1-20 of 95
Heat conduction
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Topology Optimization of Heat Sink for 3d Integrated Power Converters

Xiaoqiang Xu, Abdul Basit Mirza, Lingfeng Gao, Fang Luo, Shikui Chen
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A009, October 25–27, 2022
Paper No: IPACK2022-98066
DOI: https://doi.org/10.1115/IPACK2022-98066
View Paper titled, Topology Optimization of Heat Sink for 3d Integrated Power Converters
Open the PDF for Topology Optimization of Heat Sink for 3d Integrated Power Converters in another window
Topics: Heat sinks, Optimization, Power converters, Topology, Design, Convection, Cooling, Computer simulation, Density, Filtration
Proceedings Papers

Thermal Model of the Package Integrated Cyclone COoler (PICCO): Achieving High Thermal Conductance Using Swirled Two-Phase Flow

Rinaldo L. Miorini, Darin J. Sharar, Peter deBock
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A012, October 27–29, 2020
Paper No: IPACK2020-2605
DOI: https://doi.org/10.1115/IPACK2020-2605
View Paper titled, Thermal Model of the Package Integrated Cyclone COoler (PICCO): Achieving High Thermal Conductance Using Swirled Two-Phase Flow
Open the PDF for Thermal Model of the Package Integrated Cyclone COoler (PICCO): Achieving High Thermal Conductance Using Swirled Two-Phase Flow in another window
Topics: Thermal conductivity, Two-phase flow, Flow (Dynamics), Additive manufacturing, Army, Boundary-value problems, Bubbles, Buoyancy, Capacitance, Collaboration
Proceedings Papers

Evaporation Rate Measurement at Multiple Scales Using Temperature-Sensitive Fluorescence Dyes

Youngjoon Suh, Cheng-Hui Lin, Hamsa Gowda, Yoonjin Won
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A002, October 7–9, 2019
Paper No: IPACK2019-6372
DOI: https://doi.org/10.1115/IPACK2019-6372
View Paper titled, Evaporation Rate Measurement at Multiple Scales Using Temperature-Sensitive Fluorescence Dyes
Open the PDF for Evaporation Rate Measurement at Multiple Scales Using Temperature-Sensitive Fluorescence Dyes in another window
Topics: Evaporation, Fluorescence, Temperature, Microscale devices, Cooling, Vapors, Calibration, Cutting, Drying, Electronics
Proceedings Papers

Orientation Effects in Two-Phase Microgap Flow

Franklin L. Robinson, Avram Bar-Cohen
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A015, August 27–30, 2018
Paper No: IPACK2018-8383
DOI: https://doi.org/10.1115/IPACK2018-8383
View Paper titled, Orientation Effects in Two-Phase Microgap Flow
Open the PDF for Orientation Effects in Two-Phase Microgap Flow in another window
Topics: Flow (Dynamics), Gravity (Force), Coolers, Boiling, Cooling, Flux (Metallurgy), Heat, Aircraft, Fluids, Gravitational acceleration
Proceedings Papers

Effect of Interfacial Thermal Conductance Between the Nanoparticles

Anil Yuksel, Edward T. Yu, Michael Cullinan, Jayathi Murthy
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A002, August 27–30, 2018
Paper No: IPACK2018-8212
DOI: https://doi.org/10.1115/IPACK2018-8212
View Paper titled, Effect of Interfacial Thermal Conductance Between the Nanoparticles
Open the PDF for Effect of Interfacial Thermal Conductance Between the Nanoparticles in another window
Topics: Nanoparticles, Thermal conductivity, Heat, Heat transfer, Heat conduction, Radiation (Physics), Thermal management
Proceedings Papers

Experimental Study of Flexible Electrohydrodynamic Conduction Pumping for Electronics Cooling

Nicolas Vayas Tobar, Pavolas N. Christidis, Nathaniel J. O'Connor, Michal Talmor, Jamal Seyed-Yagoobi
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A012, August 27–30, 2018
Paper No: IPACK2018-8322
DOI: https://doi.org/10.1115/IPACK2018-8322
View Paper titled, Experimental Study of Flexible Electrohydrodynamic Conduction Pumping for Electronics Cooling
Open the PDF for Experimental Study of Flexible Electrohydrodynamic Conduction Pumping for Electronics Cooling in another window
Topics: Computer cooling, Electrohydrodynamics, Heat conduction, Pumps, Flow (Dynamics), Flexible electronics, Microscale devices, Actuators, Biology, Biomedicine
Proceedings Papers

Evaporative Wicking Phenomena on Nanotextured Surfaces for Heat Pipe Applications

Duong Vy Le, Shiwei Zhang, Jonggyu Lee, Yoonjin Won
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A025, August 27–30, 2018
Paper No: IPACK2018-8456
DOI: https://doi.org/10.1115/IPACK2018-8456
View Paper titled, Evaporative Wicking Phenomena on Nanotextured Surfaces for Heat Pipe Applications
Open the PDF for Evaporative Wicking Phenomena on Nanotextured Surfaces for Heat Pipe Applications in another window
Topics: Cooling, Copper, Design, Electronics, Energy dissipation, Evaporation, Evaporative cooling, Heat, Heat conduction, Heat flux
Proceedings Papers

Optimization of Filling Mass Fraction for Composite PCMs Based Thermal Management System

Bofeng Shang, Jinyan Hu, Xingjian Yu, Bin Xie, Ruikang Wu, Xiaobing Luo
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A027, August 29–September 1, 2017
Paper No: IPACK2017-74196
DOI: https://doi.org/10.1115/IPACK2017-74196
View Paper titled, Optimization of Filling Mass Fraction for Composite PCMs Based Thermal Management System
Open the PDF for Optimization of Filling Mass Fraction for Composite PCMs Based Thermal Management System in another window
Topics: Composite materials, Optimization, Phase change materials, Thermal management, Thermal conductivity, Latent heat, Temperature, Heat flux, Cooling, Graphite
Proceedings Papers

Inverse Conduction Heat Transfer and Kriging Interpolation Applied to Temperature Sensor Location in Microchips

D. Gonzalez Cuadrado, A. Marconnet, G. Paniagua
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A028, August 29–September 1, 2017
Paper No: IPACK2017-74224
DOI: https://doi.org/10.1115/IPACK2017-74224
View Paper titled, Inverse Conduction Heat Transfer and Kriging Interpolation Applied to Temperature Sensor Location in Microchips
Open the PDF for Inverse Conduction Heat Transfer and Kriging Interpolation Applied to Temperature Sensor Location in Microchips in another window
Topics: Heat conduction, Heat transfer, Integrated circuits, Interpolation, Temperature sensors, Temperature, Optimization, Sensors, Finite element analysis, Genetic algorithms
Proceedings Papers

Challenges in 3D Printing of High Conductivity Copper

Tahany El-Wardany, Ying She, Vijay Jagdale, Jacquelynn K. Garofano, Joe Liou, Wayde Schmidt
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A005, August 29–September 1, 2017
Paper No: IPACK2017-74306
DOI: https://doi.org/10.1115/IPACK2017-74306
View Paper titled, Challenges in 3D Printing of High Conductivity Copper
Open the PDF for Challenges in 3D Printing of High Conductivity Copper in another window
Topics: Additive manufacturing, Copper, Electrical conductivity, Thermal conductivity, Engines, Motors, Electromagnetic induction, Machinery, Aerospace industry, Electric vehicles
Proceedings Papers

State of the Art of Electronics Cooling for Radar Antenna Applications

Girish Upadhya, Clayton Pullins, Karl Freitag, George Hall, James Marthinuss
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A023, August 29–September 1, 2017
Paper No: IPACK2017-74080
DOI: https://doi.org/10.1115/IPACK2017-74080
View Paper titled, State of the Art of Electronics Cooling for Radar Antenna Applications
Open the PDF for State of the Art of Electronics Cooling for Radar Antenna Applications in another window
Topics: Computer cooling, Radar, Cooling, Heat flux, Defense industry, Design, Electronics, Refrigerants, Two-phase flow, Analytical methods
Proceedings Papers

Numerical Performance Characterization of an Innovative Micro-Scale Electrohydrodynamic Conduction Pumping Device

Michal Talmor, Jamal Yagoobi
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A024, August 29–September 1, 2017
Paper No: IPACK2017-74107
DOI: https://doi.org/10.1115/IPACK2017-74107
View Paper titled, Numerical Performance Characterization of an Innovative Micro-Scale Electrohydrodynamic Conduction Pumping Device
Open the PDF for Numerical Performance Characterization of an Innovative Micro-Scale Electrohydrodynamic Conduction Pumping Device in another window
Topics: Electrohydrodynamics, Heat conduction, Microscale devices, Performance characterization, Pumps, Electrodes, Fluids, Electronics, Flow (Dynamics), Aerospace industry
Proceedings Papers

Topology Optimization, Additive Layer Manufacturing, and Experimental Testing of an Air-Cooled Heat Sink

Ercan M. Dede, Shailesh N. Joshi, Feng Zhou
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T03A001, July 6–9, 2015
Paper No: IPACK2015-48027
DOI: https://doi.org/10.1115/IPACK2015-48027
View Paper titled, Topology Optimization, Additive Layer Manufacturing, and Experimental Testing of an Air-Cooled Heat Sink
Open the PDF for Topology Optimization, Additive Layer Manufacturing, and Experimental Testing of an Air-Cooled Heat Sink in another window
Topics: Heat sinks, Manufacturing, Optimization, Testing, Topology, Computer-aided design, Design, Aluminum, Convection, Cooling
Proceedings Papers

A Method for Thermal Performance Characterization of Ultra-Thin Vapor Chambers Cooled by Natural Convection

Gaurav Patankar, Simone Mancin, Justin A. Weibel, Suresh V. Garimella, Mark A. MacDonald
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A018, July 6–9, 2015
Paper No: IPACK2015-48175
DOI: https://doi.org/10.1115/IPACK2015-48175
View Paper titled, A Method for Thermal Performance Characterization of Ultra-Thin Vapor Chambers Cooled by Natural Convection
Open the PDF for A Method for Thermal Performance Characterization of Ultra-Thin Vapor Chambers Cooled by Natural Convection in another window
Topics: Natural convection, Performance characterization, Vapors, Heat, Flat heat pipes, Computer simulation, Condensers (steam plant), Energy dissipation, Heat losses, Temperature distribution
Proceedings Papers

Use of Two-Phase CFD Simulations to Develop a Boiling Heat Transfer Prediction Method for Slug Flow Within Microchannels

Mirco Magnini, John R. Thome
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A020, July 6–9, 2015
Paper No: IPACK2015-48033
DOI: https://doi.org/10.1115/IPACK2015-48033
View Paper titled, Use of Two-Phase CFD Simulations to Develop a Boiling Heat Transfer Prediction Method for Slug Flow Within Microchannels
Open the PDF for Use of Two-Phase CFD Simulations to Develop a Boiling Heat Transfer Prediction Method for Slug Flow Within Microchannels in another window
Topics: Boiling, Computational fluid dynamics, Engineering simulation, Heat transfer, Microchannels, Simulation, Slug flows, Bubbles, Evaporation, Flow (Dynamics)
Proceedings Papers

Novel Dynamic Numerical Microchannel Evaporator Model to Investigate Parallel Channel Instabilities

Tom Saenen, John R. Thome
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A021, July 6–9, 2015
Paper No: IPACK2015-48066
DOI: https://doi.org/10.1115/IPACK2015-48066
View Paper titled, Novel Dynamic Numerical Microchannel Evaporator Model to Investigate Parallel Channel Instabilities
Open the PDF for Novel Dynamic Numerical Microchannel Evaporator Model to Investigate Parallel Channel Instabilities in another window
Topics: Microchannels, Dynamic models, Flow (Dynamics), Heat conduction, Heat transfer, Pressure, Simulation, Stability, Two-phase flow
Proceedings Papers

Numerical Simulation of Advanced Monolithic Microcooler Designs for High Heat Flux Microelectronics

Sebastian Scholl, Catherine Gorle, Farzad Houshmand, Tanya Liu, Hyoungsoon Lee, Yoonjin Won, Mehdi Asheghi, Kenneth Goodson, Hooman Kazemi
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A009, July 6–9, 2015
Paper No: IPACK2015-48122
DOI: https://doi.org/10.1115/IPACK2015-48122
View Paper titled, Numerical Simulation of Advanced Monolithic Microcooler Designs for High Heat Flux Microelectronics
Open the PDF for Numerical Simulation of Advanced Monolithic Microcooler Designs for High Heat Flux Microelectronics in another window
Topics: Boundary-value problems, Computational fluid dynamics, Computer simulation, Cooling, Design, Fins, Flow (Dynamics), Fluid dynamics, Geometry, Heat conduction
Proceedings Papers

Computational Modeling of Extreme Heat Flux Microcooler for GaN-Based HEMT

Hyoungsoon Lee, Yoonjin Won, Farzad Houshmand, Catherine Gorle, Mehdi Asheghi, Kenneth E. Goodson
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A018, July 6–9, 2015
Paper No: IPACK2015-48670
DOI: https://doi.org/10.1115/IPACK2015-48670
View Paper titled, Computational Modeling of Extreme Heat Flux Microcooler for GaN-Based HEMT
Open the PDF for Computational Modeling of Extreme Heat Flux Microcooler for GaN-Based HEMT in another window
Topics: Computer simulation, Gallium nitride, Heat flux, Microcoolers, Microchannels, Simulation, Computational fluid dynamics, Flow (Dynamics), Fluids, Heat conduction
Proceedings Papers

Quantification of Phase Change Material Energy Storage Capability Using Multiphysics Simulations

W. E. O’Connor, A. P. Wemhoff
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A065, July 6–9, 2015
Paper No: IPACK2015-48522
DOI: https://doi.org/10.1115/IPACK2015-48522
View Paper titled, Quantification of Phase Change Material Energy Storage Capability Using Multiphysics Simulations
Open the PDF for Quantification of Phase Change Material Energy Storage Capability Using Multiphysics Simulations in another window
Topics: Energy storage, Engineering simulation, Phase change materials, Simulation, Thermal energy storage, Finite element analysis, Heat flux, Heating, Latent heat, Melting
Proceedings Papers

Full Scale Simulation of an Integrated Monolithic Heat Sink for Thermal Management of a High Power Density GaN-SiC Chip

Tanya Liu, Farzad Houshmand, Catherine Gorle, Sebastian Scholl, Hyoungsoon Lee, Yoonjin Won, Mehdi Asheghi, Kenneth Goodson, Hooman Kazemi, Kenneth Vanhille
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A057, July 6–9, 2015
Paper No: IPACK2015-48592
DOI: https://doi.org/10.1115/IPACK2015-48592
View Paper titled, Full Scale Simulation of an Integrated Monolithic Heat Sink for Thermal Management of a High Power Density GaN-SiC Chip
Open the PDF for Full Scale Simulation of an Integrated Monolithic Heat Sink for Thermal Management of a High Power Density GaN-SiC Chip in another window
Topics: Gallium nitride, Heat sinks, Power density, Simulation, Thermal management, Cooling, Flow (Dynamics), Microchannels, Design, Heat transfer