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Ball-Grid-Array packaging
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Proceedings Papers

Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 65-70, November 15–20, 1998
Paper No: IMECE1998-0430
Proceedings Papers

Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 139-148, November 11–16, 2001
Paper No: IMECE2001/HTD-24387