser machining of these holes are examined and the machining efficiency for these are found to have different dependence on the fluence. A saturation of hole-depth with increasing number of pulses is obtained.

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Fig. 1

Schematic diagram of the experimental setup for laser machining

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Fig. 2

Optical microscopic images of the micromachined structures on a Kapton sheet placed at various planes above and below the focal plane. The blurring of features and lack of resolution is clear when the workpiece is kept away from the focal plane. Scale: 8 units = 10 μm.

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Fig. 3

Schematic diagram showing the resolution of imaging two distinct spots about the focal plane of two adjacent focused beams

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Fig. 4

Optical microscopic images of the through slots intersecting at 45 deg machined through 30 μm thick Kapton sheets. The widths of the lines from left to right panels are 100 μm, 10 μm, and 1 μm, respectively.

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Fig. 5

Transmission (left) and reflection (right) optical microscopic images of 3 μm and 4 μm diameter holes in Aluminium and boPET, respectively

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Fig. 6

Optical microscopic images of 12 slots of 1 μm width and 150 μm length with interslot distance of 1 μm machined on a 30 μm thick Kapton sheet. Eight units of the scale correspond to 10 μm. The right panel shows the corresponding atomic force micrograph showing the topography of the image.

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Fig. 7

Left panel: Optical microscopic image of arrays of 2 μm diameter holes with a period of 4 μm machined on a Kapton sheet. Middle panel shows the topography of the sample measured by AFM. Right panel: The SEM image of an array of 1 μm holes with 2 μm period. These large scale arrays have a total array area of 1 mm × 1 mm with excellent uniformity throughout.

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Fig. 8

Transmission optical microscopic image of a complex network of channels machined on chrome coated glass using excimer laser

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Fig. 9

Plot showing the depth of the `holes in an array of 1 μm holes machined at various energies and with 5, 10, or 15 pulses

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Fig. 10

Material removal rate with respect to laser pulse parameters. (a) The panel on the left shows the machined hole-depths with respect to the number of pulses at various pulse energies and (b) the panel on the right shows the same data against the total energy = pulse energy × the number of pulses. (The lines shown are only a guide to the eye.)




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