Investigations on Flexural Fatigue Strength of Conductor Paths Fabricated by LPKF-LDS? Technology

[+] Author and Article Information
Hagen Mueller

Hahn-Schickard, Allmandring 9 b, 70569 Stuttgart, Germany

Tobias Groezinger

Hahn-Schickard, Allmandring 9 b, 70569 Stuttgart, Germany

Sascha Weser

Hahn-Schickard, Allmandring 9 b, 70569 Stuttgart, Germany

Wolfgang Eberhardt

Hahn-Schickard, Allmandring 9 b, 70569 Stuttgart, Germany

Andre Zimmermann

Hahn-Schickard, University of Stuttgart, Institute for Micro Integration IFM, Allmandring 9 b, 70569 Stuttgart, Germany

1Corresponding author.

ASME doi:10.1115/1.4038320 History: Received June 22, 2017; Revised October 27, 2017


Reliability aspects are crucial for the success of every technology in industrial application. Regarding interconnect devices, several methods are applied to evaluate reliability of conductor paths like accelerated environmental tests. Especially Molded Interconnect Devices (MID) which enable versatile applications with 3D circuitry on 3D shaped injection molded thermoplastic parts are often under particular stress, e.g. as component of a housing. In this study a new test method for evaluating the flexural fatigue strength of conductor paths produced by the laser based LPKF-LDSĀ® technology is presented. For characterization of test samples a test bench for flexural fatigue test was built up. A result of the flexural fatigue test is a characteristic Woehler curve of the metal layer system. Applying this new test method, essential influencing parameters on the reliability of MID under mechanical load can be identified. So the metal layer system as well as the geometric parameters of the metal layer is crucial for the performance. Furthermore test specimens are tested under different types of mechanical load, i. e. tensile stress and compressive stress. For a holistic view on reliability of MID experimental results are discussed and supported by simulations. An important finding of the study is the advantage of nickel-free layer systems in contrast to the Cu/Ni/Au layer system which is often used in MID technology.

Copyright (c) 2017 by ASME
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