Altering the wetting characteristics of copper will positively impact numerous practical applications. The contact angle (CA) of a water droplet on the polished copper surface is usually between 70° and 80°. This paper discusses a facile, scalable, tuned bulk micro-manufacturing approach for altering the surface topology of copper concomitantly at the micro- and nano- length scales, and thus significantly influence its wetting characteristics. The resultant copper surfaces were found to be robust, non-toxic, and exhibited ultra-omniphilicity to various industrial liquids. This extreme wetting ability akin to a paper towel (CA of zero for multiple liquids) was achieved by tuning the bulk micro-manufacturing process to generate connected hierarchical micro- and nano-roughness with nano-cavities within the embryos of micro-cavities. With an adsorbed coating of ester, the same ultra-omniphilic copper surfaces were found to exhibit robust super-hydrophobicity (CA ~ 152° for water).