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Proceedings Papers

Optimal Design and Modeling of Server Cabinets With In-Row Coolers and Air Conditioning Units in a Modular Data Center

Uschas Chowdhury, Walter Hendrix, Thomas Craft, Willis James, Ankit Sutaria, Dereje Agonafer

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A009, October 7–9, 2019

Paper No: IPACK2019-6522

DOI: https://doi.org/10.1115/IPACK2019-6522

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Topics: Air conditioning, Containment, Coolers, Data centers, Design, Modeling

Proceedings Papers

Parametric Study of Silicon-Based Embedded Microchannels With 3D Manifold Coolers (EMMC) for High Heat Flux (~1 kW/cm 2 ) Power Electronics Cooling

Ki Wook Jung, Sougata Hazra, Heungdong Kwon, Alisha Piazza, Edward Jih, Mehdi Asheghi, Man Prakash Gupta, Mike Degner, Kenneth E. Goodson

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A021, October 7–9, 2019

Paper No: IPACK2019-6472

DOI: https://doi.org/10.1115/IPACK2019-6472

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Topics: Computational fluid dynamics, Computer cooling, Coolers, Heat flux, Manifolds, Microchannels, Silicon, Water

Proceedings Papers

Orientation Effects in Two-Phase Microgap Flow

Franklin L. Robinson, Avram Bar-Cohen

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A015, August 27–30, 2018

Paper No: IPACK2018-8383

DOI: https://doi.org/10.1115/IPACK2018-8383

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Topics: Flow (Dynamics), Gravity (Force), Coolers, Boiling, Cooling, Flux (Metallurgy), Heat, Aircraft, Fluids, Gravitational acceleration

Proceedings Papers

Steady State and Transient Comparison of Perimeter and Row-Based Cooling Employing Controlled Cooling Curves

Husam A. Alissa, Kourosh Nemati, Bahgat Sammakia, Alfonso Ortega, David King, Mark Seymour, Russell Tipton

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A017, July 6–9, 2015

Paper No: IPACK2015-48237

DOI: https://doi.org/10.1115/IPACK2015-48237

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Topics: Cooling, Steady state, Transients (Dynamics), Data centers, Containment, Air flow, Coolers, Failure, Flow (Dynamics), Computational fluid dynamics

Proceedings Papers

Comparative Analysis of Different In Row Cooler Management Configurations in a Hybrid Cooling Data Center

Tianyi Gao, Bahgat G. Sammakia, James Geer, Bruce Murray, Russell Tipton, Roger Schmidt

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A011, July 6–9, 2015

Paper No: IPACK2015-48069

DOI: https://doi.org/10.1115/IPACK2015-48069

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Topics: Cooling, Data centers, Coolers, Energy consumption, Cooling systems, Density, Heat, Temperature, Coal, Computational fluid dynamics

Proceedings Papers

Numerical and Experimental Characterization of the Transient Effectiveness of a Water to Air Heat Exchanger for Data Center Cooling Systems

Tianyi Gao, Marcelo del Valle, Alfonso Ortega, Bahgat G. Sammakia

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A043, July 6–9, 2015

Paper No: IPACK2015-48377

DOI: https://doi.org/10.1115/IPACK2015-48377

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Topics: Cooling systems, Data centers, Experimental characterization, Heat exchangers, Transients (Dynamics), Water, Computer simulation, Flow (Dynamics), Temperature, Coolers

Proceedings Papers

Performance and Integration Implications of Addressing Localized Hotspots Through Two Approaches: Clustering of Micro Pin-Fins and Dedicated Microgap Coolers

Craig E. Green, Peter A. Kottke, Thomas E. Sarvey, Andrei G. Fedorov, Yogendra Joshi, Muhannad S. Bakir

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A056, July 6–9, 2015

Paper No: IPACK2015-48537

DOI: https://doi.org/10.1115/IPACK2015-48537

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Topics: Coolers, Fins, Computer simulation, Cooling, Density, Flow (Dynamics), Flux (Metallurgy), Heat, Coolants, Design

Proceedings Papers

Embedded Cooling of High Heat Flux Electronics Utilizing Distributed Microfluidic Impingement Jets

John Ditri, Joseph Hahn, Roland Cadotte, Michael McNulty, Denise Luppa

Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A014, July 6–9, 2015

Paper No: IPACK2015-48689

DOI: https://doi.org/10.1115/IPACK2015-48689

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Topics: Cooling, Electronics, Heat flux, Jets, Microfluidics, Simulation, Computational fluid dynamics, Reliability, Coolers, Cooling systems

Proceedings Papers

Advanced Cooling Designs for GaN-on-Diamond MMICs

Geoffrey Campbell, Henry Eppich, Keith Lang, Carlton Creamer, Thomas Yurovchak, Kanin Chu, Adonis Kassinos, Michael Ohadi, Amir Shooshtari, Serguei Dessiatoun

Paper No: IPACK2015-48429

DOI: https://doi.org/10.1115/IPACK2015-48429

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Topics: Cooling, Diamonds, Gallium nitride, Temperature, Coolers, Microchannels, Thermal resistance, Cooling systems, Design, Engineering prototypes

Proceedings Papers

Reliable Integration of Microchannel Coolers for Power Electronics

David Squiller, Sumeer Khanna, Serguei Dessiatoun, Raphael Mandel, Michael Ohadi, Patrick McCluskey

Paper No: IPACK2015-48757

DOI: https://doi.org/10.1115/IPACK2015-48757

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Topics: Coolers, Electronics, Microchannels, Corrosion, Electronic packages, Electronic systems, Erosion, Failure mechanisms, Fracture (Materials), Fracture (Process)

Proceedings Papers

Micro Cryogenic Coolers With Mixed Refrigerants

Ryan Lewis, Yunda Wang, Paul Schroeder, Collin Coolidge, Ray Radebaugh, Y. C. Lee

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T06A005, July 16–18, 2013

Paper No: IPACK2013-73290

DOI: https://doi.org/10.1115/IPACK2013-73290

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Topics: Coolers, Refrigerants, Microelectromechanical systems, Flow (Dynamics), Heat exchangers, Low temperature, Microchannel flow, Pressure, Temperature, Valves

Proceedings Papers

Design of High Packing Fraction Thermoelectric Modules for High Heat Flux Cooling

Ram Ranjan, Joseph E. Turney, Chuck E. Lents

Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A016, July 16–18, 2013

Paper No: IPACK2013-73073

DOI: https://doi.org/10.1115/IPACK2013-73073

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Topics: Cooling, Design, Heat flux, Packing (Shipments), Packings (Cushioning), Heat, Coolers, Electric current, Flux (Metallurgy), Heating

Proceedings Papers

Advanced Liquid Cooling Technology Evaluation for High Power CPUs and GPUs

Ridvan A. Sahan, Rahima K. Mohammed, Amy Xia, Ying-Feng Pang

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 311-318, July 6–8, 2011

Paper No: IPACK2011-52225

DOI: https://doi.org/10.1115/IPACK2011-52225

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Topics: Cooling, Graphics processing units, Diamonds, Fins, Water, Design, Flow (Dynamics), Coolers, Electrolytic corrosion, Metals

Proceedings Papers

Thermal Imaging of Two-Phase Coooled Microgap Channel Wall

Jessica Sheehan, Dae Whan Kim, Avram Bar-Cohen

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 491-499, July 19–23, 2009

Paper No: InterPACK2009-89238

DOI: https://doi.org/10.1115/InterPACK2009-89238

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Topics: Absorption, Coolers, Cooling, Dielectric liquids, Electronic components, Flow (Dynamics), Flux (Metallurgy), Heat, Heat flux, Imaging

Proceedings Papers

Optimization of Cold Aisle Isolation Designs for a Data Center With Roofs and Doors Using Slits

Srujan Gondipalli, Bahgat Sammakia, Siddarth Bhopte, Roger Schmidt, Madhusudan K. Iyengar, Bruce Murray

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 841-850, July 19–23, 2009

Paper No: InterPACK2009-89203

DOI: https://doi.org/10.1115/InterPACK2009-89203

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Topics: Data centers, Doors, Optimization, Roofs, Temperature, Air flow, Ceilings, Heat, Computers, Coolers

Proceedings Papers

Evaluation on Use of Thermoelectric Devices for Electronics Cooling

H. Peter J. De Bock, Tunc Icoz

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 199-203, July 8–12, 2007

Paper No: IPACK2007-33154

DOI: https://doi.org/10.1115/IPACK2007-33154

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Topics: Computer cooling, Thermoelectric devices, Cooling, Electronics, Thermoelectric cooling, Heat, Temperature, Coolers, Heat flux

Proceedings Papers

Thermofluid Characteristics of Two-Phase Microgap Coolers

Dae W. Kim, Emil Rahim, Avram Bar-Cohen, Bongtae Han

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 389-398, July 8–12, 2007

Paper No: IPACK2007-33927

DOI: https://doi.org/10.1115/IPACK2007-33927

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Topics: Coolers, Thermofluids, Boiling, Flow (Dynamics), Water, Heat transfer, Computer simulation, Pressure drop

Proceedings Papers

Partially Decoupled Aisle Method for Estimating Rack-Cooling Performance in Near-Real Time

James W. VanGilder, Xuanhang Zhang, Saurabh K. Shrivastava

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 781-789, July 8–12, 2007

Paper No: IPACK2007-33447

DOI: https://doi.org/10.1115/IPACK2007-33447

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Topics: Cooling, Computational fluid dynamics, Air flow, Boundary-value problems, Coolers, Computer software, Data centers, Engineering simulation, Engines, Simulation

Proceedings Papers

Optimization of Bulk Thermoelectric Modules for Chip Cooling Applications

Kazuhiko Fukutani, Ali Shakouri

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 2179-2183, July 17–22, 2005

Paper No: IPACK2005-73410

DOI: https://doi.org/10.1115/IPACK2005-73410

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Topics: Cooling, Optimization, Thermal resistance, Energy dissipation, Power density, Circuits, Coolers, Geometry, Heat, Integrated circuits

Proceedings Papers

Experimental Characterization of Bonded Microcoolers for Hot Spot Removal

Yan Zhang, Gehong Zeng, Christine Hoffman, Ali Shakouri, Peng Wang, Avram Bar-Cohen

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 2189-2197, July 17–22, 2005

Paper No: IPACK2005-73466

DOI: https://doi.org/10.1115/IPACK2005-73466

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Topics: Experimental characterization, Microcoolers, Cooling, Coolers, Flow (Dynamics), Heat, Heat flux, Integrated circuits, Microelectronic devices, Power density

NARROW

Optimal Design and Modeling of Server Cabinets With In-Row Coolers and Air Conditioning Units in a Modular Data Center

Parametric Study of Silicon-Based Embedded Microchannels With 3D Manifold Coolers (EMMC) for High Heat Flux (~1 kW/cm 2 ) Power Electronics Cooling

Orientation Effects in Two-Phase Microgap Flow

Steady State and Transient Comparison of Perimeter and Row-Based Cooling Employing Controlled Cooling Curves

Comparative Analysis of Different In Row Cooler Management Configurations in a Hybrid Cooling Data Center

Numerical and Experimental Characterization of the Transient Effectiveness of a Water to Air Heat Exchanger for Data Center Cooling Systems

Performance and Integration Implications of Addressing Localized Hotspots Through Two Approaches: Clustering of Micro Pin-Fins and Dedicated Microgap Coolers

Embedded Cooling of High Heat Flux Electronics Utilizing Distributed Microfluidic Impingement Jets

Advanced Cooling Designs for GaN-on-Diamond MMICs

Reliable Integration of Microchannel Coolers for Power Electronics

Micro Cryogenic Coolers With Mixed Refrigerants

Design of High Packing Fraction Thermoelectric Modules for High Heat Flux Cooling

Advanced Liquid Cooling Technology Evaluation for High Power CPUs and GPUs

Thermal Imaging of Two-Phase Coooled Microgap Channel Wall

Optimization of Cold Aisle Isolation Designs for a Data Center With Roofs and Doors Using Slits

Evaluation on Use of Thermoelectric Devices for Electronics Cooling

Thermofluid Characteristics of Two-Phase Microgap Coolers

Partially Decoupled Aisle Method for Estimating Rack-Cooling Performance in Near-Real Time

Optimization of Bulk Thermoelectric Modules for Chip Cooling Applications

Experimental Characterization of Bonded Microcoolers for Hot Spot Removal

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