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Keywords: electronic packaging
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Proceedings Papers

Proc. ASME. IMECE2001, Packaging, Reliability and Manufacturing Issues Associated With Electronic and Photonic Products, 251-256, November 11–16, 2001
Paper No: IMECE2001/EPP-24732
... and manufacturability expectations. In addition, reliability and durability have to be taken into consideration. As a consequence, some of the most sophisticated analytical, computational, and experimental methods are being used for development, optimization, and quantitative characterization of electronic packages...
Proceedings Papers

Proc. ASME. IMECE2001, Packaging, Reliability and Manufacturing Issues Associated With Electronic and Photonic Products, 201-205, November 11–16, 2001
Paper No: IMECE2001/EPP-24725
... to simulate thermal effects produced, describe facilities used, present results, and summarize correlations between the experimental and computational data for applications in electronic packaging. Proceedings of 2001 ASME International Mechanical Engineering Congress and Exposition November 11-16,2001...
Proceedings Papers

Proc. ASME. IMECE2001, Packaging, Reliability and Manufacturing Issues Associated With Electronic and Photonic Products, 271-275, November 11–16, 2001
Paper No: IMECE2001/EPP-24735
..., allowing 100% material utilization, present its design, including analysis and process optimization, and summarize its characteristics as they relate to electronic packaging. Proceedings of 2001 ASME International Mechanical Engineering Congress and Exposition November 11-16,2001, New York, NY EPP-Vol...
Proceedings Papers

Proc. ASME. IMECE2001, Packaging, Reliability and Manufacturing Issues Associated With Electronic and Photonic Products, 213-217, November 11–16, 2001
Paper No: IMECE2001/EPP-24727
...Abstract Abstract Integration of Shape Memory Alloys (SMAs) with electronic packaging depends on detailed knowledge of thermomechanical behavior of SMAs. In this paper, thermomechanical behavior of SMAs is studied using a new approach based on Analytical, Computational, and Experimental...
Proceedings Papers

Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 249-254, November 17–22, 2002
Paper No: IMECE2002-39508
... 23 05 2008 With the microelectronics industry being one of the most dynamic, in terms of new technologies, electronic packages have to be designed and optimized for new and ever more demanding applications in relatively short periods of time. In addition, for certain applications...
Proceedings Papers

Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 173-179, November 17–22, 2002
Paper No: IMECE2002-39492
... of advanced design, analysis, and fabrication methodologies, and also of quantitative metrology techniques for characterizing their performance, reliability, and integrity during the electronic packaging cycle. In this paper, we describe optoelectronic techniques for measuring, with sub-micrometer accuracy...
Proceedings Papers

Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 71-77, November 15–21, 2003
Paper No: IMECE2003-41844
..., accurate and generic ethodology for ranking the impact durability of different urface mount interconnects technologies. Keywords: Drop testing; Impact testing, Interconnect amage, Electronic Packaging. impact durability is left to the discretion of the manufacturer. Broadly classified, portable impact...
Proceedings Papers

Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 9-17, November 15–21, 2003
Paper No: IMECE2003-41753
... occurs at the contact interface between the compliant interconnect tip and the bonding pad. This contact interface is studied using analytical and numerical models to understand the reliability of freestanding sliding-contact compliant interconnect assembly. Electronic packaging stress engineering...