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Proceedings Papers

Quantitative Characterization of Sapphire and Silicon Nitride for Space Applications Circuit Subassemblies Using Cryogenic Cycling

Kirsten Lovelace, Sonya Smith
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A022, October 7–9, 2019
Paper No: IPACK2019-6499
DOI: https://doi.org/10.1115/IPACK2019-6499
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Topics: Circuits, Sapphire, Silicon nitride ceramics, Thermal expansion
Proceedings Papers

Steady State and Transient Thermal Characterization of Vertical GaN PIN Diodes

Georges Pavlidis, James Dallas, Sukwon Choi, Shyh-Chiang Shen, Samuel Graham
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A011, August 29–September 1, 2017
Paper No: IPACK2017-74149
DOI: https://doi.org/10.1115/IPACK2017-74149
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Topics: Gallium nitride, Steady state, Thermal characterization, Transients (Dynamics), Temperature, Sapphire, Temperature distribution, Heating, Imaging, Joules
Proceedings Papers

Evaluation of the Strength of Interface for Multi-Layered Materials in Photonic Devices

Hideo Koguchi, Naoki Kimura
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A017, July 6–9, 2015
Paper No: IPACK2015-48105
DOI: https://doi.org/10.1115/IPACK2015-48105
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Topics: Bonding, Boundary element methods, Cooling, Corners (Structural elements), Delamination, Joining, Numerical analysis, Packaging, Photonic equipment, Polymers
Proceedings Papers

Evaluation of Strength in Joints of Silicon and Sapphire Coating Silicon

Hideo Koguchi, Naoki Kimura
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A004, July 16–18, 2013
Paper No: IPACK2013-73113
DOI: https://doi.org/10.1115/IPACK2013-73113
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Topics: Coating processes, Coatings, Sapphire, Silicon, Delamination, Bonding, Resins, Stress, Cooling, Temperature
Proceedings Papers

Thermal Imaging of Two-Phase Coooled Microgap Channel Wall

Jessica Sheehan, Dae Whan Kim, Avram Bar-Cohen
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 491-499, July 19–23, 2009
Paper No: InterPACK2009-89238
DOI: https://doi.org/10.1115/InterPACK2009-89238
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Topics: Absorption, Coolers, Cooling, Dielectric liquids, Electronic components, Flow (Dynamics), Flux (Metallurgy), Heat, Heat flux, Imaging