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Proceedings Papers

Application of Metallic Nanoparticle Suspensions in Advanced Cooling Systems

Shinpyo Lee, Stephen U.-S. Choi
Proc. ASME. IMECE96, Recent Advances in Solids/Structures and Application of Metallic Materials, 227-234, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0161
https://doi.org/10.1115/IMECE1996-0161
View Paper titled, Application of Metallic Nanoparticle Suspensions in Advanced Cooling Systems
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Topics: Cooling systems, Nanoparticles, Heat exchangers, Microchannels, Nanofluids, Cooling, Fluids, Silicon, Heat transfer, Nitrogen
Proceedings Papers

Damage Initiation and Propagation in Metal Laminates

Robert A. Riddle, Donald R. Lesuer, Chol K. Syn
Proc. ASME. IMECE96, Recent Advances in Solids/Structures and Application of Metallic Materials, 167-184, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0157
https://doi.org/10.1115/IMECE1996-0157
View Paper titled, Damage Initiation and Propagation in Metal Laminates
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Topics: Damage, Laminates, Metals, Fracture toughness, Fracture (Materials), Aluminum alloys, Delamination, Failure, Metal matrix composites, Plates (structures)
Proceedings Papers

Flow and Heat Transfer Problems in the Semiconductor Manufacturing Processes

Masato Ikegawa
Proc. ASME. IMECE96, Transport Phenomena in Materials Processing and Manufacturing, 183, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-1044
https://doi.org/10.1115/IMECE1996-1044
View Paper titled, Flow and Heat Transfer Problems in the Semiconductor Manufacturing Processes
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Topics: Flow (Dynamics), Heat transfer, Integrated circuit fabrication, Semiconductor wafers, Manufacturing, Particulate matter, Chemical reactions, Chemical vapor deposition, Contamination, Etching
Proceedings Papers

On Selective Optical Absorber Film for Rotor of Opto Microengine

Masahiro Ota, Masataka Ishiguro, Moriyoshi Sakamoto
Proc. ASME. IMECE96, Transport Phenomena in Materials Processing and Manufacturing, 193-206, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-1046
https://doi.org/10.1115/IMECE1996-1046
View Paper titled, On Selective Optical Absorber Film for Rotor of Opto Microengine
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Topics: Rotors, Germanium, Silicon, Thin films, Aluminum, Reflectance, Borosilicate glasses, Glass, Plates (structures), Actuators
Proceedings Papers

Transient Response of Microchannel Heat Sinks in a Silicon Substrate

José R. Rujano, Muhammad M. Rahman
Proc. ASME. IMECE96, Advanced Energy Systems, 3-11, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0256
https://doi.org/10.1115/IMECE1996-0256
View Paper titled, Transient Response of Microchannel Heat Sinks in a Silicon Substrate
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Topics: Heat sinks, Microchannels, Silicon, Transients (Dynamics), Fluids, Heat transfer, Temperature, Forced convection, Heat, Heat flux
Proceedings Papers

Ultrasonic MEMS Device for Fluid Pumping and Mixing

Richard M. White
Proc. ASME. IMECE96, Aerospace, 743-750, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0690
https://doi.org/10.1115/IMECE1996-0690
View Paper titled, Ultrasonic MEMS Device for Fluid Pumping and Mixing
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Topics: Fluids, Microelectromechanical systems, Membranes, Pumps, Waves, Acoustic intensity, Acoustics, Gases, Micromachining, Silicon
Proceedings Papers

Predicted Thermally Induced Stresses in an Epoxy Molding Compound at the Chip Corner

M. Uschitsky, E. Suhir
Proc. ASME. IMECE96, Structural Analysis in Microelectronics and Fiber Optics, 67-100, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0724
https://doi.org/10.1115/IMECE1996-0724
View Paper titled, Predicted Thermally Induced Stresses in an Epoxy Molding Compound at the Chip Corner
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Topics: Corners (Structural elements), Epoxy adhesives, Epoxy resins, Molding, Stress, Delamination, Adhesion, Fracture (Materials), Reliability, Design
Proceedings Papers

Tension-Tension Fatigue of Copper Thin Films

David T. Read
Proc. ASME. IMECE96, Structural Analysis in Microelectronics and Fiber Optics, 175-180, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0732
https://doi.org/10.1115/IMECE1996-0732
View Paper titled, Tension-Tension Fatigue of Copper Thin Films
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Topics: Copper, Fatigue, Tension, Thin films, Stress, Cycles, Electrons, Fatigue testing, Feedback, Piezoelectric actuators
Proceedings Papers

An Investigation of Microstructure and Microdynamics of Fluid Flow in MEMS

Ann-Marie Lanzillotto, Tzong-Shyng Leu, Michael Amabile, Richard Wildes, John Dunsmuir
Proc. ASME. IMECE96, Aerospace, 789-796, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0695
https://doi.org/10.1115/IMECE1996-0695
View Paper titled, An Investigation of Microstructure and Microdynamics of Fluid Flow in MEMS
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Topics: Fluid dynamics, Microelectromechanical systems, Flow (Dynamics), Fluids, Microchannels, Capillarity, Computers, Displacement, Drops, Emulsions
Proceedings Papers

Combustors for Micro-Gas Turbine Engines

Ian A. Waitz, Gautam Gauba, Yang-Sheng Tzeng
Proc. ASME. IMECE96, Aerospace, 777-788, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0694
https://doi.org/10.1115/IMECE1996-0694
View Paper titled, Combustors for Micro-Gas Turbine Engines
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Topics: Combustion chambers, Gas turbines, Combustion, Hydrogen, Ceramics, Cooling, Design, Flames, Fossil fuels, Heat transfer
Proceedings Papers

Silicon Bulk Micromachining in Tohoku University

Kazuyuki Minami, Masayoshi Esashi
Proc. ASME. IMECE96, Aerospace, 769-775, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0693
https://doi.org/10.1115/IMECE1996-0693
View Paper titled, Silicon Bulk Micromachining in Tohoku University
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Topics: Micromachining, Silicon, Microelectromechanical systems, Sensors, Blood vessels, Catheters, Electric fields, Evaporation, Inertia (Mechanics), Manufacturing
Proceedings Papers

Temperature-Dependent Thermal Conductivity of Single-Crystal Silicon Layers in SOI Substrates

M. Asheghi, M. N. Touzelbaev, K. E. Goodson, Y. K. Leung, S. S. Wong
Proc. ASME. IMECE96, Microelectromechanical Systems (MEMS), 83-91, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-1340
https://doi.org/10.1115/IMECE1996-1340
View Paper titled, Temperature-Dependent Thermal Conductivity of Single-Crystal Silicon Layers in SOI Substrates
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Topics: Crystals, Silicon, Silicon-on-insulator, Temperature, Thermal conductivity, Semiconductor wafers, Phonons, Transistors, Cantilevers, Electromagnetic scattering
Proceedings Papers

Giant Reduction in Lateral Thermal Conductivity of Thin Nitride/Silicon/Oxide Membrane Measured With a Suspended Micro Structure

X. Y. Zheng, S. Z. Li, M. Chen, K. L. Wang
Proc. ASME. IMECE96, Microelectromechanical Systems (MEMS), 93-98, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-1341
https://doi.org/10.1115/IMECE1996-1341
View Paper titled, Giant Reduction in Lateral Thermal Conductivity of Thin Nitride/Silicon/Oxide Membrane Measured With a Suspended Micro Structure
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Topics: Membranes, Silicon, Thermal conductivity, Bridges (Structures), Circuits, Polysilicon, Signals, Silicon nitride ceramics, Temperature sensors
Proceedings Papers

Experiments and Simulations on a Micro-Mixer Fabricated Using a Planar Silicon/Glass Technology

Jens Peter Krog, Jens Branebjerg, Claus Rye Nielsen, Peter Gravesen
Proc. ASME. IMECE96, Microelectromechanical Systems (MEMS), 177-182, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-1350
https://doi.org/10.1115/IMECE1996-1350
View Paper titled, Experiments and Simulations on a Micro-Mixer Fabricated Using a Planar Silicon/Glass Technology
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Topics: Engineering simulation, Glass, Silicon, Simulation, Flow (Dynamics), Computer simulation, Design, Diffusion (Physics), Experimental characterization, Fluids
Proceedings Papers

A Bimetallic Thermally Actuated Micropump

Yue Yang, Zhaoying Zhou, Xiongying Ye, Xiaoning Jiang
Proc. ASME. IMECE96, Microelectromechanical Systems (MEMS), 351-354, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-1373
https://doi.org/10.1115/IMECE1996-1373
View Paper titled, A Bimetallic Thermally Actuated Micropump
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Topics: Micropumps, Pumps, Flow (Dynamics), Actuators, Membranes, Micromachining, Silicon, Valves
Proceedings Papers

A Low Power, Tight Seal, Polyimide Electrostatic Microvalve

Abraham P. Lee, Julie Hamilton, Jimmy Trevino
Proc. ASME. IMECE96, Microelectromechanical Systems (MEMS), 345-349, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-1372
https://doi.org/10.1115/IMECE1996-1372
View Paper titled, A Low Power, Tight Seal, Polyimide Electrostatic Microvalve
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Topics: Actuators, Cantilevers, Design, Displacement, Electrodes, Energy consumption, Flow (Dynamics), Fluids, Microactuators, Sealing (Process)
Proceedings Papers

Flow Behavior Through Microfluidic Valves

X. N. Jiang, Z. Y. Zhou, Y. Li, Y. Yang, X. Y. Ye
Proc. ASME. IMECE96, Microelectromechanical Systems (MEMS), 221-224, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-1355
https://doi.org/10.1115/IMECE1996-1355
View Paper titled, Flow Behavior Through Microfluidic Valves
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Topics: Flow (Dynamics), Microfluidics, Valves, Silicon, Diffusers, Nozzles, Control systems
Proceedings Papers

Development of a Micropump for Microelectronic Cooling

C. Channy Wong, Douglas R. Adkins, Dahwey Chu
Proc. ASME. IMECE96, Microelectromechanical Systems (MEMS), 239-244, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-1357
https://doi.org/10.1115/IMECE1996-1357
View Paper titled, Development of a Micropump for Microelectronic Cooling
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Topics: Cooling, Micropumps, Design, Pumps, Silicon, Microelectromechanical systems, Electrodes, Electrohydrodynamics, Fluids, Manufacturing
Proceedings Papers

Computation of Supersonic Flow for Thin Film Deposition Using Expansion Through a Skimmer

Iain D. Boyd, Gang Chen
Proc. ASME. IMECE96, Microelectromechanical Systems (MEMS), 169-176, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-1349
https://doi.org/10.1115/IMECE1996-1349
View Paper titled, Computation of Supersonic Flow for Thin Film Deposition Using Expansion Through a Skimmer
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Topics: Computation, Supersonic flow, Thin films, Simulation, Monte Carlo methods, Design, Flow (Dynamics), Gasdynamics, Hydrogen, Nonequilibrium flow
Proceedings Papers

An Integrated Silicon Based Wall Pressure-Shear Stress Sensor for Measurements in Turbulent Flows

L. Löfdahl, E. Kälvesten, T. Hadzianagnostakis, G. Stemme
Proc. ASME. IMECE96, Microelectromechanical Systems (MEMS), 245-251, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-1358
https://doi.org/10.1115/IMECE1996-1358
View Paper titled, An Integrated Silicon Based Wall Pressure-Shear Stress Sensor for Measurements in Turbulent Flows
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Topics: Pressure, Sensors, Shear (Mechanics), Silicon, Stress, Turbulence, Shear stress, Diaphragms (Mechanical devices), Diaphragms (Structural), Pressure sensors