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Proceedings Papers

Sequential Processing Mechanics Modeling for a Model IC Package

Jianjun Wang, Sheng Liu

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 401-410, November 16–21, 1997

Paper No: IMECE1997-1117

DOI: https://doi.org/10.1115/IMECE1997-1117

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Topics: Modeling, Stress, Manufacturing, Solders, Temperature, Finite element analysis, Finite element methods, Finite element model, Silicon chips, Bonding

Proceedings Papers

Material Constitutive Modeling Under High Strain Rates and Temperatures Through Orthogonal Machining Tests

Shuting Lei, Yung C. Shin, Frank P. Incropera

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 2, 91-98, November 16–21, 1997

Paper No: IMECE1997-1140

DOI: https://doi.org/10.1115/IMECE1997-1140

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Topics: Machining, Modeling, Temperature, Shear (Mechanics), Carbon steel, Constitutive equations, Deformation, Grain boundaries, Imaging, Optical microscopy

Proceedings Papers

A Continuum Mechanics Model to Predict Shear Angle and Cutting Forces in Orthogonal Cutting

Y. Zheng, J. W. Sutherland, W. W. Olson

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 2, 61-68, November 16–21, 1997

Paper No: IMECE1997-1136

DOI: https://doi.org/10.1115/IMECE1997-1136

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Topics: Continuum mechanics, Cutting, Shear (Mechanics), Deformation, Machining, Temperature, Temperature distribution, Tensors

Proceedings Papers

White Layers and Thermal Modeling of Hard Turned Surfaces

Y. Kevin Chou, Chris J. Evans

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 2, 75-82, November 16–21, 1997

Paper No: IMECE1997-1138

DOI: https://doi.org/10.1115/IMECE1997-1138

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Topics: Cutting, Heat, Modeling, Temperature, Wear

Proceedings Papers

Evaluation of Interfacial Fracture Toughness of a Bi-Material System Under Thermal Loading Conditions

Jianjun Wang, Daqing Zou, Sheng Liu

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 411-421, November 16–21, 1997

Paper No: IMECE1997-1118

DOI: https://doi.org/10.1115/IMECE1997-1118

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Topics: Fracture toughness, Fracture (Materials), Temperature, Stress, Displacement, Finite element analysis, Interferometry, Molding, Silicon, Density

Proceedings Papers

Influence of the Clamping Mechanism on Tool Failure During Dry High Speed Machining

Tahany I. El-Wardany, Mohamed A. Elbestawi

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 2, 285-296, November 16–21, 1997

Paper No: IMECE1997-1164

DOI: https://doi.org/10.1115/IMECE1997-1164

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Topics: Failure, High speed machining, Brittle fracture, Tension, Aluminum, Automotive brakes, Boron, Cast iron, Clamps (Tools), Composite materials

Proceedings Papers

Transient and Steady-State Thermal Design Evaluation of a Carbon Monoxide Gas Sensor Using CFD Tool

Tien-Yu Tom Lee, Ravi Sharma, André Peyre-Lavigne

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 339-345, November 16–21, 1997

Paper No: IMECE1997-1108

DOI: https://doi.org/10.1115/IMECE1997-1108

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Topics: Carbon monoxide, Computational fluid dynamics, Design, Sensors, Steady state, Transients (Dynamics), Cooling, Cycles, Electrical measurement, Energy consumption

Proceedings Papers

Real Time Monitoring and Simulation of Thermal Deformation in Plastic Package

Jiansen Zhu, Daqing Zou, Sheng Liu

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 361-368, November 16–21, 1997

Paper No: IMECE1997-1111

DOI: https://doi.org/10.1115/IMECE1997-1111

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Topics: Simulation, Thermal deformation, Temperature, Finite element analysis, Interferometry, Diffraction patterns, Electronic packaging, Packaging, Reliability, Diffraction gratings

Proceedings Papers

Finite Element Modeling and Photoelastic Analysis of an Integral Armor Under Flexural Loading

H. Mahfuz, B. R. Lokesh, P. S. Das, U. Vaidya, S. Jeelani

Proc. ASME. IMECE97, Noise Control and Acoustics, 235-241, November 16–21, 1997

Paper No: IMECE1997-1049

DOI: https://doi.org/10.1115/IMECE1997-1049

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Topics: Armor, Finite element analysis, Modeling, Bricks, Coating processes, Coatings, Composite materials, Deformation, Diffraction patterns, Failure mechanisms

Proceedings Papers

Hat Cycle Exergetic Analysis and Thermoeconomic Evaluation of Fuel Costs

Waldyr L. R. Gallo, Jorge Llagostera, Arnaldo C. S. Walter

Proc. ASME. IMECE97, Advanced Energy Systems, 231-238, November 16–21, 1997

Paper No: IMECE1997-0993

DOI: https://doi.org/10.1115/IMECE1997-0993

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Topics: Cycles, Fuels, Thermoeconomics, Water, Compressors, Pressure, Alloys, Blades, Cooling, Economic analysis

Proceedings Papers

A Thermodynamic Analysis of Fever in Chemotraphs

K. Annamalai, T. Morris, D. McNichols

Proc. ASME. IMECE97, Advanced Energy Systems, 239-247, November 16–21, 1997

Paper No: IMECE1997-0994

DOI: https://doi.org/10.1115/IMECE1997-0994

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Topics: Blood flow, Combustion, Energy levels (Quantum mechanics), Exhaust systems, Food products, Heat, Heat losses, Oxidation, Skin, Sleep

Proceedings Papers

Thermodynamics of Insulated Pressure Vessels for Vehicular Hydrogen Storage

Salvador M. Aceves, Gene D. Berry

Proc. ASME. IMECE97, Advanced Energy Systems, 155-163, November 16–21, 1997

Paper No: IMECE1997-0985

DOI: https://doi.org/10.1115/IMECE1997-0985

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Topics: Hydrogen storage, Pressure vessels, Thermodynamics, Hydrogen, Temperature, Vessels, Automobiles, Fuels, Low temperature, Pressure

Proceedings Papers

Pool Boiling Heat Transfer Coefficients of Alternative Refrigerants

Dongsoo Jung, Chong-Bo Kim, Kil-Hong Song, Jun-Kang Lee

Proc. ASME. IMECE97, Advanced Energy Systems, 411-415, November 16–21, 1997

Paper No: IMECE1997-1014

DOI: https://doi.org/10.1115/IMECE1997-1014

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Topics: Heat transfer coefficients, Pool boiling, Refrigerants, Copper, Heat flux, Heat transfer, Nucleate pool boiling, Temperature

Proceedings Papers

Thermionic Cascade Converter Concept for High-Efficiency Space Power

Lester L. Begg, Thomas H. Van Hagan, Joe N. Smith, Jr.

Proc. ASME. IMECE97, Advanced Energy Systems, 59-63, November 16–21, 1997

Paper No: IMECE1997-0974

DOI: https://doi.org/10.1115/IMECE1997-0974

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Topics: Cascades (Fluid dynamics), Heat, Energy conversion, Temperature, Solar energy, Belts, Databases, Power systems (Machinery)

Proceedings Papers

An Analysis of the Major Variables Impacting Performance of Absorption Chillers and Heat Pumps

Keith E. Herold

Proc. ASME. IMECE97, Advanced Energy Systems, 349-356, November 16–21, 1997

Paper No: IMECE1997-1007

DOI: https://doi.org/10.1115/IMECE1997-1007

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Topics: Absorption, Heat pumps, Heat, Temperature, Cycles, Machinery, Heat transfer, Machine design, Modeling, Shapes

Proceedings Papers

150 Watt Portable Thermophotovoltaic Power Supply

Frederick E. Becker, Edward F. Doyle, Kailash C. Shukla

Proc. ASME. IMECE97, Advanced Energy Systems, 65-73, November 16–21, 1997

Paper No: IMECE1997-0975

DOI: https://doi.org/10.1115/IMECE1997-0975

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Topics: Ceramics, Defense industry, Design, Electricity (Physics), Energy conversion, Energy gap, Energy generation, Energy recovery, Engineering prototypes, Engines

Proceedings Papers

Ultrasonic Time-Frequency Characterization of Silicon Wafers at Elevated Temperatures

C. Steve Suh, G. Andrew Rabroker, Christian P. Burger, Ravinder Chona

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 37-43, November 16–21, 1997

Paper No: IMECE1997-1225

DOI: https://doi.org/10.1115/IMECE1997-1225

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Topics: Semiconductor wafers, Temperature, Waves, Acoustics, Fibers, Interferometers, Mechanical properties, Nondestructive evaluation, Splines, Thermomechanics

Proceedings Papers

Characterization of Plastic Packages Using (100) Silicon Stress Test Chips

Y. Zou, J. C. Suhling, R. C. Jaeger, S. T. Lin, L. Nguyen, S. A. Gee

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 15-21, November 16–21, 1997

Paper No: IMECE1997-1222

DOI: https://doi.org/10.1115/IMECE1997-1222

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Topics: Silicon, Stress, Finite element analysis, Temperature, Constitutive equations, Electronic packaging, Engineering simulation, Packaging, Sensors, Shear stress

Proceedings Papers

Advances in Stress Test Chips

Richard C. Jaeger, Jeffrey C. Suhling

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 1-5, November 16–21, 1997

Paper No: IMECE1997-1220

DOI: https://doi.org/10.1115/IMECE1997-1220

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Topics: Stress, Sensors, Silicon, Circuits, Electronic packages, Energy dissipation, Integrated circuits, Operating temperature, Reliability, Resistors

Proceedings Papers

Creep Behavior Study of Plastic Power Package by Real Time Moiré Interferometry and FEM Modeling

Daqing Zou, Jianjun Wang, Minfu Lu, Sheng Liu

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 51-57, November 16–21, 1997

Paper No: IMECE1997-1227

DOI: https://doi.org/10.1115/IMECE1997-1227

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Topics: Creep, Finite element methods, Finite element model, Interferometry, Modeling, Epoxy adhesives, Epoxy resins, Molding, Constitutive equations, Deformation

2 3 4 5

NARROW

Sequential Processing Mechanics Modeling for a Model IC Package

Material Constitutive Modeling Under High Strain Rates and Temperatures Through Orthogonal Machining Tests

A Continuum Mechanics Model to Predict Shear Angle and Cutting Forces in Orthogonal Cutting

White Layers and Thermal Modeling of Hard Turned Surfaces

Evaluation of Interfacial Fracture Toughness of a Bi-Material System Under Thermal Loading Conditions

Influence of the Clamping Mechanism on Tool Failure During Dry High Speed Machining

Transient and Steady-State Thermal Design Evaluation of a Carbon Monoxide Gas Sensor Using CFD Tool

Real Time Monitoring and Simulation of Thermal Deformation in Plastic Package

Finite Element Modeling and Photoelastic Analysis of an Integral Armor Under Flexural Loading

Hat Cycle Exergetic Analysis and Thermoeconomic Evaluation of Fuel Costs

A Thermodynamic Analysis of Fever in Chemotraphs

Thermodynamics of Insulated Pressure Vessels for Vehicular Hydrogen Storage

Pool Boiling Heat Transfer Coefficients of Alternative Refrigerants

Thermionic Cascade Converter Concept for High-Efficiency Space Power

An Analysis of the Major Variables Impacting Performance of Absorption Chillers and Heat Pumps

150 Watt Portable Thermophotovoltaic Power Supply

Ultrasonic Time-Frequency Characterization of Silicon Wafers at Elevated Temperatures

Characterization of Plastic Packages Using (100) Silicon Stress Test Chips

Advances in Stress Test Chips

Creep Behavior Study of Plastic Power Package by Real Time Moiré Interferometry and FEM Modeling

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