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Proceedings Papers

Role of Unloading in Machining of Brittle Materials

A. Chandra, K. Wang, Y. Huang, G. Subhash
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 2, 83-90, November 16–21, 1997
Paper No: IMECE1997-1139
DOI: https://doi.org/10.1115/IMECE1997-1139
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Topics: Borosilicate glasses, Brittleness, Ceramics, Damage, Design, Fracture (Materials), Fracture (Process), Glass, Grinding, Machining
Proceedings Papers

Chip Formation When Hard Turning Steel

Amitabh Vyas, Milton C. Shaw
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 2, 21-28, November 16–21, 1997
Paper No: IMECE1997-1131
DOI: https://doi.org/10.1115/IMECE1997-1131
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Topics: Steel, Turning, Machining, Grinding, Boron, Ceramics, Finishes, Fracture (Materials), Fracture (Process), Hard materials
Proceedings Papers

Development of a Magnetostrictive Torque Sensor for Milling Process Monitoring

Hiro Ohzeki, Akihiro Mashine, Hideki Aoyama, Ichiro Inasaki
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 129-136, November 16–21, 1997
Paper No: IMECE1997-1085
DOI: https://doi.org/10.1115/IMECE1997-1085
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Topics: Milling, Process monitoring, Sensors, Torque, Cutting, Alloys, Failure, Fracture (Materials), Fracture (Process), Permeability
Proceedings Papers

Microstructural Effects on the Machining Performance of Dental Ceramics

D. T. Le, Lixun Qi, Guangming Zhang, Stanley J. Ng
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 245-251, November 16–21, 1997
Paper No: IMECE1997-1098
DOI: https://doi.org/10.1115/IMECE1997-1098
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Topics: Ceramics, Machining, Bending strength, Chemical properties, Cutting, Force measurement, Fracture (Materials), Fracture (Process), Fracture toughness, Microscale devices
Proceedings Papers

In Process Stress Analysis of Flip Chip Assemblies During Underfill Cure

Prema Palaniappan, Daniel F. Baldwin
Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 7-14, November 16–21, 1997
Paper No: IMECE1997-1221
DOI: https://doi.org/10.1115/IMECE1997-1221
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Topics: Density, Electronics, Flip-chip, Flip-chip assemblies, Flip-chip devices, Fracture (Materials), Fracture (Process), Glass transition, Manufacturing, Printed circuit boards
Proceedings Papers

Calibrated Fracture Process Zone Models for Polyimide/Metal Blisters

A. Shirani, K. M. Liechti, F. J. Boerio
Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 131-133, November 16–21, 1997
Paper No: IMECE1997-1238
DOI: https://doi.org/10.1115/IMECE1997-1238
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Topics: Fracture (Materials), Fracture (Process), Metals, Adhesives, Aluminum, Modeling
Proceedings Papers

Thermo-Mechanical Analysis of Solder-Sealed Electronic Modules During Power Cycling

Raed A. Sherif, David L. Edwards, Michael J. Ellsworth, Jr.
Proc. ASME. IMECE97, CAE/CAD and Thermal Management Issues in Electronic Systems, 7-12, November 16–21, 1997
Paper No: IMECE1997-1209
DOI: https://doi.org/10.1115/IMECE1997-1209
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Topics: Solders, Thermomechanics, Ceramics, Cracking (Materials), Cycles, Design, Energy dissipation, Fatigue life, Finite element methods, Finite element model
Proceedings Papers

Thin Film Resistance Heaters for High Heat Flux Jet-Array Cooling Experiments

Hesham F. Younis, Rudy S. Dahbura, John H. Lienhard, V
Proc. ASME. IMECE97, Heat Transfer: Volume 3, 127-134, November 16–21, 1997
Paper No: IMECE1997-0901
DOI: https://doi.org/10.1115/IMECE1997-0901
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Topics: Cooling, Heat flux, Thin films, Flux (Metallurgy), Heat, Ceramics, Metals, Plasmas (Ionized gases), Bulk solids, Design
Proceedings Papers

Strength and Fracture of Micromachined Silicon Structures

Wan Suwito, Martin L. Dunn, Shawn J. Cunningham
Proc. ASME. IMECE97, Microelectromechanical Systems (MEMS), 99-104, November 16–21, 1997
Paper No: IMECE1997-0946
DOI: https://doi.org/10.1115/IMECE1997-0946
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Topics: Fracture (Materials), Fracture (Process), Micromachining, Silicon, Corners (Structural elements), Design, Anisotropy, Chemical etching, Crystals, Manufacturing
Proceedings Papers

A Biomechanical Comparison Between Modern Anterior Versus Posterior Plate Fixation of Unstable Cervical Spine Injuries

Tae-Hong Lim, Howard S. An, Young Do Koh, Linda M. McGrady
Proc. ASME. IMECE97, Advances in Bioengineering, 217-218, November 16–21, 1997
Paper No: IMECE1997-0306
DOI: https://doi.org/10.1115/IMECE1997-0306
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Topics: Biomechanics, Cervical spine, Wounds, Plating, Fracture (Materials), Fracture (Process), Screws, Stability, Stiffness, Surgery
Proceedings Papers

Effect of Thermal Residual Stress on the Measurement of the Adhesion Between Polyimide and Underfill Using an Asymmetric Double Cantilever Beam Specimen

Jinbao Jiao, Charan K. Gurumurthy, Edward J. Kramer, Yan Sha, Chung-Yuen Hui, Peter Børgesen
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 97-102, November 16–21, 1997
Paper No: IMECE1997-0504
DOI: https://doi.org/10.1115/IMECE1997-0504
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Topics: Adhesion, Cantilever beams, Stress, Epoxy adhesives, Epoxy resins, Fracture (Materials), Fracture (Process), Ethers (Class of compounds), Thermal expansion
Proceedings Papers

The Effect of Temperature and Humidity Exposure on Adhesion

R. A. Pearson, R. M. Hydro, T. B. Lloyd, H. F. Nied
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 1-6, November 16–21, 1997
Paper No: IMECE1997-0493
DOI: https://doi.org/10.1115/IMECE1997-0493
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Topics: Adhesion, Temperature, Adhesives, Silver, Copper, Epoxy adhesives, Epoxy resins, Fracture (Materials), Fracture (Process), Cantilever beams
Proceedings Papers

Direct Measurement of the Adhesive Fracture Resistance of CVD Diamond Particles

Shoji Kamiya, Hironori Takahashi, Masumi Saka, Hiroyuki Abé
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 169-174, November 16–21, 1997
Paper No: IMECE1997-0513
DOI: https://doi.org/10.1115/IMECE1997-0513
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Topics: Adhesives, Fracture (Materials), Fracture (Process), Particulate matter, Synthetic diamonds, Chemical vapor deposition, Diamond films, Nucleation (Physics), Stress, Electronics
Proceedings Papers

Reliability of Underfill-Encapsulated Flip-Chip Packages

Hiroaki Doi, Kenya Kawano, Akio Yasukawa, Toshihiko Sato
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 7-14, November 16–21, 1997
Paper No: IMECE1997-0494
DOI: https://doi.org/10.1115/IMECE1997-0494
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Topics: Flip-chip packages, Reliability, Flat heat pipes, Solder joints, Delamination, Mechanical properties, Shapes, Stress, Stress analysis (Engineering), Finite element methods
Proceedings Papers

Fracture and Damage Evaluation in Chip Scale Packages and Flip-Chip-Assemblies by FEA and MicroDAC

Jürgen Auersperg, Andreas Schubert, Dietmar Vogel, Bernd Michel, Herbert Reichl
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 133-138, November 16–21, 1997
Paper No: IMECE1997-0508
DOI: https://doi.org/10.1115/IMECE1997-0508
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Topics: Damage, Finite element analysis, Flip-chip assemblies, Fracture (Materials), Fracture (Process), Solders, Reliability, Simulation, Thermomechanics, Delamination
Proceedings Papers

Adhesion and Reliability of Polymer/Inorganic Interfaces in Microelectronic Applications

J. M. Snodgrass, S.-Y. Kook, A. Kirtikar, R. H. Dauskardt
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 33-39, November 16–21, 1997
Paper No: IMECE1997-0497
DOI: https://doi.org/10.1115/IMECE1997-0497
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Topics: Adhesion, Polymers, Reliability, Fracture (Materials), Fracture (Process), Fatigue, Fracture toughness, Cycles, Deformation, Fracture mechanics
Proceedings Papers

Free-Edge Stress Intensity Factors for Edge-Loaded Bimaterial Layers

Nathan W. Klingbeil, Jack L. Beuth
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 153-162, November 16–21, 1997
Paper No: IMECE1997-0511
DOI: https://doi.org/10.1115/IMECE1997-0511
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Topics: Stress, Design, Stress singularity, Finite element analysis, Fracture (Materials), Fracture (Process), Pressure, Strips
Proceedings Papers

Potential Failure Sites in a Flip-Chip Package With and Without Underfill

E. Madenci, S. Shkarayev, R. Mahajan
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 61-71, November 16–21, 1997
Paper No: IMECE1997-0501
DOI: https://doi.org/10.1115/IMECE1997-0501
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Topics: Failure, Flip-chip packages, Stress, Design, Electronic packages, Thermomechanics, Adhesive joints, Cracking (Materials), Fillers (Materials), Finite element analysis
Proceedings Papers

Strength and Stability Analyses of Retaining Structure Models for the Fracturing Fluid Characterization Facility

Alfred G. Striz, Keyur Thakore
Proc. ASME. IMECE97, Recent Advances in Solids/Structures and Application of Metallic Materials, 109-117, November 16–21, 1997
Paper No: IMECE1997-0528
DOI: https://doi.org/10.1115/IMECE1997-0528
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Topics: Fluids, Fracture (Process), Stability, Buckling, Pressure, Finite element methods, Plates (structures), Boundary-value problems, Design, Engineering standards
Proceedings Papers

Nondestructive Evaluation of Fiberglass Reinforced Plastic Subjected to Localized Heat Damage, Using Acoustic Emission

H. Nayeb-Hashemi, P. Kisnomo, N. Saniei
Proc. ASME. IMECE97, Recent Advances in Solids/Structures and Application of Metallic Materials, 119-131, November 16–21, 1997
Paper No: IMECE1997-0529
DOI: https://doi.org/10.1115/IMECE1997-0529
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Topics: Acoustic emissions, Damage, Glass reinforced plastics, Heat, Nondestructive evaluation, Lasers, Fibers, Composite materials, Failure, Fracture (Materials)