Research Papers

Development of Micro Pencil Grinding Tools Via an Electroless Plating Process

[+] Author and Article Information
Peter A. Arrabiyeh

Institute for Manufacturing Technology
and Production Systems,
TU Kaiserslautern,
Kaiserslautern 67663, Germany

Benjamin Kirsch, Jan C. Aurich

Institute for Manufacturing Technology and
Production Systems,
TU Kaiserslautern,
Kaiserslautern 67663, Germany

Contributed by the Manufacturing Engineering Division of ASME for publication in the JOURNAL OF MICRO- AND NANO-MANUFACTURING. Manuscript received August 24, 2016; final manuscript received September 2, 2016; published online November 9, 2016. Editor: Jian Cao.

J. Micro Nano-Manuf 5(1), 011002 (Nov 09, 2016) (6 pages) Paper No: JMNM-16-1037; doi: 10.1115/1.4034645 History: Received August 24, 2016; Revised September 02, 2016

This paper presents the development process of a new coating method for micro pencil grinding tools (MPGTs). MPGTs, applied for microgrinding, consist of a base body, abrasives, and a metallic bond. The manufacturing process of these microtools presents two challenges. The first being in finding a method to embed the abrasives with a uniform grit distribution and the second finding the correct parameters, required for a bond with adequate grit retention forces. In this research, an electroless plating process is presented. Both the abrasive grit distribution method and the plating parameters will be presented in this paper.

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Fig. 7

SEM micrographs of electroless nickel deposits from plating solutions with thiourea concentrations of (a) 0.6 mg/l, (b) 0.5 mg/l, and (c) 0.4 mg/l

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Fig. 8

SEM micrographs of electroless nickel deposits from plating solutions with diamond concentrations of (a) 1000 mg/l, (b) 500 mg/l, and (c) 150 mg/l

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Fig. 4

The right substrate has a black nickel coating and the one on the left is uncoated

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Fig. 6

Scanning electron microscope (SEM) micrographs of electroless nickel deposits from plating solutions with thiourea concentrations of (a) 1.1 mg/l, (b) 0.7 mg/l, and (c) 0.1 mg/l

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Fig. 5

Effect of thiourea on the nickel deposition rate

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Fig. 9

SEM micrographs of electroless nickel deposits from substrates with rotation speeds of (a) 1.5 rpm, (b) 9 rpm, and (c) 25 rpm

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Fig. 10

SEM micrographs of an electroless nickel deposit with a substrate rotation speed of 46 rpm

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Fig. 11

SEM micrographs of electroless nickel deposits with embedding times of (a) 30 s, (b) 60 s, and (c) 120 s

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Fig. 3

Nickel strike bath's electric cycle

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Fig. 2

Experimental setup

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Fig. 1

Scheme of the experimental process chain



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