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Keywords: solder martial properties
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Proceedings Papers
Proc. ASME. IMECE2006, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 91-99, November 5–10, 2006
Paper No: IMECE2006-13745
... with tin-lead solder. The steady-state creep test data for 95.53.8Ag0.7Cu solder was curve-fitted to a hyperbolic-sine creep model. The material constitutive parameters developed are in line with similar studies. Keywords: Lead-Free solder; solder martial properties, solder, coefficient of thermal...
