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Proceedings Papers

Sequential Processing Mechanics Modeling for a Model IC Package

Jianjun Wang, Sheng Liu
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 401-410, November 16–21, 1997
Paper No: IMECE1997-1117
DOI: https://doi.org/10.1115/IMECE1997-1117
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Topics: Modeling, Stress, Manufacturing, Solders, Temperature, Finite element analysis, Finite element methods, Finite element model, Silicon chips, Bonding
Proceedings Papers

A Thermomechanical Model of Machine Tool Spindles for Use in the Design of Reconfigurable Angular Contact Spindle Bearing Load Control Systems

Alex O. Gibson, Jeffrey L. Stein, Jay F. Tu
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 23-30, November 16–21, 1997
Paper No: IMECE1997-1071
DOI: https://doi.org/10.1115/IMECE1997-1071
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Topics: Bearings, Control systems, Design, Machine tool spindles, Stress, Thermomechanics, Roller bearings, Thermal expansion, Centrifugal force, Deflection
Proceedings Papers

A Multi-Purpose Laser Sensor for Cutting Tools

Oleg Ryabov, Kazuo Mori, Nagayoshi Kasashima
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 9-14, November 16–21, 1997
Paper No: IMECE1997-1069
DOI: https://doi.org/10.1115/IMECE1997-1069
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Topics: Cutting tools, Lasers, Sensors, Milling, Displacement, Geometry, Chatter, Engineering prototypes, Failure, Laser beams
Proceedings Papers

In Process Stress Analysis of Flip Chip Assemblies During Underfill Cure

Prema Palaniappan, Daniel F. Baldwin
Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 7-14, November 16–21, 1997
Paper No: IMECE1997-1221
DOI: https://doi.org/10.1115/IMECE1997-1221
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Topics: Density, Electronics, Flip-chip, Flip-chip assemblies, Flip-chip devices, Fracture (Materials), Fracture (Process), Glass transition, Manufacturing, Printed circuit boards
Proceedings Papers

Nanoscale Thermometry Using Scanning Joule Expansion Microscopy

Arun Majumdar, John Varesi
Proc. ASME. IMECE97, Microelectromechanical Systems (MEMS), 171-179, November 16–21, 1997
Paper No: IMECE1997-0955
DOI: https://doi.org/10.1115/IMECE1997-0955
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Topics: Joules, Microscopy, Nanoscale phenomena, Temperature measurement, Atomic force microscopy, Imaging, Metals, Resolution (Optics), Signals, Temperature distribution
Proceedings Papers

Some Mechanics Issues Related to the Thermomechanical Reliability of Flip Chip DCA With Underfill Encapsulation

Carole A. Le Gall, Jianmin Qu, David L. McDowell
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 85-95, November 16–21, 1997
Paper No: IMECE1997-0503
DOI: https://doi.org/10.1115/IMECE1997-0503
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Topics: Flip-chip, Flip-chip devices, Reliability, Thermomechanics, Stress, Creep, Dimensions, Elasticity, Flip-chip assemblies, Geometry
Proceedings Papers

Shearing Deformation in Partial Areal Arrays: Analytical Results

S. M. Heinrich, S. Shakya, P. S. Lee
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 51-59, November 16–21, 1997
Paper No: IMECE1997-0500
DOI: https://doi.org/10.1115/IMECE1997-0500
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Topics: Boundary-value problems, Corners (Structural elements), Die cutting, Dimensions, Displacement, Elasticity, Fatigue life, Finite element analysis, Finite element model, Geometry
Proceedings Papers

Effect of Thermal Residual Stress on the Measurement of the Adhesion Between Polyimide and Underfill Using an Asymmetric Double Cantilever Beam Specimen

Jinbao Jiao, Charan K. Gurumurthy, Edward J. Kramer, Yan Sha, Chung-Yuen Hui, Peter Børgesen
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 97-102, November 16–21, 1997
Paper No: IMECE1997-0504
DOI: https://doi.org/10.1115/IMECE1997-0504
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Topics: Adhesion, Cantilever beams, Stress, Epoxy adhesives, Epoxy resins, Fracture (Materials), Fracture (Process), Ethers (Class of compounds), Thermal expansion
Proceedings Papers

Stress Analysis of High Density Bare Chip Packaging Technologies

Yutaka Tsukada, Shogo Mizumoto, Yasuyuki Kodama, Hideo Nishimura
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 49-50, November 16–21, 1997
Paper No: IMECE1997-0499
DOI: https://doi.org/10.1115/IMECE1997-0499
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Topics: Density, Packaging, Stress analysis (Engineering), Epoxy adhesives, Epoxy resins, Ceramics, Ball-Grid-Array packages, Ball-Grid-Array packaging, Electronic packaging, Flip-chip
Proceedings Papers

Toughening of High Performance Epoxy Adhesives Using Core-Shell Particles

Hung-Jue Sue, P. Mac Puckett, Yee Y. Wang
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 163-168, November 16–21, 1997
Paper No: IMECE1997-0512
DOI: https://doi.org/10.1115/IMECE1997-0512
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Topics: Epoxy adhesives, Particulate matter, Shells, Rubber, Adhesives, Elastic moduli, Fracture toughness, Glass transition, Materials properties, Shear (Mechanics)
Proceedings Papers

Failure Analysis of P75 Graphite/934 Epoxy Composites Subjected to Thermal and Mechanical Loads

P. Atherton, A. Saigal, R. Greif
Proc. ASME. IMECE97, Recent Advances in Solids/Structures and Application of Metallic Materials, 155-165, November 16–21, 1997
Paper No: IMECE1997-0532
DOI: https://doi.org/10.1115/IMECE1997-0532
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Topics: Composite materials, Epoxy adhesives, Epoxy resins, Failure analysis, Graphite, Stress, Failure, Finite element analysis, Residual stresses, Fibers
Proceedings Papers

Microstructure and Residual Stresses in FGMs

Antonios Zavaliangos
Proc. ASME. IMECE97, Composites and Functionally Graded Materials, 57-64, November 16–21, 1997
Paper No: IMECE1997-0651
DOI: https://doi.org/10.1115/IMECE1997-0651
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Topics: Residual stresses, Hydrostatic pressure, Thermal expansion
Proceedings Papers

Thermal Shape Control of Active and Sensory Piezoelectric Composite Plates

Ho-Jun Lee, Dimitris A. Saravanos
Proc. ASME. IMECE97, Analysis and Design Issues for Modern Aerospace Vehicles, 249-257, November 16–21, 1997
Paper No: IMECE1997-0726
DOI: https://doi.org/10.1115/IMECE1997-0726
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Topics: Composite materials, Plates (structures), Shapes, Temperature effects, Epoxy adhesives, Epoxy resins, Finite element analysis, Graphite, Laminates, Piezoelectric ceramics
Proceedings Papers

Thermal Expansion Behavior of Ceramic Composites for Thermal Management Applications

Yu-Lin Shen
Proc. ASME. IMECE97, Composites and Functionally Graded Materials, 385-392, November 16–21, 1997
Paper No: IMECE1997-0689
DOI: https://doi.org/10.1115/IMECE1997-0689
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Topics: Ceramic composites, Thermal expansion, Thermal management, Composite materials, Particulate matter, Computer simulation, Deformation, Finite element methods, Micromechanical devices, Porosity
Proceedings Papers

Stress Dependency of the Thermoelastic and Piezoelectric Coefficients

Charles W. Bert, Victor Birman
Proc. ASME. IMECE97, Analysis and Design Issues for Modern Aerospace Vehicles, 265-269, November 16–21, 1997
Paper No: IMECE1997-0728
DOI: https://doi.org/10.1115/IMECE1997-0728
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Topics: Stress, Thermoelasticity, Temperature, Thermal expansion, Thermodynamics
Proceedings Papers

Free Vibration Analysis of Composite Plates With Tailored Thermal Residual-Stresses

Sérgio Frascino Müller de Almeida, Jorn S. Hansen
Proc. ASME. IMECE97, Analysis and Design Issues for Modern Aerospace Vehicles, 183-190, November 16–21, 1997
Paper No: IMECE1997-0721
DOI: https://doi.org/10.1115/IMECE1997-0721
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Topics: Composite materials, Free vibrations, Plates (structures), Residual stresses, Manufacturing, Elasticity, Finite element analysis, Laminates, Membranes, Operating temperature
Proceedings Papers

Experimental Observation of Fatigue-Creep Fracture Development in Solder Joints of Different Standoffs

D. R. Liu
Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 249-259, November 16–21, 1997
Paper No: IMECE1997-0824
DOI: https://doi.org/10.1115/IMECE1997-0824
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Topics: Creep, Fatigue, Fracture (Materials), Fracture (Process), Solder joints, Temperature, Printed circuit boards, Damage, Melting, Separation (Technology)
Proceedings Papers

Thermoelastic Behavior of Filled Molding Compounds: Composite Mechanics Approach

M. Uschitsky, E. Suhir, G. W. Kammlott
Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 171-206, November 16–21, 1997
Paper No: IMECE1997-0819
DOI: https://doi.org/10.1115/IMECE1997-0819
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Topics: Composite materials, Molding, Thermoelasticity, Fillers (Materials), Thermal stresses, Epoxy adhesives, Epoxy resins, Design, Integrated circuits, Reliability
Proceedings Papers

Structural Integrity of Optical Fibers in Connectors

Wilton W. King, Bruce G. LeFevre, A. Guy Hardee
Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 261-269, November 16–21, 1997
Paper No: IMECE1997-0825
DOI: https://doi.org/10.1115/IMECE1997-0825
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Topics: Epoxy adhesives, Epoxy resins, Fibers, Finite element analysis, Fracture (Materials), Fracture (Process), Optical fiber, Reliability, Stress analysis (Engineering), Structural analysis
Proceedings Papers

A Constrained Thermal Expansion Micro-Actuator

Rebecca Cragun, Larry L. Howell
Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 365-371, November 15–20, 1998
Paper No: IMECE1998-1270
DOI: https://doi.org/10.1115/IMECE1998-1270
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Topics: Microactuators, Thermal expansion, Actuators, Compliant mechanisms, Cycles, Deflection, Finite element analysis, Polysilicon, Visualization