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Proceedings Papers

Constitutive Modeling of Polymer Films From Viscoelasticity to Viscoplasticity

Zhengfang Qian, Minfu Lu, Sheng Liu

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 377-382, November 16–21, 1997

Paper No: IMECE1997-1113

DOI: https://doi.org/10.1115/IMECE1997-1113

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Topics: Modeling, Polymer films, Viscoelasticity, Viscoplasticity, Deformation, Stress, Chain, Constitutive equations, Drag (Fluid dynamics), Temperature effects

Proceedings Papers

Some Mechanics Issues Related to the Thermomechanical Reliability of Flip Chip DCA With Underfill Encapsulation

Carole A. Le Gall, Jianmin Qu, David L. McDowell

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 85-95, November 16–21, 1997

Paper No: IMECE1997-0503

DOI: https://doi.org/10.1115/IMECE1997-0503

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Topics: Flip-chip, Flip-chip devices, Reliability, Thermomechanics, Stress, Creep, Dimensions, Elasticity, Flip-chip assemblies, Geometry

Proceedings Papers

Observation and Prediction of Damage Evolution in Continuous Fiber Titanium Matrix Composites

David H. Allen, James W. Foulk, III, Kayleen L. E. Helms

Proc. ASME. IMECE97, Composites and Functionally Graded Materials, 109-116, November 16–21, 1997

Paper No: IMECE1997-0655

DOI: https://doi.org/10.1115/IMECE1997-0655

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Topics: Composite materials, Damage, Fibers, Titanium, Embrittlement, Failure, Crack propagation, Cracking (Materials), Fatigue, Fracture (Process)

Proceedings Papers

Effect of Deformation-Induced Change of Fiber Orientation on Nonlinear Behavior of Polymeric Composite Laminates

C. T. Sun, C. Zhu

Proc. ASME. IMECE98, Mechanical Behavior of Advanced Materials, 247-248, November 15–20, 1998

Paper No: IMECE1998-1191

DOI: https://doi.org/10.1115/IMECE1998-1191

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Topics: Deformation, Fibers, Laminates, Polymer composites, Hardening (Curing), Stress, Composite materials, Plate theory, Damage, Delamination

Proceedings Papers

Selected Elements of Thermomechanics for Constitutive Equations

Richard B. Hall

Proc. ASME. IMECE98, Mechanical Behavior of Advanced Materials, 191, November 15–20, 1998

Paper No: IMECE1998-1168

DOI: https://doi.org/10.1115/IMECE1998-1168

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Topics: Constitutive equations, Thermomechanics, Damage mechanics, Deformation, Elasticity, Viscoelasticity, Viscoplasticity

Proceedings Papers

Failure Analysis of Miniature Solder Specimen

Y. Wei, C. L. Chow, H. E. Fang, M. K. Neilsen, T. J. Lim, W. Lu

Proc. ASME. IMECE2001, Packaging, Reliability and Manufacturing Issues Associated With Electronic and Photonic Products, 243-249, November 11–16, 2001

Paper No: IMECE2001/EPP-24731

DOI: https://doi.org/10.1115/IMECE2001/EPP-24731

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Topics: Failure analysis, Solders, Damage, Engineering simulation, Simulation, Finite element analysis, Tension, ASTM International, ASTM standards, Constitutive equations

Proceedings Papers

Constitutive Modeling of Multiaxial Deformation and Induced Anisotropy in Superplastic Materials

Marwan K. Khraisheh

Proc. ASME. IMECE2000, Recent Trends in Constitutive Modeling of Advanced Materials, 79-94, November 5–10, 2000

Paper No: IMECE2000-1196

DOI: https://doi.org/10.1115/IMECE2000-1196

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Topics: Anisotropy, Deformation, Modeling, Superplasticity, Particle spin, Rotation, Spin (Aerodynamics), Alloys, Stress, Tin

Proceedings Papers

Anand Viscoplasticity Model for the Effect of Aging on Mechanical Behavior of SAC305 Operating at High Strain Rate and High Temperature

Pradeep Lall, Di Zhang, Jeff Suhling, David Locker

Proc. ASME. IMECE2015, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A023, November 13–19, 2015

Paper No: IMECE2015-53751

DOI: https://doi.org/10.1115/IMECE2015-53751

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Topics: High temperature, Mechanical behavior, Viscoplasticity, Solders, Temperature, Deformation, Operating temperature, Storage, Electronics, Constitutive equations

Proceedings Papers

High Strain-Rate Constitutive Behavior of SAC305 Solder During Operation at High Temperature

Pradeep Lall, Di Zhang, Vikas Yadav

Proc. ASME. IMECE2014, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A069, November 14–20, 2014

Paper No: IMECE2014-39518

DOI: https://doi.org/10.1115/IMECE2014-39518

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Topics: High temperature, Solders, Temperature, Deformation, Lead-free solders, Alloys, Chemical properties, Constitutive equations, Electronic components, Electronic packaging

Proceedings Papers

The Rate (Time)–Dependent Mechanical Behavior of the PMR-15 Thermoset Polymer at Temperatures in the 274–316 °C Range: Experiments and Modeling

C. E. C. Ryther, M. B. Ruggles-Wrenn

Proc. ASME. IMECE2011, Volume 8: Mechanics of Solids, Structures and Fluids; Vibration, Acoustics and Wave Propagation, 61-70, November 11–17, 2011

Paper No: IMECE2011-63117

DOI: https://doi.org/10.1115/IMECE2011-63117

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Topics: Creep, High temperature, Mechanical behavior, Modeling, Polymers, Relaxation (Physics), Stress, Temperature, Viscoplasticity, Deformation

Proceedings Papers

A Viscoplasticity Model for Solder Alloys

Yongchang Lee, Cemal Basaran

Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 309-316, November 12–18, 2010

Paper No: IMECE2010-37106

DOI: https://doi.org/10.1115/IMECE2010-37106

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Topics: Alloys, Solders, Viscoplasticity, Creep, Stress, Diffusion processes, Dislocation motion, Electronic packaging, Grain size, Reliability

Proceedings Papers

Coexistense of Creep and Transformation in High Temperature Shape Memory Alloys

Dimitris C. Lagoudas, George Chatzigeorgiou, Darren J. Hartl, Parikshith K. Kumar

Proc. ASME. IMECE2009, Volume 12: Micro and Nano Systems, Parts A and B, 45-51, November 13–19, 2009

Paper No: IMECE2009-11718

DOI: https://doi.org/10.1115/IMECE2009-11718

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Topics: Creep, High temperature, Shape memory alloys, Phase transitions, Actuators, Calibration, Constitutive equations, Metals, Viscoplasticity

Proceedings Papers

Relaxation Investigation for Terminals of Electronic Connectors Under Thermal Shock Test

K.-C. Liao, K.-H. Lin

Proc. ASME. IMECE2007, Volume 5: Electronics and Photonics, 391-395, November 11–15, 2007

Paper No: IMECE2007-43340

DOI: https://doi.org/10.1115/IMECE2007-43340

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Topics: Relaxation (Physics), Thermal shock, Electrical resistance, Creep, Cycles, Temperature, Bronze, Finite element analysis, Numerical analysis, Phosphors

Proceedings Papers

Multi-Scale Analysis of Deformation and Failure of Superplastic Materials

Marwan Khraisheh, Naveen Thuramalla, Fadi Abu-Farha, Pushkarraj Deshmukh

Proc. ASME. IMECE2003, Applied Mechanics and Biomedical Technology, 137, November 15–21, 2003

Paper No: IMECE2003-43355

DOI: https://doi.org/10.1115/IMECE2003-43355

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Topics: Deformation, Failure, Superplasticity, Stability, Cavitation, Anisotropy, Finite element analysis, Flow (Dynamics), Grain size, Porosity

Proceedings Papers

Finite Element Implementation of a Thermoviscoplastic Model for Ratcheting

Rashid K. Abu Al-Rub, George Z. Voyiadjis

Proc. ASME. IMECE2004, Applied Mechanics, 37-45, November 13–19, 2004

Paper No: IMECE2004-61734

DOI: https://doi.org/10.1115/IMECE2004-61734

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Topics: Finite element analysis, Hardening, Kinematics, Temperature, Algorithms, Constitutive equations, Work hardening, Damage, Finite element methods, Flow (Dynamics)

Proceedings Papers

Experimental and Numerical Evaluation of SnAgCu and SnPb Solders Using a MicroBGA Under Accelerated Temperature Cycling Conditions

Bryan Rodgers, Jeff Punch, Claire Ryan, Finbarr Waldron, Liam Floyd

Proc. ASME. IMECE2004, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 153-159, November 13–19, 2004

Paper No: IMECE2004-59684

DOI: https://doi.org/10.1115/IMECE2004-59684

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Topics: Solders, Temperature, Cycles, Fatigue life, Lead-free solders, Vehicles, Ball-Grid-Array packaging, Chain, Failure, Fatigue

Proceedings Papers

Comparison of the Strain Localization Approaches: Viscoplasticity Theory and Gradient Dependent Theory

George Z. Voyiadjis, Rashid K. Abu Al-Rub

Proc. ASME. IMECE2005, Applied Mechanics, 79-87, November 5–11, 2005

Paper No: IMECE2005-81424

DOI: https://doi.org/10.1115/IMECE2005-81424

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Topics: Viscoplasticity

NARROW

Constitutive Modeling of Polymer Films From Viscoelasticity to Viscoplasticity

Some Mechanics Issues Related to the Thermomechanical Reliability of Flip Chip DCA With Underfill Encapsulation

Observation and Prediction of Damage Evolution in Continuous Fiber Titanium Matrix Composites

Effect of Deformation-Induced Change of Fiber Orientation on Nonlinear Behavior of Polymeric Composite Laminates

Selected Elements of Thermomechanics for Constitutive Equations

Failure Analysis of Miniature Solder Specimen

Constitutive Modeling of Multiaxial Deformation and Induced Anisotropy in Superplastic Materials

Anand Viscoplasticity Model for the Effect of Aging on Mechanical Behavior of SAC305 Operating at High Strain Rate and High Temperature

High Strain-Rate Constitutive Behavior of SAC305 Solder During Operation at High Temperature

The Rate (Time)–Dependent Mechanical Behavior of the PMR-15 Thermoset Polymer at Temperatures in the 274–316 °C Range: Experiments and Modeling

A Viscoplasticity Model for Solder Alloys

Coexistense of Creep and Transformation in High Temperature Shape Memory Alloys

Relaxation Investigation for Terminals of Electronic Connectors Under Thermal Shock Test

Multi-Scale Analysis of Deformation and Failure of Superplastic Materials

Finite Element Implementation of a Thermoviscoplastic Model for Ratcheting

Experimental and Numerical Evaluation of SnAgCu and SnPb Solders Using a MicroBGA Under Accelerated Temperature Cycling Conditions

Comparison of the Strain Localization Approaches: Viscoplasticity Theory and Gradient Dependent Theory

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