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Proceedings Papers

Vibratory States in and Radiation From a Framed Cylindrical Shell With Internal Complexity

Brian H. Houston, Douglas M. Photiadis, Joseph A. Bucaro, Harry J. Simpson

Proc. ASME. IMECE97, Noise Control and Acoustics, 25-35, November 16–21, 1997

Paper No: IMECE1997-1026

DOI: https://doi.org/10.1115/IMECE1997-1026

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Topics: Acoustics, Aerospace industry, Design, Electromagnetic scattering, Energy dissipation, Fluids, Marine vehicles, Mechanical admittance, Pipes, Radiation (Physics)

Proceedings Papers

Accelerated Reliability Testing Method for Sensors With a Pulsing Membrane Structure

Yifan Guo, Vijay Sarihan, Tom Lee

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 23-27, November 16–21, 1997

Paper No: IMECE1997-1223

DOI: https://doi.org/10.1115/IMECE1997-1223

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Topics: Accelerated life testing, Membranes, Sensors, Reliability, Testing, Failure, High temperature, Stress, Cycles, Deformation

Proceedings Papers

Advances in Stress Test Chips

Richard C. Jaeger, Jeffrey C. Suhling

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 1-5, November 16–21, 1997

Paper No: IMECE1997-1220

DOI: https://doi.org/10.1115/IMECE1997-1220

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Topics: Stress, Sensors, Silicon, Circuits, Electronic packages, Energy dissipation, Integrated circuits, Operating temperature, Reliability, Resistors

Proceedings Papers

Application of the Thermal Network Method to the Transient Thermal Analysis of Multichip Modules

Masaru Ishizuka, Hideo Iwasaki

Proc. ASME. IMECE97, CAE/CAD and Thermal Management Issues in Electronic Systems, 75-81, November 16–21, 1997

Paper No: IMECE1997-1216

DOI: https://doi.org/10.1115/IMECE1997-1216

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Topics: Multi-chip modules, Thermal analysis, Transients (Dynamics), Density, Design, Electronic circuits, Energy dissipation, Heat, Packaging, Reliability

Proceedings Papers

Parametric Study of Thermal Performance of a Plastic Ball Grid Array, Single Package Technology for Automotive Applications

K. Ramakrishna, J. R. Trent

Proc. ASME. IMECE97, CAE/CAD and Thermal Management Issues in Electronic Systems, 13-21, November 16–21, 1997

Paper No: IMECE1997-1210

DOI: https://doi.org/10.1115/IMECE1997-1210

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Topics: Automotive industry, Ball-Grid-Array packaging, Temperature, Junctions, Printed circuit boards, Computational fluid dynamics, Thermal conductivity, Heat transfer, Transients (Dynamics), Energy dissipation

Proceedings Papers

Experimental Study of Automotive Brake System Temperatures

A. F. Emery, P. Kumar, J. C. Firey

Proc. ASME. IMECE97, CAE/CAD and Thermal Management Issues in Electronic Systems, 55-64, November 16–21, 1997

Paper No: IMECE1997-1214

DOI: https://doi.org/10.1115/IMECE1997-1214

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Topics: Automotive brakes, Temperature, Brakes, Braking, Fluids, Boiling, Disks, Vehicles, Energy dissipation, Failure

Proceedings Papers

Thermo-Mechanical Analysis of Solder-Sealed Electronic Modules During Power Cycling

Raed A. Sherif, David L. Edwards, Michael J. Ellsworth, Jr.

Proc. ASME. IMECE97, CAE/CAD and Thermal Management Issues in Electronic Systems, 7-12, November 16–21, 1997

Paper No: IMECE1997-1209

DOI: https://doi.org/10.1115/IMECE1997-1209

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Topics: Solders, Thermomechanics, Ceramics, Cracking (Materials), Cycles, Design, Energy dissipation, Fatigue life, Finite element methods, Finite element model

Proceedings Papers

Wave-Generated Forces and Moments on Submersibles: Models for Dynamic Simulation at Periscope Depth

Narender K. Chhabra, James R. Scholten, Jeffrey B. Lozow

Proc. ASME. IMECE97, Ocean Engineering, 183-191, November 16–21, 1997

Paper No: IMECE1997-1257

DOI: https://doi.org/10.1115/IMECE1997-1257

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Topics: Periscopes, Simulation, Submersibles, Waves, Shapes, Water, Computer simulation, Energy dissipation, Fluid-dynamic forces, Fluids

Proceedings Papers

Symmetric Formulations for Modal Analysis of Internal Fluid Structure Systems

Roger Ohayon

Proc. ASME. IMECE97, 4th International Symposium on Fluid-Structure Interactions, Aeroelasticity, Flow-Induced Vibration and Noise: Volume I, 67-74, November 16–21, 1997

Paper No: IMECE1997-0044

DOI: https://doi.org/10.1115/IMECE1997-0044

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Topics: Fluids, Modal analysis, Displacement, Sloshing, Acoustics, Cavities, Computational methods, Linear vibration, Construction, Degrees of freedom

Proceedings Papers

Vibration Damping in Multispan Heat Exchanger Tubes

C. E. Taylor, M. J. Pettigrew, T. J. Dickinson, I. G. Currie, P. Vidalou

Proc. ASME. IMECE97, 4th International Symposium on Fluid-Structure Interactions, Aeroelasticity, Flow-Induced Vibration and Noise: Volume II, 201-208, November 16–21, 1997

Paper No: IMECE1997-0113

DOI: https://doi.org/10.1115/IMECE1997-0113

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Topics: Damping, Heat exchangers, Vibration, Temperature, Friction, Excitation, Flow-induced vibrations, Arches, Design, Energy dissipation

Proceedings Papers

Improved Estimation of Fluidelastic Instability Threshold for Tube Arrays in Two-Phase Flow: Approximate Theory Based on Energy Balance in a Separated Flow Model

Tomomichi Nakamura, Takaya Kusakabe, Hideo Nishikawa

Proc. ASME. IMECE97, 4th International Symposium on Fluid-Structure Interactions, Aeroelasticity, Flow-Induced Vibration and Noise: Volume II, 373-380, November 16–21, 1997

Paper No: IMECE1997-0132

DOI: https://doi.org/10.1115/IMECE1997-0132

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Topics: Energy budget (Physics), Flow (Dynamics), Two-phase flow, Design, Energy dissipation, Excitation, Fluid dynamics, Fluids, Stability, Vibration

Proceedings Papers

Thermocapillary Convection of Viscoinelastic Fluids in Layered Fluid Systems

Dennis A. Siginer, Thomas E. Jacks

Proc. ASME. IMECE97, Rheology and Fluid Mechanics of Nonlinear Materials, 229-242, November 16–21, 1997

Paper No: IMECE1997-0490

DOI: https://doi.org/10.1115/IMECE1997-0490

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Topics: Convection, Fluids, Prandtl number, Deformation, Dimensions, Energy dissipation, Flow (Dynamics), Gravity (Force), Shear rate, Temperature

Proceedings Papers

Finite Strain, Visco-Elastic Constitutive Models for Kinematically Constrained Materials

Todd A. Martin

Proc. ASME. IMECE97, Rheology and Fluid Mechanics of Nonlinear Materials, 133-142, November 16–21, 1997

Paper No: IMECE1997-0480

DOI: https://doi.org/10.1115/IMECE1997-0480

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Topics: Constitutive equations, Anisotropy, Energy dissipation, Equations of state, Fibers, Materials properties, Rheology, Tensors, Textiles, Viscoelasticity

Proceedings Papers

Comparison of Acoustic Microscope, X-Ray Radiography, Dye Penetrant and Destructive Physical Analysis Data for Die Attachment Analysis

Duane A. Gilmour, James F. Reilly, Donald W. Calabrese

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 175-181, November 16–21, 1997

Paper No: IMECE1997-0514

DOI: https://doi.org/10.1115/IMECE1997-0514

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Topics: Acoustics, Microscopes, X-rays, Microscopy, Silicon, Adhesion, Energy dissipation, Testing, Delamination, Density

Proceedings Papers

The Influence of Material Damping on Flexural Vibration of Thick Cylinders

Hamid R. Hamidzadeh, Dare Afolabi

Proc. ASME. IMECE97, Recent Advances in Solids/Structures and Application of Metallic Materials, 253-259, November 16–21, 1997

Paper No: IMECE1997-0541

DOI: https://doi.org/10.1115/IMECE1997-0541

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Topics: Cylinders, Damping, Vibration, Resonance, Stress, Circular cylinders, Computation, Elastic moduli, Elastodynamics, Energy dissipation

Proceedings Papers

Passive Control of Multi-Jointed Structures

Mohammed M. Ettouney, Raymond P. Daddazio, Najib N. Abboud

Proc. ASME. IMECE97, Active/Passive Vibration Control and Nonlinear Dynamics of Structures, 69-78, November 16–21, 1997

Paper No: IMECE1997-0561

DOI: https://doi.org/10.1115/IMECE1997-0561

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Topics: Passive control, Noise (Sound), Energy dissipation, Waves, Design, Engineers, Equilibrium (Physics), Fillers (Materials), Filters, Machinery

Proceedings Papers

Application of a 3D Numerical Model for Shell-and-Tube Heat Exchanger Simulation and Comparison With Other Methods

M. Prithiviraj, M. J. Andrews

Proc. ASME. IMECE97, Heat Transfer: Volume 3, 311-318, November 16–21, 1997

Paper No: IMECE1997-0923

DOI: https://doi.org/10.1115/IMECE1997-0923

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Topics: Computer simulation, Heat exchangers, Shells, Simulation, Heat transfer, Turbulence, Computation, Flow (Dynamics), Pressure drop, Algorithms

Proceedings Papers

Analysis and Evaluation of Malfunctions in Thermomechanical Systems

Javier Royo, Alejandro Zaleta, Antonio Valero

Proc. ASME. IMECE97, Advanced Energy Systems, 103-108, November 16–21, 1997

Paper No: IMECE1997-0979

DOI: https://doi.org/10.1115/IMECE1997-0979

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Topics: Cycles, Economic analysis, Energy dissipation, Gates (Closures), High pressure (Physics), Maintenance, Power stations, Simulation, Steam turbines, Temperature

Proceedings Papers

Energy Absorption and Dissipation Characteristics of Pultruded Glass-Graphite/Epoxy Hybrid Composite Beams

Murthy V. S. L. N. Kowsika, P. Raju Mantena, K. Balasubramaniam

Proc. ASME. IMECE97, Noise Control and Acoustics, 99-116, November 16–21, 1997

Paper No: IMECE1997-1035

DOI: https://doi.org/10.1115/IMECE1997-1035

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Topics: Absorption, Composite building materials, Energy dissipation, Epoxy adhesives, Epoxy resins, Glass, Graphite, Pultrusion, Delamination, Composite materials

Proceedings Papers

Guidelines for Preliminary Thermal Design of Convectively Cooled Printed Circuit Boards

Hyunjae Park, Nicholas Nigro, Abdel Elkouh, Neil Gollhardt, Ping Lee

Proc. ASME. IMECE97, Heat Transfer: Volume 1, 315-324, November 16–21, 1997

Paper No: IMECE1997-0857

DOI: https://doi.org/10.1115/IMECE1997-0857

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Topics: Design, Printed circuit boards, Air flow, Heat, Dimensions, Electronic components, Energy dissipation, Engineers, Temperature, Temperature distribution

2 3 4 5

NARROW

Vibratory States in and Radiation From a Framed Cylindrical Shell With Internal Complexity

Accelerated Reliability Testing Method for Sensors With a Pulsing Membrane Structure

Advances in Stress Test Chips

Application of the Thermal Network Method to the Transient Thermal Analysis of Multichip Modules

Parametric Study of Thermal Performance of a Plastic Ball Grid Array, Single Package Technology for Automotive Applications

Experimental Study of Automotive Brake System Temperatures

Thermo-Mechanical Analysis of Solder-Sealed Electronic Modules During Power Cycling

Wave-Generated Forces and Moments on Submersibles: Models for Dynamic Simulation at Periscope Depth

Symmetric Formulations for Modal Analysis of Internal Fluid Structure Systems

Vibration Damping in Multispan Heat Exchanger Tubes

Improved Estimation of Fluidelastic Instability Threshold for Tube Arrays in Two-Phase Flow: Approximate Theory Based on Energy Balance in a Separated Flow Model

Thermocapillary Convection of Viscoinelastic Fluids in Layered Fluid Systems

Finite Strain, Visco-Elastic Constitutive Models for Kinematically Constrained Materials

Comparison of Acoustic Microscope, X-Ray Radiography, Dye Penetrant and Destructive Physical Analysis Data for Die Attachment Analysis

The Influence of Material Damping on Flexural Vibration of Thick Cylinders

Passive Control of Multi-Jointed Structures

Application of a 3D Numerical Model for Shell-and-Tube Heat Exchanger Simulation and Comparison With Other Methods

Analysis and Evaluation of Malfunctions in Thermomechanical Systems

Energy Absorption and Dissipation Characteristics of Pultruded Glass-Graphite/Epoxy Hybrid Composite Beams

Guidelines for Preliminary Thermal Design of Convectively Cooled Printed Circuit Boards

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