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Keywords: solder
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Proceedings Papers
Proc. ASME. IMECE2001, Packaging, Reliability and Manufacturing Issues Associated With Electronic and Photonic Products, 193-200, November 11–16, 2001
Paper No: IMECE2001/EPP-24724
... University of Arkansas, Fayetteville, AR 72701 * Contact Information: Tel (501) 575-6561 / E-mail apm2@engr.uark.edu Keywords: high power semiconductor laser diode, die attach, solder, reliability, thermomechanical stress ABSTRACT microscopic defect analyses were carried out using primarily metallography...
Proceedings Papers
Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 329-335, November 17–22, 2002
Paper No: IMECE2002-39676
... 23 05 2008 Various constitutive and fatigue-life predictive models for lead-tin solders in SBGA (Super Ball Grid Array) packages are studied and compared with the results from experimental data. Two solder compositions, 62Sn/36Pb/2Ag and 63Sn/37Pb are studied in this work. The fatigue...
Proceedings Papers
Proc. ASME. IMECE2006, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 271-280, November 5–10, 2006
Paper No: IMECE2006-13584
... at the interface increases with decreasing interfacial roughness. This could explain why one observes failure site transition from the solder to the intermetallic layer during flexural loading of aged specimens. solder flexure aging failure site transition intermetallic layer interfacial fracture...
Proceedings Papers
Proc. ASME. IMECE2006, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 91-99, November 5–10, 2006
Paper No: IMECE2006-13745
... 18 01 2008 Reinikainen, T., Marjama¨ki, O., Kivilahti, P., J., K., “Deformation Characteristics and Microstructural Evolution of SnAgCu Solder Joints” IEEE EuroSimE, Germany, Apr, 2005. Instron Microtester reference manual TM Reinikainen, T., O., and Ren, W., “An Optimized...
Proceedings Papers
Proc. ASME. IMECE2006, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 177-181, November 5–10, 2006
Paper No: IMECE2006-13615
... Accelerated Thermal Cycling (ATC) is traditionally used for assessing solder joint reliability. ATC typically takes as long as three to four months to complete. This paper proposes a new method to determine the fatigue life of solder joints using laser moire´ technique. The developed method...
