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Proceedings Papers

Role of Unloading in Machining of Brittle Materials

A. Chandra, K. Wang, Y. Huang, G. Subhash

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 2, 83-90, November 16–21, 1997

Paper No: IMECE1997-1139

DOI: https://doi.org/10.1115/IMECE1997-1139

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Topics: Borosilicate glasses, Brittleness, Ceramics, Damage, Design, Fracture (Materials), Fracture (Process), Glass, Grinding, Machining

Proceedings Papers

Chip Formation When Hard Turning Steel

Amitabh Vyas, Milton C. Shaw

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 2, 21-28, November 16–21, 1997

Paper No: IMECE1997-1131

DOI: https://doi.org/10.1115/IMECE1997-1131

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Topics: Steel, Turning, Machining, Grinding, Boron, Ceramics, Finishes, Fracture (Materials), Fracture (Process), Hard materials

Proceedings Papers

Development of a Magnetostrictive Torque Sensor for Milling Process Monitoring

Hiro Ohzeki, Akihiro Mashine, Hideki Aoyama, Ichiro Inasaki

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 129-136, November 16–21, 1997

Paper No: IMECE1997-1085

DOI: https://doi.org/10.1115/IMECE1997-1085

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Topics: Milling, Process monitoring, Sensors, Torque, Cutting, Alloys, Failure, Fracture (Materials), Fracture (Process), Permeability

Proceedings Papers

Microstructural Effects on the Machining Performance of Dental Ceramics

D. T. Le, Lixun Qi, Guangming Zhang, Stanley J. Ng

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 245-251, November 16–21, 1997

Paper No: IMECE1997-1098

DOI: https://doi.org/10.1115/IMECE1997-1098

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Topics: Ceramics, Machining, Bending strength, Chemical properties, Cutting, Force measurement, Fracture (Materials), Fracture (Process), Fracture toughness, Microscale devices

Proceedings Papers

In Process Stress Analysis of Flip Chip Assemblies During Underfill Cure

Prema Palaniappan, Daniel F. Baldwin

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 7-14, November 16–21, 1997

Paper No: IMECE1997-1221

DOI: https://doi.org/10.1115/IMECE1997-1221

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Topics: Density, Electronics, Flip-chip, Flip-chip assemblies, Flip-chip devices, Fracture (Materials), Fracture (Process), Glass transition, Manufacturing, Printed circuit boards

Proceedings Papers

Calibrated Fracture Process Zone Models for Polyimide/Metal Blisters

A. Shirani, K. M. Liechti, F. J. Boerio

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 131-133, November 16–21, 1997

Paper No: IMECE1997-1238

DOI: https://doi.org/10.1115/IMECE1997-1238

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Topics: Fracture (Materials), Fracture (Process), Metals, Adhesives, Aluminum, Modeling

Proceedings Papers

Thermo-Mechanical Analysis of Solder-Sealed Electronic Modules During Power Cycling

Raed A. Sherif, David L. Edwards, Michael J. Ellsworth, Jr.

Proc. ASME. IMECE97, CAE/CAD and Thermal Management Issues in Electronic Systems, 7-12, November 16–21, 1997

Paper No: IMECE1997-1209

DOI: https://doi.org/10.1115/IMECE1997-1209

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Topics: Solders, Thermomechanics, Ceramics, Cracking (Materials), Cycles, Design, Energy dissipation, Fatigue life, Finite element methods, Finite element model

Proceedings Papers

A Biomechanical Comparison Between Modern Anterior Versus Posterior Plate Fixation of Unstable Cervical Spine Injuries

Tae-Hong Lim, Howard S. An, Young Do Koh, Linda M. McGrady

Proc. ASME. IMECE97, Advances in Bioengineering, 217-218, November 16–21, 1997

Paper No: IMECE1997-0306

DOI: https://doi.org/10.1115/IMECE1997-0306

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Topics: Biomechanics, Cervical spine, Wounds, Plating, Fracture (Materials), Fracture (Process), Screws, Stability, Stiffness, Surgery

Proceedings Papers

Effect of Thermal Residual Stress on the Measurement of the Adhesion Between Polyimide and Underfill Using an Asymmetric Double Cantilever Beam Specimen

Jinbao Jiao, Charan K. Gurumurthy, Edward J. Kramer, Yan Sha, Chung-Yuen Hui, Peter Børgesen

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 97-102, November 16–21, 1997

Paper No: IMECE1997-0504

DOI: https://doi.org/10.1115/IMECE1997-0504

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Topics: Adhesion, Cantilever beams, Stress, Epoxy adhesives, Epoxy resins, Fracture (Materials), Fracture (Process), Ethers (Class of compounds), Thermal expansion

Proceedings Papers

The Effect of Temperature and Humidity Exposure on Adhesion

R. A. Pearson, R. M. Hydro, T. B. Lloyd, H. F. Nied

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 1-6, November 16–21, 1997

Paper No: IMECE1997-0493

DOI: https://doi.org/10.1115/IMECE1997-0493

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Topics: Adhesion, Temperature, Adhesives, Silver, Copper, Epoxy adhesives, Epoxy resins, Fracture (Materials), Fracture (Process), Cantilever beams

Proceedings Papers

Direct Measurement of the Adhesive Fracture Resistance of CVD Diamond Particles

Shoji Kamiya, Hironori Takahashi, Masumi Saka, Hiroyuki Abé

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 169-174, November 16–21, 1997

Paper No: IMECE1997-0513

DOI: https://doi.org/10.1115/IMECE1997-0513

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Topics: Adhesives, Fracture (Materials), Fracture (Process), Particulate matter, Synthetic diamonds, Chemical vapor deposition, Diamond films, Nucleation (Physics), Stress, Electronics

Proceedings Papers

Reliability of Underfill-Encapsulated Flip-Chip Packages

Hiroaki Doi, Kenya Kawano, Akio Yasukawa, Toshihiko Sato

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 7-14, November 16–21, 1997

Paper No: IMECE1997-0494

DOI: https://doi.org/10.1115/IMECE1997-0494

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Topics: Flip-chip packages, Reliability, Flat heat pipes, Solder joints, Delamination, Mechanical properties, Shapes, Stress, Stress analysis (Engineering), Finite element methods

Proceedings Papers

Fracture and Damage Evaluation in Chip Scale Packages and Flip-Chip-Assemblies by FEA and MicroDAC

Jürgen Auersperg, Andreas Schubert, Dietmar Vogel, Bernd Michel, Herbert Reichl

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 133-138, November 16–21, 1997

Paper No: IMECE1997-0508

DOI: https://doi.org/10.1115/IMECE1997-0508

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Topics: Damage, Finite element analysis, Flip-chip assemblies, Fracture (Materials), Fracture (Process), Solders, Reliability, Simulation, Thermomechanics, Delamination

Proceedings Papers

Adhesion and Reliability of Polymer/Inorganic Interfaces in Microelectronic Applications

J. M. Snodgrass, S.-Y. Kook, A. Kirtikar, R. H. Dauskardt

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 33-39, November 16–21, 1997

Paper No: IMECE1997-0497

DOI: https://doi.org/10.1115/IMECE1997-0497

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Topics: Adhesion, Polymers, Reliability, Fracture (Materials), Fracture (Process), Fatigue, Fracture toughness, Cycles, Deformation, Fracture mechanics

Proceedings Papers

Free-Edge Stress Intensity Factors for Edge-Loaded Bimaterial Layers

Nathan W. Klingbeil, Jack L. Beuth

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 153-162, November 16–21, 1997

Paper No: IMECE1997-0511

DOI: https://doi.org/10.1115/IMECE1997-0511

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Topics: Stress, Design, Stress singularity, Finite element analysis, Fracture (Materials), Fracture (Process), Pressure, Strips

Proceedings Papers

Potential Failure Sites in a Flip-Chip Package With and Without Underfill

E. Madenci, S. Shkarayev, R. Mahajan

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 61-71, November 16–21, 1997

Paper No: IMECE1997-0501

DOI: https://doi.org/10.1115/IMECE1997-0501

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Topics: Failure, Flip-chip packages, Stress, Design, Electronic packages, Thermomechanics, Adhesive joints, Cracking (Materials), Fillers (Materials), Finite element analysis

Proceedings Papers

Strength and Stability Analyses of Retaining Structure Models for the Fracturing Fluid Characterization Facility

Alfred G. Striz, Keyur Thakore

Proc. ASME. IMECE97, Recent Advances in Solids/Structures and Application of Metallic Materials, 109-117, November 16–21, 1997

Paper No: IMECE1997-0528

DOI: https://doi.org/10.1115/IMECE1997-0528

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Topics: Fluids, Fracture (Process), Stability, Buckling, Pressure, Finite element methods, Plates (structures), Boundary-value problems, Design, Engineering standards

Proceedings Papers

Nondestructive Evaluation of Fiberglass Reinforced Plastic Subjected to Localized Heat Damage, Using Acoustic Emission

H. Nayeb-Hashemi, P. Kisnomo, N. Saniei

Proc. ASME. IMECE97, Recent Advances in Solids/Structures and Application of Metallic Materials, 119-131, November 16–21, 1997

Paper No: IMECE1997-0529

DOI: https://doi.org/10.1115/IMECE1997-0529

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Topics: Acoustic emissions, Damage, Glass reinforced plastics, Heat, Nondestructive evaluation, Lasers, Fibers, Composite materials, Failure, Fracture (Materials)

Proceedings Papers

Scientific Implications in High Peak Power Nd:YAG Laser Material Removal of Al-30%SiC Composite

K. Nagarathnam, X. Chen, J. Mazumder

Proc. ASME. IMECE97, Recent Advances in Solids/Structures and Application of Metallic Materials, 389-398, November 16–21, 1997

Paper No: IMECE1997-0553

DOI: https://doi.org/10.1115/IMECE1997-0553

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Topics: Composite materials, Nd-YAG lasers, Lasers, Drilling, Manufacturing, Q-switching, Wavelength, Aeronautics, Cracking (Materials), Cross section (Physics)

Proceedings Papers

Sustained-Load Cracking in Mill Annealed Ti-6Al-4V at Room Temperature

Youri Lenets, James P. Thomas, Theodore Nicholas

Proc. ASME. IMECE97, Recent Advances in Solids/Structures and Application of Metallic Materials, 315-321, November 16–21, 1997

Paper No: IMECE1997-0547

DOI: https://doi.org/10.1115/IMECE1997-0547

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Topics: Cracking (Materials), Fracture (Process), Stress, Temperature, Fracture (Materials), Diffusion processes, Fatigue, Forging, Fracture mechanics, Hydrogen

2 3 4 5

NARROW

Role of Unloading in Machining of Brittle Materials

Chip Formation When Hard Turning Steel

Development of a Magnetostrictive Torque Sensor for Milling Process Monitoring

Microstructural Effects on the Machining Performance of Dental Ceramics

In Process Stress Analysis of Flip Chip Assemblies During Underfill Cure

Calibrated Fracture Process Zone Models for Polyimide/Metal Blisters

Thermo-Mechanical Analysis of Solder-Sealed Electronic Modules During Power Cycling

A Biomechanical Comparison Between Modern Anterior Versus Posterior Plate Fixation of Unstable Cervical Spine Injuries

Effect of Thermal Residual Stress on the Measurement of the Adhesion Between Polyimide and Underfill Using an Asymmetric Double Cantilever Beam Specimen

The Effect of Temperature and Humidity Exposure on Adhesion

Direct Measurement of the Adhesive Fracture Resistance of CVD Diamond Particles

Reliability of Underfill-Encapsulated Flip-Chip Packages

Fracture and Damage Evaluation in Chip Scale Packages and Flip-Chip-Assemblies by FEA and MicroDAC

Adhesion and Reliability of Polymer/Inorganic Interfaces in Microelectronic Applications

Free-Edge Stress Intensity Factors for Edge-Loaded Bimaterial Layers

Potential Failure Sites in a Flip-Chip Package With and Without Underfill

Strength and Stability Analyses of Retaining Structure Models for the Fracturing Fluid Characterization Facility

Nondestructive Evaluation of Fiberglass Reinforced Plastic Subjected to Localized Heat Damage, Using Acoustic Emission

Scientific Implications in High Peak Power Nd:YAG Laser Material Removal of Al-30%SiC Composite

Sustained-Load Cracking in Mill Annealed Ti-6Al-4V at Room Temperature

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