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Proceedings Papers

Molecular Dynamics Analysis on the Degradation Mechanism of the Crystallinity and Strength of Grain Boundaries in Heat-Resistant Alloys Under Creep-Fatigue Loading at Elevated Temperature

Proc. ASME. IMECE2022, Volume 9: Mechanics of Solids, Structures, and Fluids; Micro- and Nano-Systems Engineering and Packaging; Safety Engineering, Risk, and Reliability Analysis; Research Posters, V009T12A036, October 30–November 3, 2022

Paper No: IMECE2022-94286

DOI: https://doi.org/10.1115/IMECE2022-94286

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Topics: Alloys, Creep, Diffusion (Physics), Fatigue, Grain boundaries, Heat, Molecular dynamics, Stress, Temperature

Proceedings Papers

Acceleration of Intergranular Cracking in Ni-Base Alloy GH4169 (IN718) Due to the Growth of δ-Phase Around Grain Boundaries Under Creep Loading at Elevated Temperatures

Ayumi Nakayama, Runzi Wang, Hideo Miura

Paper No: IMECE2022-94701

DOI: https://doi.org/10.1115/IMECE2022-94701

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Topics: Alloys, Cracking (Materials), Creep, Electron backscatter diffraction, Fracture (Process), Grain boundaries, Temperature

Proceedings Papers

Prediction of the Generation of Intergranular Cracking in Stainless Steels Under Creep Loading at Elevated Temperatures

Ken Suzuki, Koki Nakayama, Ayumi Nakayama, Shogo Tezuka, Hideo Miura

Paper No: IMECE2022-94891

DOI: https://doi.org/10.1115/IMECE2022-94891

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Topics: Cracking (Materials), Creep, Electron backscatter diffraction, Fracture (Process), Grain boundaries, Stainless steel, Stress, Temperature, Damage, Dislocations

Proceedings Papers

Material Constitutive Modeling Under High Strain Rates and Temperatures Through Orthogonal Machining Tests

Shuting Lei, Yung C. Shin, Frank P. Incropera

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 2, 91-98, November 16–21, 1997

Paper No: IMECE1997-1140

DOI: https://doi.org/10.1115/IMECE1997-1140

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Topics: Machining, Modeling, Temperature, Shear (Mechanics), Carbon steel, Constitutive equations, Deformation, Grain boundaries, Imaging, Optical microscopy

Proceedings Papers

Mechanisms Governing Cyclic Deformation and Damage During Elevated Temperature Fatigue of High Strength Aluminum Alloy 7055

T. S. Srivatsan, S. Anand

Proc. ASME. IMECE98, Mechanical Behavior of Advanced Materials, 33-50, November 15–20, 1998

Paper No: IMECE1998-1139

DOI: https://doi.org/10.1115/IMECE1998-1139

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Topics: Aluminum alloys, Damage, Deformation, Fatigue, Temperature, Stress, Alloys, Compression, Crack propagation, Dislocations

Proceedings Papers

A Comparison of the Fatigue Crack Growth Behavior of Single Crystal and Polycrystalline Inconel 718

C. Mercer, W. O. Soboyejo, A. B. O. Soboyejo

Proc. ASME. IMECE98, Mechanical Behavior of Advanced Materials, 79-105, November 15–20, 1998

Paper No: IMECE1998-1142

DOI: https://doi.org/10.1115/IMECE1998-1142

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Topics: Crystals, Fatigue cracks, Fracture (Materials), Alloys, Fatigue, Stress, Fractography, Grain boundaries, Scanning electron microscopy

Proceedings Papers

Crystallinity-Induced Acceleration of Intergranular Cracking in Thin-Film Interconnections Under High Current Density

Shota Akasaki, Hideo Miura

Proc. ASME. IMECE2021, Volume 12: Mechanics of Solids, Structures, and Fluids; Micro- and Nano- Systems Engineering and Packaging, V012T13A002, November 1–5, 2021

Paper No: IMECE2021-70222

DOI: https://doi.org/10.1115/IMECE2021-70222

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Topics: Cracking (Materials), Current density, Fracture (Process), Thin films, Grain boundaries, Electron backscatter diffraction, Bulk solids, Diffusion (Physics), Electrodiffusion, Grain boundary diffusion

Proceedings Papers

Molecular Dynamics Analysis of the Acceleration of the Degradation of the Strength of a Grain Boundary Under Creep-Fatigue Loads

Shujiroh Suzuki, Shogo Tezuka, Ken Suzuki, Hideo Miura

Proc. ASME. IMECE2021, Volume 12: Mechanics of Solids, Structures, and Fluids; Micro- and Nano- Systems Engineering and Packaging, V012T12A053, November 1–5, 2021

Paper No: IMECE2021-70628

DOI: https://doi.org/10.1115/IMECE2021-70628

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Topics: Creep, Damage, Fatigue, Grain boundaries, Molecular dynamics, Stress, Superalloys

Proceedings Papers

Creep-Fatigue Damage of Heat-Resistant Alloys Caused by the Local Lattice Mismatch-Induced Acceleration of the Generation and Accumulation of Dislocations and Vacancies

Yifan Luo, Shogo Tezuka, Koki Nakayama, Ayumi Nakayama, Ken Suzuki, Hideo Miura

Proc. ASME. IMECE2021, Volume 12: Mechanics of Solids, Structures, and Fluids; Micro- and Nano- Systems Engineering and Packaging, V012T12A051, November 1–5, 2021

Paper No: IMECE2021-68489

DOI: https://doi.org/10.1115/IMECE2021-68489

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Topics: Alloys, Creep, Damage, Dislocations, Electron backscatter diffraction, Fatigue, Grain boundaries, Heat, Stress, Diffusion (Physics)

Proceedings Papers

Transient, Three-Dimensional Heat Transfer Model for Partially Stabilized Zirconia Undergoing Laser-Assisted Machining

Frank E. Pfefferkorn, Frank P. Incropera, Yung C. Shin

Proc. ASME. IMECE99, Heat Transfer: Volume 3, 197-209, November 14–19, 1999

Paper No: IMECE1999-1078

DOI: https://doi.org/10.1115/IMECE1999-1078

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Topics: Heat transfer, Lasers, Machining, Transients (Dynamics), Temperature, Radiation (Physics), Approximation, Ceramics, Electromagnetic scattering, Radiation scattering

Proceedings Papers

Photon Counting Temperature Measurements During Pulsed Laser Heating of Al 2 O 3 -TiC Ceramics

Todd M. Harms, Xianfan Xu

Proc. ASME. IMECE99, Heat Transfer: Volume 3, 181-187, November 14–19, 1999

Paper No: IMECE1999-1076

DOI: https://doi.org/10.1115/IMECE1999-1076

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Topics: Ceramics, Heating, Lasers, Photons, Temperature measurement, Temperature, Chemical reactions, Computer simulation, Emission spectra, Excitation

Proceedings Papers

Metal-Induced Laterally Crystallized Polycrystalline Silicon for Micro-Systems: Mechanical and Etching Characteristics

Mingxiang Wang, Wan Lap Yeung, Yitshak Zohar, Man Wong

Proc. ASME. IMECE2001, Micro-Electro-Mechanical Systems (MEMS), 345-349, November 11–16, 2001

Paper No: IMECE2001/MEMS-23850

DOI: https://doi.org/10.1115/IMECE2001/MEMS-23850

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Topics: Etching, Metals, Microelectromechanical systems, Polysilicon, Electrical properties, Grain boundaries, Pressure, Vapors

Proceedings Papers

Mechanical Properties of Novel Nanocrystalline Materials

J. Narayan, H. Wang, A. Kvit

Proc. ASME. IMECE2001, Effects of Processing on Properties of Advanced Ceramics, 55-63, November 11–16, 2001

Paper No: IMECE2001/MD-24806

DOI: https://doi.org/10.1115/IMECE2001/MD-24806

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Topics: Mechanical properties, Nanocrystals, Grain size, Grain boundaries, Adhesion, Deformation, Shear (Mechanics), Thin films, Weak force, Wear

Proceedings Papers

Superplasticity and Microstructural Evolution of a Large-Grained Mg Alloy

Yi Liu, Kelly Shue, Xin Wu, Zhicheng Li, Yongbo Xu

Proc. ASME. IMECE2000, Manufacturing Engineering, 275-280, November 5–10, 2000

Paper No: IMECE2000-1818

DOI: https://doi.org/10.1115/IMECE2000-1818

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Topics: Magnesium alloys, Superplasticity, Deformation, Dislocations, Grain boundaries, Temperature, Electron backscatter diffraction, Elongation, Grain size, Recrystallization

Proceedings Papers

Micro-Mechanics of Creep-Fatigue Damage in Pb-Sn Solder Due to Thermal Cycling

Pradeep Sharma, Abhijit Dasgupta

Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 173-179, November 5–10, 2000

Paper No: IMECE2000-2260

DOI: https://doi.org/10.1115/IMECE2000-2260

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Topics: Creep, Damage, Fatigue, Micromechanics (Engineering), Solders, Tin, Stress, Aeroelasticity, Damage mechanics, Fatigue damage

Proceedings Papers

Molecular Dynamics Simulation Based Cohesive Zone Representation of Intergranular Fracture Processes in Bicrystalline Graphene

MD Imrul Reza Shishir, Alireza Tabarraei

Proc. ASME. IMECE2020, Volume 12: Mechanics of Solids, Structures, and Fluids, V012T12A028, November 16–19, 2020

Paper No: IMECE2020-23624

DOI: https://doi.org/10.1115/IMECE2020-23624

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Topics: Fracture (Materials), Fracture (Process), Grain boundaries, Graphene, Molecular dynamics simulation, Separation (Technology), Traction

Proceedings Papers

Molecular Dynamics Analysis of the Acceleration of Intergranular Cracking of Ni-Base Superalloy Caused by Accumulation of Vacancies and Dislocations Around Grain Boundaries

Ryo Kikuchi, Shujiro Suzuki, Ken Suzuki

Proc. ASME. IMECE2020, Volume 12: Mechanics of Solids, Structures, and Fluids, V012T12A059, November 16–19, 2020

Paper No: IMECE2020-23352

DOI: https://doi.org/10.1115/IMECE2020-23352

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Topics: Creep, Dislocations, Fatigue, Fracture (Process), Grain boundaries, Molecular dynamics, Superalloys

Proceedings Papers

Damage Mechanism of the Acceleration of Intergranular Cracking of Stainless Steel SUS316LN Under Creep Loading at Elevated Temperatures

Chongzhe Gu, Yukako Takahashi, Hideo Miura

Proc. ASME. IMECE2020, Volume 12: Mechanics of Solids, Structures, and Fluids, V012T12A061, November 16–19, 2020

Paper No: IMECE2020-23693

DOI: https://doi.org/10.1115/IMECE2020-23693

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Topics: Cracking (Materials), Creep, Damage, Electron backscatter diffraction, Fracture (Process), Grain boundaries, Stainless steel, Temperature

Proceedings Papers

Acceleration of Grain Boundary Cracking in Ni-Base Alloy 617 Under Creep-Fatigue Loading at 800°C

Kenta Ishihara, Yifan Luo, Hideo Miura

Proc. ASME. IMECE2020, Volume 12: Mechanics of Solids, Structures, and Fluids, V012T12A062, November 16–19, 2020

Paper No: IMECE2020-23738

DOI: https://doi.org/10.1115/IMECE2020-23738

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Topics: Alloys, Cracking (Materials), Creep, Electron backscatter diffraction, Fatigue, Fracture (Process), Grain boundaries

Proceedings Papers

Degradation of the Strength of a Grain Boundary of Ni-Base Superalloys Under Creep-Fatigue Loading at Elevated Temperature

Yukako Takahashi, Yifan Luo, Kenta Ishihara, Shujiro Suzuki, Hideo Miura

Proc. ASME. IMECE2020, Volume 12: Mechanics of Solids, Structures, and Fluids, V012T12A071, November 16–19, 2020

Paper No: IMECE2020-24473

DOI: https://doi.org/10.1115/IMECE2020-24473

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Topics: Creep, Electron backscatter diffraction, Fatigue, Grain boundaries, Superalloys, Temperature

2 3 4 5

NARROW

Molecular Dynamics Analysis on the Degradation Mechanism of the Crystallinity and Strength of Grain Boundaries in Heat-Resistant Alloys Under Creep-Fatigue Loading at Elevated Temperature

Acceleration of Intergranular Cracking in Ni-Base Alloy GH4169 (IN718) Due to the Growth of δ-Phase Around Grain Boundaries Under Creep Loading at Elevated Temperatures

Prediction of the Generation of Intergranular Cracking in Stainless Steels Under Creep Loading at Elevated Temperatures

Material Constitutive Modeling Under High Strain Rates and Temperatures Through Orthogonal Machining Tests

Mechanisms Governing Cyclic Deformation and Damage During Elevated Temperature Fatigue of High Strength Aluminum Alloy 7055

A Comparison of the Fatigue Crack Growth Behavior of Single Crystal and Polycrystalline Inconel 718

Crystallinity-Induced Acceleration of Intergranular Cracking in Thin-Film Interconnections Under High Current Density

Molecular Dynamics Analysis of the Acceleration of the Degradation of the Strength of a Grain Boundary Under Creep-Fatigue Loads

Creep-Fatigue Damage of Heat-Resistant Alloys Caused by the Local Lattice Mismatch-Induced Acceleration of the Generation and Accumulation of Dislocations and Vacancies

Transient, Three-Dimensional Heat Transfer Model for Partially Stabilized Zirconia Undergoing Laser-Assisted Machining

Photon Counting Temperature Measurements During Pulsed Laser Heating of Al 2 O 3 -TiC Ceramics

Metal-Induced Laterally Crystallized Polycrystalline Silicon for Micro-Systems: Mechanical and Etching Characteristics

Mechanical Properties of Novel Nanocrystalline Materials

Superplasticity and Microstructural Evolution of a Large-Grained Mg Alloy

Micro-Mechanics of Creep-Fatigue Damage in Pb-Sn Solder Due to Thermal Cycling

Molecular Dynamics Simulation Based Cohesive Zone Representation of Intergranular Fracture Processes in Bicrystalline Graphene

Molecular Dynamics Analysis of the Acceleration of Intergranular Cracking of Ni-Base Superalloy Caused by Accumulation of Vacancies and Dislocations Around Grain Boundaries

Damage Mechanism of the Acceleration of Intergranular Cracking of Stainless Steel SUS316LN Under Creep Loading at Elevated Temperatures

Acceleration of Grain Boundary Cracking in Ni-Base Alloy 617 Under Creep-Fatigue Loading at 800°C

Degradation of the Strength of a Grain Boundary of Ni-Base Superalloys Under Creep-Fatigue Loading at Elevated Temperature

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