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Proceedings Papers

A Study on Reliability of Pb40/Sn60 Solder Joints Under Dynamic Loading

Cemal Basaran, Rumpa Chandaroy

Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 227-242, November 16–21, 1997

Paper No: IMECE1997-0822

DOI: https://doi.org/10.1115/IMECE1997-0822

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Topics: Dynamic testing (Materials), Reliability, Solder joints, Dynamic analysis, Failure mechanisms, Solders, Constitutive equations, Cycles, Defense industry, Failure

Proceedings Papers

Experimental Observation of Fatigue-Creep Fracture Development in Solder Joints of Different Standoffs

D. R. Liu

Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 249-259, November 16–21, 1997

Paper No: IMECE1997-0824

DOI: https://doi.org/10.1115/IMECE1997-0824

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Topics: Creep, Fatigue, Fracture (Materials), Fracture (Process), Solder joints, Temperature, Printed circuit boards, Damage, Melting, Separation (Technology)

Proceedings Papers

Assessment of an Axisymmetric Analytical Model of a Square Areal Array Assembly

S. Shakya, S. M. Heinrich, J. Liang, P. S. Lee

Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 55-63, November 16–21, 1997

Paper No: IMECE1997-0814

DOI: https://doi.org/10.1115/IMECE1997-0814

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Topics: Ball-Grid-Array packaging, Ceramics, Computer simulation, Die cutting, Disks, Displacement, Finite element analysis, Finite element methods, Flip-chip packages, Geometry

Proceedings Papers

Prediction of the Solder Joint Configuration Under Various Geometric Parameters

Wei-Long Chen, Bor-Lin Shyu, Kuo-Ning Chiang

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 397-400, November 16–21, 1997

Paper No: IMECE1997-1116

DOI: https://doi.org/10.1115/IMECE1997-1116

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Topics: Solder joints, Shapes, Electronic packaging, Energy conservation, Gravity (Force), Numerical analysis, Shape design, Solders, Surface tension, Weight (Mass)

Proceedings Papers

CBGA Solder Fillet Shape Prediction and Design Optimization

Y. Li, R. L. Mahajan

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 431-438, November 16–21, 1997

Paper No: IMECE1997-1120

DOI: https://doi.org/10.1115/IMECE1997-1120

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Topics: Design, Optimization, Shapes, Solders, Mathematical analysis, Reliability, Ball-Grid-Array packaging, Ceramics, Composite materials, Experimental design

Proceedings Papers

Solder Joint Formation Simulation and Component Tombstoning Prediction During Reflow

Xiaohua Wu, Xinyu Dou, Chao-pin Yeh, Karl Waytt

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 391-395, November 16–21, 1997

Paper No: IMECE1997-1115

DOI: https://doi.org/10.1115/IMECE1997-1115

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Topics: Simulation, Solder joints, Geometry, Solders, Engineering simulation, Failure, Reliability, Wetting, Alloys, Computer simulation

Proceedings Papers

On the Equivalent Finite Element Beam Model for Ball Grid Array Analysis

Hsien-Chie Cheng, Kuo-Ning Chiang, Ming-Hsiao Lee

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 353-360, November 16–21, 1997

Paper No: IMECE1997-1110

DOI: https://doi.org/10.1115/IMECE1997-1110

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Topics: Ball-Grid-Array packaging, Finite element analysis, Optimization, Packaging, Pipes, Plastics, Solder joints

Proceedings Papers

Shearing Deformation in Partial Areal Arrays: Analytical Results

S. M. Heinrich, S. Shakya, P. S. Lee

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 51-59, November 16–21, 1997

Paper No: IMECE1997-0500

DOI: https://doi.org/10.1115/IMECE1997-0500

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Topics: Boundary-value problems, Corners (Structural elements), Die cutting, Dimensions, Displacement, Elasticity, Fatigue life, Finite element analysis, Finite element model, Geometry

Proceedings Papers

Stress Analysis of High Density Bare Chip Packaging Technologies

Yutaka Tsukada, Shogo Mizumoto, Yasuyuki Kodama, Hideo Nishimura

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 49-50, November 16–21, 1997

Paper No: IMECE1997-0499

DOI: https://doi.org/10.1115/IMECE1997-0499

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Topics: Density, Packaging, Stress analysis (Engineering), Epoxy adhesives, Epoxy resins, Ceramics, Ball-Grid-Array packages, Ball-Grid-Array packaging, Electronic packaging, Flip-chip

Proceedings Papers

Reliability of Underfill-Encapsulated Flip-Chip Packages

Hiroaki Doi, Kenya Kawano, Akio Yasukawa, Toshihiko Sato

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 7-14, November 16–21, 1997

Paper No: IMECE1997-0494

DOI: https://doi.org/10.1115/IMECE1997-0494

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Topics: Flip-chip packages, Reliability, Flat heat pipes, Solder joints, Delamination, Mechanical properties, Shapes, Stress, Stress analysis (Engineering), Finite element methods

Proceedings Papers

Fracture and Damage Evaluation in Chip Scale Packages and Flip-Chip-Assemblies by FEA and MicroDAC

Jürgen Auersperg, Andreas Schubert, Dietmar Vogel, Bernd Michel, Herbert Reichl

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 133-138, November 16–21, 1997

Paper No: IMECE1997-0508

DOI: https://doi.org/10.1115/IMECE1997-0508

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Topics: Damage, Finite element analysis, Flip-chip assemblies, Fracture (Materials), Fracture (Process), Solders, Reliability, Simulation, Thermomechanics, Delamination

Proceedings Papers

The Effect of Underfill Delamination on the Reliability of Flip Chip Modules

Sven Rzepka, Matt A. Korhonen, Ekkehard Meusel, Che-Yu Li

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 73-83, November 16–21, 1997

Paper No: IMECE1997-0502

DOI: https://doi.org/10.1115/IMECE1997-0502

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Topics: Delamination, Flip-chip, Flip-chip devices, Reliability, Solders, Tension, Failure, Solder joints, Adhesion, Compressive stress

Proceedings Papers

Underfill Selection and its Impact on the Reliability of Flip-Chip Assemblies

Xiantao Yan

Proc. ASME. IMECE98, Manufacturing Science and Engineering, 735-745, November 15–20, 1998

Paper No: IMECE1998-1088

DOI: https://doi.org/10.1115/IMECE1998-1088

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Topics: Flip-chip assemblies, Reliability, Solders, Fracture toughness, Printed circuit boards, Stress, Cracking (Materials), Experimental methods, Fatigue, Flow (Dynamics)

Proceedings Papers

A System for First Order Reliability Estimation of Solder Joints in Area Array Packages

Anand M. Deshpande, Ganesh Subbarayan, Dan Rose

Proc. ASME. IMECE98, Manufacturing Science and Engineering, 767-777, November 15–20, 1998

Paper No: IMECE1998-1091

DOI: https://doi.org/10.1115/IMECE1998-1091

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Topics: Reliability, Solder joints, Design, Artificial neural networks, Computers, Fatigue life, Interferometry, Neural network models, Sands

Proceedings Papers

Parametric Analysis of Thermally Enhanced BGA Reliability Using a Finite-Volume-Weighted Averaging Technique

Hsien-Chie Cheng, Kuo-Ning Chiang, Chao-Kuang Chen

Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 13-20, November 15–20, 1998

Paper No: IMECE1998-0423

DOI: https://doi.org/10.1115/IMECE1998-0423

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Topics: Ball-Grid-Array packaging, Reliability, Solder joints, Ball-Grid-Array packages, Design, Fatigue, Geometry, Corners (Structural elements), Finite element analysis, Manufacturing

Proceedings Papers

On the Life Prediction and Accelerated Testing of Solder Joints

Zhengfang Qian, Sheng Liu

Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 1-11, November 15–20, 1998

Paper No: IMECE1998-0422

DOI: https://doi.org/10.1115/IMECE1998-0422

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Topics: Solder joints, Testing, Fatigue life, Flip-chip packages, Constitutive equations, Finite element analysis, Finite element model, Modeling, Solders, Temperature

Proceedings Papers

On Enhancing Eutectic Solder Joint Reliability Using a 2 nd -Reflow-Process Approach

Kuo-Ning Chiang, Hsien-Chie Cheng

Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 21-25, November 15–20, 1998

Paper No: IMECE1998-0424

DOI: https://doi.org/10.1115/IMECE1998-0424

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Topics: Reliability, Solder joints, Solders, Ball-Grid-Array packaging, Geometry, Fatigue life, Flip-chip, Flip-chip devices, Materials properties

Proceedings Papers

Effect of Manufacturing Induced Defects on the Reliability of Flip-Chip Packages

Jianjun Wang, Daqing Zou, Zhengfang Qian, Wei Ren, Sheng Liu

Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 35-42, November 15–20, 1998

Paper No: IMECE1998-0426

DOI: https://doi.org/10.1115/IMECE1998-0426

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Topics: Flip-chip packages, Manufacturing, Reliability, Solders, Simulation results, Finite element analysis, Finite element model, Interferometry, Warping, Contamination

Proceedings Papers

A Linear Motor Driven Mini Tester and its Application to Thermal/Mechanical Fatigue Testing of Solder Joint Specimen

Minfu Lu, Zhengfang Qian, Sheng Liu, Jianhau Wu

Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 43-49, November 15–20, 1998

Paper No: IMECE1998-0427

DOI: https://doi.org/10.1115/IMECE1998-0427

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Topics: Fatigue testing, Linear motors, Solder joints, Fatigue, Damage, Engines, Motors, Solders, Failure, Fracture (Materials)

Proceedings Papers

Prognostic Health Monitoring Method for Thermal Fatigue Failure of Power Modules Based on Finite Element Method-Based Lagrangian Neural Networks

Akira Kano, Tomoko Monda, Tomoyuki Suzuki, Hideaki Uehara, Tomoya Fumikura, Kenji Hirohata

Proc. ASME. IMECE2021, Volume 13: Safety Engineering, Risk, and Reliability Analysis; Research Posters, V013T14A028, November 1–5, 2021

Paper No: IMECE2021-70783

DOI: https://doi.org/10.1115/IMECE2021-70783

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Topics: Artificial neural networks, Fatigue, Fatigue failure, Finite element analysis, Fatigue life, Stress, Reliability, Cycles, Maintenance, Solder joints

2 3 4 5

NARROW

A Study on Reliability of Pb40/Sn60 Solder Joints Under Dynamic Loading

Experimental Observation of Fatigue-Creep Fracture Development in Solder Joints of Different Standoffs

Assessment of an Axisymmetric Analytical Model of a Square Areal Array Assembly

Prediction of the Solder Joint Configuration Under Various Geometric Parameters

CBGA Solder Fillet Shape Prediction and Design Optimization

Solder Joint Formation Simulation and Component Tombstoning Prediction During Reflow

On the Equivalent Finite Element Beam Model for Ball Grid Array Analysis

Shearing Deformation in Partial Areal Arrays: Analytical Results

Stress Analysis of High Density Bare Chip Packaging Technologies

Reliability of Underfill-Encapsulated Flip-Chip Packages

Fracture and Damage Evaluation in Chip Scale Packages and Flip-Chip-Assemblies by FEA and MicroDAC

The Effect of Underfill Delamination on the Reliability of Flip Chip Modules

Underfill Selection and its Impact on the Reliability of Flip-Chip Assemblies

A System for First Order Reliability Estimation of Solder Joints in Area Array Packages

Parametric Analysis of Thermally Enhanced BGA Reliability Using a Finite-Volume-Weighted Averaging Technique

On the Life Prediction and Accelerated Testing of Solder Joints

On Enhancing Eutectic Solder Joint Reliability Using a 2 nd -Reflow-Process Approach

Effect of Manufacturing Induced Defects on the Reliability of Flip-Chip Packages

A Linear Motor Driven Mini Tester and its Application to Thermal/Mechanical Fatigue Testing of Solder Joint Specimen

Prognostic Health Monitoring Method for Thermal Fatigue Failure of Power Modules Based on Finite Element Method-Based Lagrangian Neural Networks

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