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Research Papers

Influence of Process Errors on the Tool Load in Microblanking of Thin Metal Foils With Silicon Punches

[+] Author and Article Information
Sven Hildering

Institute of Manufacturing Technology,
Friedrich-Alexander-Universität
Erlangen-Nürnberg,
Egerlandstraße 13,
Erlangen 91058, Germany
e-mail: sven.hildering@fau.de

Ulf Engel

Mem. ASME
Institute of Manufacturing Technology,
Friedrich-Alexander-Universität
Erlangen-Nürnberg,
Egerlandstraße 13,
Erlangen 91058, Germany
e-mail: ulf.engel@fau.de

Marion Merklein

Institute of Manufacturing Technology,
Friedrich-Alexander-Universität
Erlangen-Nürnberg,
Egerlandstraße 13,
Erlangen 91058, Germany
e-mail: marion.merklein@fau.de

Contributed by the Manufacturing Engineering Division of ASME for publication in the JOURNAL OF MICRO- AND NANO-MANUFACTURING. Manuscript received August 11, 2014; final manuscript received January 20, 2015; published online February 20, 2015. Assoc. Editor: Gracious Ngaile.

J. Micro Nano-Manuf 3(2), 021001 (Jun 01, 2015) (8 pages) Paper No: JMNM-14-1052; doi: 10.1115/1.4029629 History: Received August 11, 2014; Revised January 20, 2015; Online February 20, 2015

The trend toward miniaturization of metallic microparts results in the need of high-precision production methods. Major challenges are, for example, downsizing of tools and adequate positioning accuracy within blanking. Starting from a novel approach for tool miniaturization and its realization, the aim of this study is showing the assessment of tool sensitivity against process errors. Etched silicon punches were used for blanking copper foils, where outbreaks occurred at the cutting edge. Hence, tool stresses during blanking were analyzed by finite element (FE) method in dependency of defined positioning and process errors and evaluated concerning tool stresses and sheared edge quality.

Copyright © 2015 by ASME
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References

Figures

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Fig. 1

Tool system for silicon punches

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Fig. 2

(a) Lead frame (Shinko) with dam bars. (b) Derived workpiece geometry with grain structure of copper foil.

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Fig. 3

Test rig for microblanking of thin foils

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Fig. 4

Examples for different tool wear occurrences at used silicon punches

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Fig. 5

Methodology for the determination of punch stresses during the blanking process

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Fig. 6

Simplified model for lateral misalignment between punch and die

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Fig. 7

Maximum tensile stresses in the silicon punch in dependency of punch-to-die clearance

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Fig. 8

Simplified model for angle misalignment between punch and die with different misalignment angles

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Fig. 9

Maximum tensile stresses in the silicon punch in dependency of angle misalignment between punch and die

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Fig. 10

Confocal microscope measurement of the copper foil topography and simplified model for the FE simulation with surface peak variation

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Fig. 11

Maximum tensile stresses in the silicon punch in dependency of copper foil topography

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Fig. 12

Simplified model for adhered foil particles at the punch and stress distribution for different particle positions

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Fig. 13

Maximum tensile stresses in the silicon punch in dependency of the position of a punch adhered foil particle

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Fig. 14

Maximum tensile stresses in the silicon punch with combined process errors

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Fig. 15

Typical punch-force-stroke curves for different process errors from FE simulation

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Fig. 16

Resulting sheared edge quality at the copper foil without and with process errors

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