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Keywords: coefficient of thermal expansion (CTE)
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Proceedings Papers

Proc. ASME. IMECE2006, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 91-99, November 5–10, 2006
Paper No: IMECE2006-13745
... coefficient of thermal expansion (CTE) for those SnAgCu lead free alloys were measured in the temperature range of - 40 to 160°C using thermo-mechanical analyzer (TMA). The tensile and shear properties of 95.5Sn3.8Ag0.7Cu solder and solder joint specimens are highly dependent on test temperature and strain...