Microtransfer printing is rapidly emerging as an effective method for heterogeneous materials integration. Laser microtransfer printing (LMTP) is a noncontact variant of the process that uses laser heating to drive the release of the microstructure from the stamp. This makes the process independent of the properties or preparation of the receiving substrate. In this paper, an extensive study is conducted to investigate the capability of the LMTP process. Furthermore, a thermomechanical finite element model (FEM) is developed, using the experimentally observed delamination times and absorbed powers, to estimate the delamination temperatures at the interface, as well as the strain, displacement, and thermal gradient fields.