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Keywords: wiresaw
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Proceedings Papers
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 369-376, November 16–21, 1997
Paper No: IMECE1997-1112
... Abstract In this paper, a modified shadow moiré technique is applied to measure surface topology of wafers. When a wafer is sliced, either by an inner-diameter (ID) saw or wiresaw, the surface needs to be measured to ensure the consistency of quality. Two important characteristics of the wafer...
