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Research Papers

Development of Micro Pencil Grinding Tools Via an Electroless Plating Process

[+] Author and Article Information
Peter A. Arrabiyeh

Institute for Manufacturing Technology
and Production Systems,
TU Kaiserslautern,
Kaiserslautern 67663, Germany

Benjamin Kirsch, Jan C. Aurich

Institute for Manufacturing Technology and
Production Systems,
TU Kaiserslautern,
Kaiserslautern 67663, Germany

Contributed by the Manufacturing Engineering Division of ASME for publication in the JOURNAL OF MICRO- AND NANO-MANUFACTURING. Manuscript received August 24, 2016; final manuscript received September 2, 2016; published online November 9, 2016. Editor: Jian Cao.

J. Micro Nano-Manuf 5(1), 011002 (Nov 09, 2016) (6 pages) Paper No: JMNM-16-1037; doi: 10.1115/1.4034645 History: Received August 24, 2016; Revised September 02, 2016

This paper presents the development process of a new coating method for micro pencil grinding tools (MPGTs). MPGTs, applied for microgrinding, consist of a base body, abrasives, and a metallic bond. The manufacturing process of these microtools presents two challenges. The first being in finding a method to embed the abrasives with a uniform grit distribution and the second finding the correct parameters, required for a bond with adequate grit retention forces. In this research, an electroless plating process is presented. Both the abrasive grit distribution method and the plating parameters will be presented in this paper.

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References

Butler-Smith, P. W. , Axinte, D. A. , and Daine, M. , 2012, “ Solid Diamond Micro-Grinding Tools: From Innovative Design and Fabrication to Preliminary Performance Evaluation in Ti–6Al–4V,” Int. J. Mach. Tools Manuf., 59, pp. 55–64. [CrossRef]
Alting, L. , Kimura, F. , Hansen, H. N. , and Bissacco, G. , 2003, “ Micro Engineering,” CIRP Ann. Manuf. Technol., 52(2), pp. 635–657. [CrossRef]
Aurich, J. C. , Engmann, J. , Schueler, G. M. , and Haberland, R. , 2009, “ Micro Grinding Tool for Manufacture of Complex Structures in Brittle Materials,” CIRP Ann. Manuf. Technol., 58(1), pp. 311–314. [CrossRef]
Engmann, J. , 2011, “ Galvanisch Gebundene Mikro-Schleifstifte: Entwicklung, Herstellung und Einsatz,” Ph.D. thesis, University of Kaiserslautern, Kaiserslautern, Germany.
Tilo Michal, Haefeli Diamond Tools Manufacturer, 2010, “ Alles im Augenmaß,” Diamond Business, Eltmann, Germany, pp. 16–18.
Gäbler, J. , and Pleger, S. , 2010, “ Precision and Micro CVD Diamond-Coated Grinding Tools,” Int. J. Mach. Tools Manuf., 50(4), pp. 420–424. [CrossRef]
Lou, H. H. , and Huang, Y. L. , 2006, “ Electroplating,” Encyclopedia of Chemical Processing, S. Lee , ed., Marcel Dekker, New York.
Park, H. K. , Onikura, H. , Ohnishi, O. , and Sharifuddin, A. , 2010, “ Development of Micro-Diamond Tools Through Electroless Composite Plating and Investigation Into Micro-Machining Characteristics,” Precis. Eng., 34(3), pp. 376–386. [CrossRef]
Cheong, W. J. , Luan, B. L. , and Shoesmith, D. W. , 2004, “ The Effects of Stabilizers on the Bath Stability of Electroless Ni Deposition and the Deposit,” Appl. Surf. Sci., 229(1–4), pp. 282–300. [CrossRef]
Parkinson, R. , 1997, “ Properties and Applications of Electroless Nickel Deposits,” Nickel Development Institute, Toronto, ON, Canada, Technical Series No. 10081.
Strauch, A. , 1987, Galvanotechnisches Fachwissen, 2nd ed., Deutscher Verlag für Grundstoffindustrie, Leipzig, Germany.
Watson, S. A. , 1989, “ Electroless Nickel Coatings,” Nickel Development Institute, Toronto, ON, Canada, Technical Series No. 10055.
Schlesinger, M. , and Paunovic, M. , 2010, Modern Electroplating, 5th ed., Wiley, New York.
Jappes, J. W. , Ramamoorthy, B. , and Nair, P. K. , 2005, “ A Study on the Influence of Process Parameters on Efficiency and Crystallinity of Electroless Ni–P Deposits,” J. Mater. Process. Technol., 169(2), pp. 308–313. [CrossRef]
Lin, K. L. , and Hwang, J. W. , 2002, “ Effect of Thiourea and Lead Acetate on the Deposition of Electroless Nickel,” Mater. Chem. Phys., 76(2), pp. 204–211. [CrossRef]
Mallory, G. O. , and Hajdu, J. B. , 1990, Electroless Plating: Fundamentals and Applications, American Electroplaters and Surface Finishers Society, Orlando, FL.
Brenner, A. , and Riddel, G. , 1947, “ Deposition of Nickel and Cobalt by Chemical Reduction,” Part of the Journal of Research of the National Bureau of Standards, Vol. 39, Paper No. RP1835, pp. 385–395. http://nvlpubs.nist.gov/nistpubs/jres/39/jresv39n5p385_A1b.pdf

Figures

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Fig. 1

Scheme of the experimental process chain

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Fig. 2

Experimental setup

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Fig. 3

Nickel strike bath's electric cycle

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Fig. 4

The right substrate has a black nickel coating and the one on the left is uncoated

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Fig. 5

Effect of thiourea on the nickel deposition rate

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Fig. 6

Scanning electron microscope (SEM) micrographs of electroless nickel deposits from plating solutions with thiourea concentrations of (a) 1.1 mg/l, (b) 0.7 mg/l, and (c) 0.1 mg/l

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Fig. 7

SEM micrographs of electroless nickel deposits from plating solutions with thiourea concentrations of (a) 0.6 mg/l, (b) 0.5 mg/l, and (c) 0.4 mg/l

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Fig. 8

SEM micrographs of electroless nickel deposits from plating solutions with diamond concentrations of (a) 1000 mg/l, (b) 500 mg/l, and (c) 150 mg/l

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Fig. 9

SEM micrographs of electroless nickel deposits from substrates with rotation speeds of (a) 1.5 rpm, (b) 9 rpm, and (c) 25 rpm

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Fig. 10

SEM micrographs of an electroless nickel deposit with a substrate rotation speed of 46 rpm

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Fig. 11

SEM micrographs of electroless nickel deposits with embedding times of (a) 30 s, (b) 60 s, and (c) 120 s

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