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Proceedings Papers

A Study of the Electronic Flame off Discharge Process Used for Ball Bonding in Microelectronic Packaging

Srinivas S. Sripada, I. M. Cohen, P. S. Ayyaswamy
Proc. ASME. IMECE96, Transport Phenomena in Materials Processing and Manufacturing, 129-136, November 17–22, 1996
Paper No: IMECE1996-1038
https://doi.org/10.1115/IMECE1996-1038
View Paper titled, A Study of the Electronic Flame off Discharge Process Used for Ball Bonding in Microelectronic Packaging
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Topics: Bonding, Flames, Microelectronic packaging, Wire, Heat transfer, Temperature, Transients (Dynamics), Copper, Electric discharge, Grain boundaries
Proceedings Papers

Molecular Dynamics Analysis on the Degradation Mechanism of the Crystallinity and Strength of Grain Boundaries in Heat-Resistant Alloys Under Creep-Fatigue Loading at Elevated Temperature

Shogo Tezuka, Ken Suzuki
Proc. ASME. IMECE2022, Volume 9: Mechanics of Solids, Structures, and Fluids; Micro- and Nano-Systems Engineering and Packaging; Safety Engineering, Risk, and Reliability Analysis; Research Posters, V009T12A036, October 30–November 3, 2022
Paper No: IMECE2022-94286
https://doi.org/10.1115/IMECE2022-94286
View Paper titled, Molecular Dynamics Analysis on the Degradation Mechanism of the Crystallinity and Strength of Grain Boundaries in Heat-Resistant Alloys Under Creep-Fatigue Loading at Elevated Temperature
Open the PDF for Molecular Dynamics Analysis on the Degradation Mechanism of the Crystallinity and Strength of Grain Boundaries in Heat-Resistant Alloys Under Creep-Fatigue Loading at Elevated Temperature in another window
Topics: Alloys, Creep, Diffusion (Physics), Fatigue, Grain boundaries, Heat, Molecular dynamics, Stress, Temperature
Proceedings Papers

Acceleration of Intergranular Cracking in Ni-Base Alloy GH4169 (IN718) Due to the Growth of δ-Phase Around Grain Boundaries Under Creep Loading at Elevated Temperatures

Ayumi Nakayama, Runzi Wang, Hideo Miura
Proc. ASME. IMECE2022, Volume 9: Mechanics of Solids, Structures, and Fluids; Micro- and Nano-Systems Engineering and Packaging; Safety Engineering, Risk, and Reliability Analysis; Research Posters, V009T12A047, October 30–November 3, 2022
Paper No: IMECE2022-94701
https://doi.org/10.1115/IMECE2022-94701
View Paper titled, Acceleration of Intergranular Cracking in Ni-Base Alloy GH4169 (IN718) Due to the Growth of δ-Phase Around Grain Boundaries Under Creep Loading at Elevated Temperatures
Open the PDF for Acceleration of Intergranular Cracking in Ni-Base Alloy GH4169 (IN718) Due to the Growth of δ-Phase Around Grain Boundaries Under Creep Loading at Elevated Temperatures in another window
Topics: Alloys, Cracking (Materials), Creep, Electron backscatter diffraction, Fracture (Process), Grain boundaries, Temperature
Proceedings Papers

Prediction of the Generation of Intergranular Cracking in Stainless Steels Under Creep Loading at Elevated Temperatures

Ken Suzuki, Koki Nakayama, Ayumi Nakayama, Shogo Tezuka, Hideo Miura
Proc. ASME. IMECE2022, Volume 9: Mechanics of Solids, Structures, and Fluids; Micro- and Nano-Systems Engineering and Packaging; Safety Engineering, Risk, and Reliability Analysis; Research Posters, V009T12A038, October 30–November 3, 2022
Paper No: IMECE2022-94891
https://doi.org/10.1115/IMECE2022-94891
View Paper titled, Prediction of the Generation of Intergranular Cracking in Stainless Steels Under Creep Loading at Elevated Temperatures
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Topics: Cracking (Materials), Creep, Electron backscatter diffraction, Fracture (Process), Grain boundaries, Stainless steel, Stress, Temperature, Damage, Dislocations
Proceedings Papers

Material Constitutive Modeling Under High Strain Rates and Temperatures Through Orthogonal Machining Tests

Shuting Lei, Yung C. Shin, Frank P. Incropera
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 2, 91-98, November 16–21, 1997
Paper No: IMECE1997-1140
https://doi.org/10.1115/IMECE1997-1140
View Paper titled, Material Constitutive Modeling Under High Strain Rates and Temperatures Through Orthogonal Machining Tests
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Topics: Machining, Modeling, Temperature, Shear (Mechanics), Carbon steel, Constitutive equations, Deformation, Grain boundaries, Imaging, Optical microscopy
Proceedings Papers

Mechanisms Governing Cyclic Deformation and Damage During Elevated Temperature Fatigue of High Strength Aluminum Alloy 7055

T. S. Srivatsan, S. Anand
Proc. ASME. IMECE98, Mechanical Behavior of Advanced Materials, 33-50, November 15–20, 1998
Paper No: IMECE1998-1139
https://doi.org/10.1115/IMECE1998-1139
View Paper titled, Mechanisms Governing Cyclic Deformation and Damage During Elevated Temperature Fatigue of High Strength Aluminum Alloy 7055
Open the PDF for Mechanisms Governing Cyclic Deformation and Damage During Elevated Temperature Fatigue of High Strength Aluminum Alloy 7055 in another window
Topics: Aluminum alloys, Damage, Deformation, Fatigue, Temperature, Stress, Alloys, Compression, Crack propagation, Dislocations
Proceedings Papers

A Comparison of the Fatigue Crack Growth Behavior of Single Crystal and Polycrystalline Inconel 718

C. Mercer, W. O. Soboyejo, A. B. O. Soboyejo
Proc. ASME. IMECE98, Mechanical Behavior of Advanced Materials, 79-105, November 15–20, 1998
Paper No: IMECE1998-1142
https://doi.org/10.1115/IMECE1998-1142
View Paper titled, A Comparison of the Fatigue Crack Growth Behavior of Single Crystal and Polycrystalline Inconel 718
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Topics: Crystals, Fatigue cracks, Fracture (Materials), Alloys, Fatigue, Stress, Fractography, Grain boundaries, Scanning electron microscopy
Proceedings Papers

Crystallinity-Induced Acceleration of Intergranular Cracking in Thin-Film Interconnections Under High Current Density

Shota Akasaki, Hideo Miura
Proc. ASME. IMECE2021, Volume 12: Mechanics of Solids, Structures, and Fluids; Micro- and Nano- Systems Engineering and Packaging, V012T13A002, November 1–5, 2021
Paper No: IMECE2021-70222
https://doi.org/10.1115/IMECE2021-70222
View Paper titled, Crystallinity-Induced Acceleration of Intergranular Cracking in Thin-Film Interconnections Under High Current Density
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Topics: Cracking (Materials), Current density, Fracture (Process), Thin films, Grain boundaries, Electron backscatter diffraction, Bulk solids, Diffusion (Physics), Electrodiffusion, Grain boundary diffusion
Proceedings Papers

Molecular Dynamics Analysis of the Acceleration of the Degradation of the Strength of a Grain Boundary Under Creep-Fatigue Loads

Shujiroh Suzuki, Shogo Tezuka, Ken Suzuki, Hideo Miura
Proc. ASME. IMECE2021, Volume 12: Mechanics of Solids, Structures, and Fluids; Micro- and Nano- Systems Engineering and Packaging, V012T12A053, November 1–5, 2021
Paper No: IMECE2021-70628
https://doi.org/10.1115/IMECE2021-70628
View Paper titled, Molecular Dynamics Analysis of the Acceleration of the Degradation of the Strength of a Grain Boundary Under Creep-Fatigue Loads
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Topics: Creep, Damage, Fatigue, Grain boundaries, Molecular dynamics, Stress, Superalloys
Proceedings Papers

Creep-Fatigue Damage of Heat-Resistant Alloys Caused by the Local Lattice Mismatch-Induced Acceleration of the Generation and Accumulation of Dislocations and Vacancies

Yifan Luo, Shogo Tezuka, Koki Nakayama, Ayumi Nakayama, Ken Suzuki, Hideo Miura
Proc. ASME. IMECE2021, Volume 12: Mechanics of Solids, Structures, and Fluids; Micro- and Nano- Systems Engineering and Packaging, V012T12A051, November 1–5, 2021
Paper No: IMECE2021-68489
https://doi.org/10.1115/IMECE2021-68489
View Paper titled, Creep-Fatigue Damage of Heat-Resistant Alloys Caused by the Local Lattice Mismatch-Induced Acceleration of the Generation and Accumulation of Dislocations and Vacancies
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Topics: Alloys, Creep, Damage, Dislocations, Electron backscatter diffraction, Fatigue, Grain boundaries, Heat, Stress, Diffusion (Physics)
Proceedings Papers

Transient, Three-Dimensional Heat Transfer Model for Partially Stabilized Zirconia Undergoing Laser-Assisted Machining

Frank E. Pfefferkorn, Frank P. Incropera, Yung C. Shin
Proc. ASME. IMECE99, Heat Transfer: Volume 3, 197-209, November 14–19, 1999
Paper No: IMECE1999-1078
https://doi.org/10.1115/IMECE1999-1078
View Paper titled, Transient, Three-Dimensional Heat Transfer Model for Partially Stabilized Zirconia Undergoing Laser-Assisted Machining
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Topics: Heat transfer, Lasers, Machining, Transients (Dynamics), Temperature, Radiation (Physics), Approximation, Ceramics, Electromagnetic scattering, Radiation scattering
Proceedings Papers

Photon Counting Temperature Measurements During Pulsed Laser Heating of Al 2 O 3 -TiC Ceramics

Todd M. Harms, Xianfan Xu
Proc. ASME. IMECE99, Heat Transfer: Volume 3, 181-187, November 14–19, 1999
Paper No: IMECE1999-1076
https://doi.org/10.1115/IMECE1999-1076
View Paper titled, Photon Counting Temperature Measurements During Pulsed Laser Heating of Al 2 O 3 -TiC Ceramics
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Topics: Ceramics, Heating, Lasers, Photons, Temperature measurement, Temperature, Chemical reactions, Computer simulation, Emission spectra, Excitation
Proceedings Papers

Metal-Induced Laterally Crystallized Polycrystalline Silicon for Micro-Systems: Mechanical and Etching Characteristics

Mingxiang Wang, Wan Lap Yeung, Yitshak Zohar, Man Wong
Proc. ASME. IMECE2001, Micro-Electro-Mechanical Systems (MEMS), 345-349, November 11–16, 2001
Paper No: IMECE2001/MEMS-23850
https://doi.org/10.1115/IMECE2001/MEMS-23850
View Paper titled, Metal-Induced Laterally Crystallized Polycrystalline Silicon for Micro-Systems: Mechanical and Etching Characteristics
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Topics: Etching, Metals, Microelectromechanical systems, Polysilicon, Electrical properties, Grain boundaries, Pressure, Vapors
Proceedings Papers

Mechanical Properties of Novel Nanocrystalline Materials

J. Narayan, H. Wang, A. Kvit
Proc. ASME. IMECE2001, Effects of Processing on Properties of Advanced Ceramics, 55-63, November 11–16, 2001
Paper No: IMECE2001/MD-24806
https://doi.org/10.1115/IMECE2001/MD-24806
View Paper titled, Mechanical Properties of Novel Nanocrystalline Materials
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Topics: Mechanical properties, Nanocrystals, Grain size, Grain boundaries, Adhesion, Deformation, Shear (Mechanics), Thin films, Weak force, Wear
Proceedings Papers

Micro-Mechanics of Creep-Fatigue Damage in Pb-Sn Solder Due to Thermal Cycling

Pradeep Sharma, Abhijit Dasgupta
Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 173-179, November 5–10, 2000
Paper No: IMECE2000-2260
https://doi.org/10.1115/IMECE2000-2260
View Paper titled, Micro-Mechanics of Creep-Fatigue Damage in Pb-Sn Solder Due to Thermal Cycling
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Topics: Creep, Damage, Fatigue, Micromechanics (Engineering), Solders, Tin, Stress, Aeroelasticity, Damage mechanics, Fatigue damage
Proceedings Papers

Superplasticity and Microstructural Evolution of a Large-Grained Mg Alloy

Yi Liu, Kelly Shue, Xin Wu, Zhicheng Li, Yongbo Xu
Proc. ASME. IMECE2000, Manufacturing Engineering, 275-280, November 5–10, 2000
Paper No: IMECE2000-1818
https://doi.org/10.1115/IMECE2000-1818
View Paper titled, Superplasticity and Microstructural Evolution of a Large-Grained Mg Alloy
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Topics: Magnesium alloys, Superplasticity, Deformation, Dislocations, Grain boundaries, Temperature, Electron backscatter diffraction, Elongation, Grain size, Recrystallization
Proceedings Papers

Crystallinity Dependence of Grain and Grain Boundary Strength of a Bicrystal Structure of Copper

Ken Suzuki, Yiqing Fan, Yifan Luo
Proc. ASME. IMECE2020, Volume 13: Micro- and Nano-Systems Engineering and Packaging, V013T13A004, November 16–19, 2020
Paper No: IMECE2020-23757
https://doi.org/10.1115/IMECE2020-23757
View Paper titled, Crystallinity Dependence of Grain and Grain Boundary Strength of a Bicrystal Structure of Copper
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Topics: Copper, Grain boundaries, Molecular dynamics
Proceedings Papers

Traction Separation Laws of Hydrogenated Grain Boundaries of Graphene

Mohan S. R. Elapolu, Alireza Tabarraei
Proc. ASME. IMECE2020, Volume 12: Mechanics of Solids, Structures, and Fluids, V012T12A029, November 16–19, 2020
Paper No: IMECE2020-23770
https://doi.org/10.1115/IMECE2020-23770
View Paper titled, Traction Separation Laws of Hydrogenated Grain Boundaries of Graphene
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Topics: Grain boundaries, Graphene, Separation (Technology), Traction
Proceedings Papers

Molecular Dynamics Simulation Based Cohesive Zone Representation of Intergranular Fracture Processes in Bicrystalline Graphene

MD Imrul Reza Shishir, Alireza Tabarraei
Proc. ASME. IMECE2020, Volume 12: Mechanics of Solids, Structures, and Fluids, V012T12A028, November 16–19, 2020
Paper No: IMECE2020-23624
https://doi.org/10.1115/IMECE2020-23624
View Paper titled, Molecular Dynamics Simulation Based Cohesive Zone Representation of Intergranular Fracture Processes in Bicrystalline Graphene
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Topics: Fracture (Materials), Fracture (Process), Grain boundaries, Graphene, Molecular dynamics simulation, Separation (Technology), Traction
Proceedings Papers

Molecular Dynamics Analysis of the Acceleration of Intergranular Cracking of Ni-Base Superalloy Caused by Accumulation of Vacancies and Dislocations Around Grain Boundaries

Ryo Kikuchi, Shujiro Suzuki, Ken Suzuki
Proc. ASME. IMECE2020, Volume 12: Mechanics of Solids, Structures, and Fluids, V012T12A059, November 16–19, 2020
Paper No: IMECE2020-23352
https://doi.org/10.1115/IMECE2020-23352
View Paper titled, Molecular Dynamics Analysis of the Acceleration of Intergranular Cracking of Ni-Base Superalloy Caused by Accumulation of Vacancies and Dislocations Around Grain Boundaries
Open the PDF for Molecular Dynamics Analysis of the Acceleration of Intergranular Cracking of Ni-Base Superalloy Caused by Accumulation of Vacancies and Dislocations Around Grain Boundaries in another window
Topics: Creep, Dislocations, Fatigue, Fracture (Process), Grain boundaries, Molecular dynamics, Superalloys