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Proceedings Papers

Assessment of an Axisymmetric Analytical Model of a Square Areal Array Assembly

S. Shakya, S. M. Heinrich, J. Liang, P. S. Lee

Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 55-63, November 16–21, 1997

Paper No: IMECE1997-0814

DOI: https://doi.org/10.1115/IMECE1997-0814

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Topics: Ball-Grid-Array packaging, Ceramics, Computer simulation, Die cutting, Disks, Displacement, Finite element analysis, Finite element methods, Flip-chip packages, Geometry

Proceedings Papers

CBGA Solder Fillet Shape Prediction and Design Optimization

Y. Li, R. L. Mahajan

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 431-438, November 16–21, 1997

Paper No: IMECE1997-1120

DOI: https://doi.org/10.1115/IMECE1997-1120

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Topics: Design, Optimization, Shapes, Solders, Mathematical analysis, Reliability, Ball-Grid-Array packaging, Ceramics, Composite materials, Experimental design

Proceedings Papers

On the Equivalent Finite Element Beam Model for Ball Grid Array Analysis

Hsien-Chie Cheng, Kuo-Ning Chiang, Ming-Hsiao Lee

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 353-360, November 16–21, 1997

Paper No: IMECE1997-1110

DOI: https://doi.org/10.1115/IMECE1997-1110

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Topics: Ball-Grid-Array packaging, Finite element analysis, Optimization, Packaging, Pipes, Plastics, Solder joints

Proceedings Papers

Parametric Study of Thermal Performance of a Plastic Ball Grid Array, Single Package Technology for Automotive Applications

K. Ramakrishna, J. R. Trent

Proc. ASME. IMECE97, CAE/CAD and Thermal Management Issues in Electronic Systems, 13-21, November 16–21, 1997

Paper No: IMECE1997-1210

DOI: https://doi.org/10.1115/IMECE1997-1210

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Topics: Automotive industry, Ball-Grid-Array packaging, Temperature, Junctions, Printed circuit boards, Computational fluid dynamics, Thermal conductivity, Heat transfer, Transients (Dynamics), Energy dissipation

Proceedings Papers

Opportunities and Needs for Interfacial Fracture Mechanics in Microelectronic Packaging Industry

William T. Chen, David Questad, David Read, Bahgat Sammakia

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 183-192, November 16–21, 1997

Paper No: IMECE1997-0515

DOI: https://doi.org/10.1115/IMECE1997-0515

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Topics: Fracture mechanics, Microelectronic packaging, Packaging, Ball-Grid-Array packaging, Electronic packaging, Design, Electronic packages, Electronic products, Low temperature, Manufacturing

Proceedings Papers

Stress Analysis of High Density Bare Chip Packaging Technologies

Yutaka Tsukada, Shogo Mizumoto, Yasuyuki Kodama, Hideo Nishimura

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 49-50, November 16–21, 1997

Paper No: IMECE1997-0499

DOI: https://doi.org/10.1115/IMECE1997-0499

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Topics: Density, Packaging, Stress analysis (Engineering), Epoxy adhesives, Epoxy resins, Ceramics, Ball-Grid-Array packages, Ball-Grid-Array packaging, Electronic packaging, Flip-chip

Proceedings Papers

Some Aspects of the Thermal Performance of a Tape Ball Grid Array (TBGA) Package

Sanjeev B. Sathe, Bahgat G. Sammakia

Proc. ASME. IMECE98, Manufacturing Science and Engineering, 747-756, November 15–20, 1998

Paper No: IMECE1998-1089

DOI: https://doi.org/10.1115/IMECE1998-1089

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Topics: Accounting, Adhesives, Ball-Grid-Array packaging, Construction, Convection, Design, Flat heat pipes, Geometry, Heat conduction, Heat sinks

Proceedings Papers

Parametric Analysis of Thermally Enhanced BGA Reliability Using a Finite-Volume-Weighted Averaging Technique

Hsien-Chie Cheng, Kuo-Ning Chiang, Chao-Kuang Chen

Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 13-20, November 15–20, 1998

Paper No: IMECE1998-0423

DOI: https://doi.org/10.1115/IMECE1998-0423

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Topics: Ball-Grid-Array packaging, Reliability, Solder joints, Ball-Grid-Array packages, Design, Fatigue, Geometry, Corners (Structural elements), Finite element analysis, Manufacturing

Proceedings Papers

Automatic Warpage Measurement of Advanced Packages by Optical Method

Xiaoyuan He, Jiabin Dai, Sheng Liu

Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 65-70, November 15–20, 1998

Paper No: IMECE1998-0430

DOI: https://doi.org/10.1115/IMECE1998-0430

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Topics: Warping, Deformation, Ball-Grid-Array packaging, Shapes, Computer software, Diffraction gratings, Imaging, Manufacturing, Modeling, Packaging

Proceedings Papers

On Enhancing Eutectic Solder Joint Reliability Using a 2 nd -Reflow-Process Approach

Kuo-Ning Chiang, Hsien-Chie Cheng

Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 21-25, November 15–20, 1998

Paper No: IMECE1998-0424

DOI: https://doi.org/10.1115/IMECE1998-0424

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Topics: Reliability, Solder joints, Solders, Ball-Grid-Array packaging, Geometry, Fatigue life, Flip-chip, Flip-chip devices, Materials properties

Proceedings Papers

A Constriction Resistance Model in Thermal Analysis of Solder Ball Joints in Ball Grid Array Packages

T. M. Ying, K. C. Toh

Proc. ASME. IMECE99, Heat Transfer: Volume 1, 29-36, November 14–19, 1999

Paper No: IMECE1999-0967

DOI: https://doi.org/10.1115/IMECE1999-0967

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Topics: Ball-Grid-Array packages, Solders, Thermal analysis, Ball-Grid-Array packaging, Solder joints, Energy dissipation, Finite element methods, Finite element model, Heat, Boundary-value problems

Proceedings Papers

A Study of the Aperture Filling Process in Solder Paste Stencil Printing

Jianbiao Pan, Gregory L. Tonkay

Proc. ASME. IMECE99, Electronics Manufacturing Issues, 75-82, November 14–19, 1999

Paper No: IMECE1999-0920

DOI: https://doi.org/10.1115/IMECE1999-0920

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Topics: Printing, Solders, Ball-Grid-Array packaging, Surface mount assemblies, Flip-chip, Flip-chip devices, Packaging

Proceedings Papers

Impact of On-Die Discrete Heating on Thermal Performance Characteristics of Silicon Based IC Electronic Packages

V. H. Adams, K. Ramakrishna

Proc. ASME. IMECE99, Electronics Manufacturing Issues, 99-106, November 14–19, 1999

Paper No: IMECE1999-0922

DOI: https://doi.org/10.1115/IMECE1999-0922

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Topics: Electronic packages, Heating, Performance characterization, Silicon, Heat, Temperature, Thermal characterization, Ball-Grid-Array packaging, Engineering simulation, Junctions

Proceedings Papers

Integrated Transient Thermal and Mechanical Analysis of Molded PBGA Packages During Thermal Shock

Lei L. Mercado, Tien-Yu Tom Lee, Jeff Cook

Proc. ASME. IMECE99, Electronics Manufacturing Issues, 111-119, November 14–19, 1999

Paper No: IMECE1999-0924

DOI: https://doi.org/10.1115/IMECE1999-0924

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Topics: Thermal shock, Transients (Dynamics), Computational fluid dynamics, Stress, Boundary-value problems, Ball-Grid-Array packaging, Flip-chip, Heat transfer, Heat transfer coefficients, Molded plastics

Proceedings Papers

Thermal Issues That Arise due to Manufacturing Processes: Evaluation and Measurement Techniques

Bahgat Sammakia, Sanjeev Sathe

Proc. ASME. IMECE99, Electronics Manufacturing Issues, 121-138, November 14–19, 1999

Paper No: IMECE1999-0925

DOI: https://doi.org/10.1115/IMECE1999-0925

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Topics: Manufacturing, Heat sinks, Adhesives, Delamination, Design, Lamination, Signals, Stress, Accounting, Ball-Grid-Array packaging

Proceedings Papers

Prediction of Thermal Performance of Flip-Chip-Plastic Ball Grid Array (FC-PBGA) Packages: Effect of Die Size

K. Ramakrishna, T.-Y. Lee

Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 139-148, November 11–16, 2001

Paper No: IMECE2001/HTD-24387

DOI: https://doi.org/10.1115/IMECE2001/HTD-24387

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Topics: Ball-Grid-Array packaging, Junctions, Mixed convection, Computation, Computational fluid dynamics, Databases, Flip-chip, Heat transfer, Thermal resistance

Proceedings Papers

CAE Simulation and Verification of Wire Sweep for BGA 436

Wen-Ren Jong, You-Ren Chen

Proc. ASME. IMECE2000, CAE and Related Innovations for Polymer Processing, 285-298, November 5–10, 2000

Paper No: IMECE2000-1243

DOI: https://doi.org/10.1115/IMECE2000-1243

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Topics: Ball-Grid-Array packaging, Computer-aided engineering, Simulation, Wire, Density, Bonding, Computer software, Diluents, Manufacturing, Microelectronic devices

Proceedings Papers

Experimentally Validated Vibration Fatigue Life Prediction Model for Ball Grid Array Solder Joint

T. E. Wong, F. W. Palmieri, L. A. Kachatorian

Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 113-119, November 5–10, 2000

Paper No: IMECE2000-2252

DOI: https://doi.org/10.1115/IMECE2000-2252

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Topics: Ball-Grid-Array packaging, Fatigue life, Solder joints, Vibration, Random vibration, Solders, Ball-Grid-Array packages, Ceramics, Computation, Computers

Proceedings Papers

Application of a Novel Flip Chip Solder Joint Inspection System to Chips on an FR-4 Substrate

Dathan S. Erdahl, Sheng Liu, I. Charles Ume

Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 189-195, November 5–10, 2000

Paper No: IMECE2000-2262

DOI: https://doi.org/10.1115/IMECE2000-2262

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Topics: Flip-chip devices, Inspection, Solder joints, Solders, Vibration, Ball-Grid-Array packaging, Lasers, Ultrasound, Displacement, Interferometers

Proceedings Papers

Thermomechanical Durability of High I/O BGA Packages

Pavan Davuluri, Abhijit Dasgupta, Steven Young

Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 121-127, November 5–10, 2000

Paper No: IMECE2000-2253

DOI: https://doi.org/10.1115/IMECE2000-2253

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Topics: Ball-Grid-Array packages, Durability, Thermomechanics, Ball-Grid-Array packaging, Solder joints, Failure, Solders, Cycles, Damage, Failure data

2 3 4 5

NARROW

Assessment of an Axisymmetric Analytical Model of a Square Areal Array Assembly

CBGA Solder Fillet Shape Prediction and Design Optimization

On the Equivalent Finite Element Beam Model for Ball Grid Array Analysis

Parametric Study of Thermal Performance of a Plastic Ball Grid Array, Single Package Technology for Automotive Applications

Opportunities and Needs for Interfacial Fracture Mechanics in Microelectronic Packaging Industry

Stress Analysis of High Density Bare Chip Packaging Technologies

Some Aspects of the Thermal Performance of a Tape Ball Grid Array (TBGA) Package

Parametric Analysis of Thermally Enhanced BGA Reliability Using a Finite-Volume-Weighted Averaging Technique

Automatic Warpage Measurement of Advanced Packages by Optical Method

On Enhancing Eutectic Solder Joint Reliability Using a 2 nd -Reflow-Process Approach

A Constriction Resistance Model in Thermal Analysis of Solder Ball Joints in Ball Grid Array Packages

A Study of the Aperture Filling Process in Solder Paste Stencil Printing

Impact of On-Die Discrete Heating on Thermal Performance Characteristics of Silicon Based IC Electronic Packages

Integrated Transient Thermal and Mechanical Analysis of Molded PBGA Packages During Thermal Shock

Thermal Issues That Arise due to Manufacturing Processes: Evaluation and Measurement Techniques

Prediction of Thermal Performance of Flip-Chip-Plastic Ball Grid Array (FC-PBGA) Packages: Effect of Die Size

CAE Simulation and Verification of Wire Sweep for BGA 436

Experimentally Validated Vibration Fatigue Life Prediction Model for Ball Grid Array Solder Joint

Application of a Novel Flip Chip Solder Joint Inspection System to Chips on an FR-4 Substrate

Thermomechanical Durability of High I/O BGA Packages

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