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Proceedings Papers

Machine Learning and Simulation Based Temperature Prediction on High-Performance Processors

Carlton Knox, Zihao Yuan, Ayse K. Coskun
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A001, October 25–27, 2022
Paper No: IPACK2022-96751
DOI: https://doi.org/10.1115/IPACK2022-96751
View Paper titled, Machine Learning and Simulation Based Temperature Prediction on High-Performance Processors
Click here to open pdf in another window PDF for Machine Learning and Simulation Based Temperature Prediction on High-Performance Processors
Topics: Machine learning, Simulation, Temperature
Proceedings Papers

Effect of Property Evolution of Doped and Undoped SnAgCu Solder Alloys Under Shock and Vibration

Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A003, October 25–27, 2022
Paper No: IPACK2022-97452
DOI: https://doi.org/10.1115/IPACK2022-97452
View Paper titled, Effect of Property Evolution of Doped and Undoped SnAgCu Solder Alloys Under Shock and Vibration
Click here to open pdf in another window PDF for Effect of Property Evolution of Doped and Undoped SnAgCu Solder Alloys Under Shock and Vibration
Topics: Alloys, Shock (Mechanics), Solders, Vibration, Reliability, Aerospace industry, Climate, Defense industry, Elastic moduli, Electronics
Proceedings Papers

Comparative Study of Single-Phase Immersion Cooled Two Socket Server in Tank and Sled Configurations

Krishna Bhavana Sivaraju, Pratik Bansode, Gautam Gupta, Jacob Lamotte-Dawaghreh, Satyam Saini, Vibin Simon, Joseph Herring, II, Saket Karajgikar, Veerendra Mulay, Dereje Agonafer
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A010, October 25–27, 2022
Paper No: IPACK2022-97429
DOI: https://doi.org/10.1115/IPACK2022-97429
View Paper titled, Comparative Study of Single-Phase Immersion Cooled Two Socket Server in Tank and Sled Configurations
Click here to open pdf in another window PDF for Comparative Study of Single-Phase Immersion Cooled Two Socket Server in Tank and Sled Configurations
Topics: Building renovation, Computational fluid dynamics, Coolants, Cooling, Data centers, Flow (Dynamics), Fluids, Geometry, Heat, Heat transfer
Proceedings Papers

A Control Strategy for Minimizing Temperature Fluctuations in High Power Liquid to Liquid CDUs Operated at Very Low Heat Loads

Ali Heydari, Pardeep Shahi, Vahideh Radmard, Bahareh Eslami, Uschas Chowdhury, Chandraprakash Hinge, Lochan Sai Reddy Cinthaparthy, Harold Miyamura, Himanshu Modi, Dereje Agonafer, Jeremy Rodriguez
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A011, October 25–27, 2022
Paper No: IPACK2022-97434
DOI: https://doi.org/10.1115/IPACK2022-97434
View Paper titled, A Control Strategy for Minimizing Temperature Fluctuations in High Power Liquid to Liquid CDUs Operated at Very Low Heat Loads
Click here to open pdf in another window PDF for A Control Strategy for Minimizing Temperature Fluctuations in High Power Liquid to Liquid CDUs Operated at Very Low Heat Loads
Topics: Coolants, Cooling, Data centers, Fluctuations (Physics), Heat, Plates (structures), Stress, Temperature, Failure, Flow control
Proceedings Papers

High Strain Rate Properties and Evolution of Plastic-Work for Doped Solder SAC-Q for Isothermal Aging Up to 240-Days at 100°C

Pradeep Lall, Vishal Mehta, Jeff Suhling, Ken Blecker
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A010, October 25–27, 2022
Paper No: IPACK2022-97438
DOI: https://doi.org/10.1115/IPACK2022-97438
View Paper titled, High Strain Rate Properties and Evolution of Plastic-Work for Doped Solder SAC-Q for Isothermal Aging Up to 240-Days at 100°C
Click here to open pdf in another window PDF for High Strain Rate Properties and Evolution of Plastic-Work for Doped Solder SAC-Q for Isothermal Aging Up to 240-Days at 100°C
Topics: Shock (Mechanics), Solders, Temperature, Operating temperature, Alloys, High temperature, Stress, Stress-strain curves, Testing, Aerospace industry
Proceedings Papers

CFD Simulation-Based Comparative Study of Forced Convection Single-Phase Liquid Immersion Cooling for a High-Powered Server

Prajwal Murthy, Gautam Gupta, Joseph Herring, Jacob Lamotte-Dawaghreh, Krishna Bhavana Sivaraju, Pratik Bansode, Himanshu Modi, Dereje Agonafer, Poornima Mynampati, Mike Sweeney
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A006, October 25–27, 2022
Paper No: IPACK2022-97402
DOI: https://doi.org/10.1115/IPACK2022-97402
View Paper titled, CFD Simulation-Based Comparative Study of Forced Convection Single-Phase Liquid Immersion Cooling for a High-Powered Server
Click here to open pdf in another window PDF for CFD Simulation-Based Comparative Study of Forced Convection Single-Phase Liquid Immersion Cooling for a High-Powered Server
Topics: Computational fluid dynamics, Cooling, Fluids, Forced convection, Power density, Simulation, Temperature, Thermal conductivity
Proceedings Papers

Power Envelope Analysis for the Thermal Optimization of a Chiplet Module

Eric Ouyang, Xiao Gu, Yonghyuk Jeong, Michael Liu
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A001, October 25–27, 2022
Paper No: IPACK2022-97204
DOI: https://doi.org/10.1115/IPACK2022-97204
View Paper titled, Power Envelope Analysis for the Thermal Optimization of a Chiplet Module
Click here to open pdf in another window PDF for Power Envelope Analysis for the Thermal Optimization of a Chiplet Module
Topics: Design, Heat sinks, Junctions, Optimization, Reliability, Resistors, Risk, Simulation, Temperature
Proceedings Papers

Thermomechanical Reliability of BGA Packages With Different Underfill Reinforcement Methods

Yangyang Lai, Chongyang Cai, Ke Pan, Junbo Yang, Jonghwan Ha, Pengcheng Yin, Karthik Deo, Seungbae Park
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A006, October 25–27, 2022
Paper No: IPACK2022-97349
DOI: https://doi.org/10.1115/IPACK2022-97349
View Paper titled, Thermomechanical Reliability of BGA Packages With Different Underfill Reinforcement Methods
Click here to open pdf in another window PDF for Thermomechanical Reliability of BGA Packages With Different Underfill Reinforcement Methods
Topics: Ball-Grid-Array packages, Ball-Grid-Array packaging, Reliability, Thermomechanics, Cycles, Solders, Corners (Structural elements), Bonding, Deformation, Stiffness
Proceedings Papers

Evolution of Circuit Performance With Sustained 50°C Temperature Exposure for Additively Printed Inkjet Circuits With SMT Components

Pradeep Lall, Kartik Goyal, Scott Miller
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A005, October 25–27, 2022
Paper No: IPACK2022-97430
DOI: https://doi.org/10.1115/IPACK2022-97430
View Paper titled, Evolution of Circuit Performance With Sustained 50°C Temperature Exposure for Additively Printed Inkjet Circuits With SMT Components
Click here to open pdf in another window PDF for Evolution of Circuit Performance With Sustained 50°C Temperature Exposure for Additively Printed Inkjet Circuits With SMT Components
Topics: Circuits, Electronics, Temperature, Surface mount components, Filters, Manufacturing, Printing, Wearable devices, Energy dissipation, Heat
Proceedings Papers

Modeling Underfill Degradation and Its Effect on FCBGA Package Reliability Under High-Temperature Operation

Pradeep Lall, Madhu Kasturi, Haotian Wu, Edward Davis
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A009, October 25–27, 2022
Paper No: IPACK2022-97433
DOI: https://doi.org/10.1115/IPACK2022-97433
View Paper titled, Modeling Underfill Degradation and Its Effect on FCBGA Package Reliability Under High-Temperature Operation
Click here to open pdf in another window PDF for Modeling Underfill Degradation and Its Effect on FCBGA Package Reliability Under High-Temperature Operation
Topics: High temperature, Modeling, Reliability, Flip-chip, Solder joints, Ball-Grid-Array packaging, Electronics, Fatigue failure, Fatigue life, Materials degradation
Proceedings Papers

Electro-Chemical Migration in Aerosol-Jet Printed Electronics Using Temperature-Humidity and Water Droplet Testing Methods

Beihan Zhao, Aniket Ajitkumar Bharamgonda, Eric Jennings, Robert G. Utter, Michael Osterman, Michael H. Azarian, Siddhartha Das, Abhijit Dasgupta, Jason Fleischer, Edwin Quinn, Daniel Hines
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A001, October 25–27, 2022
Paper No: IPACK2022-92306
DOI: https://doi.org/10.1115/IPACK2022-92306
View Paper titled, Electro-Chemical Migration in Aerosol-Jet Printed Electronics Using Temperature-Humidity and Water Droplet Testing Methods
Click here to open pdf in another window PDF for Electro-Chemical Migration in Aerosol-Jet Printed Electronics Using Temperature-Humidity and Water Droplet Testing Methods
Topics: Aerosols, Drops, Electronics, Silver, Temperature, Testing, Water
Proceedings Papers

Experimental Probing of the Bias Dependent Self-Heating in AlGaN/GaN HEMTs With a Transparent Indium Tin Oxide Gate

Anwarul Karim, Tae Kyoung Kim, Daniel Shoemaker, Yiwen Song, Joon Seop Kwak, Sukwon Choi
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A011, October 25–27, 2022
Paper No: IPACK2022-98800
DOI: https://doi.org/10.1115/IPACK2022-98800
View Paper titled, Experimental Probing of the Bias Dependent Self-Heating in AlGaN/GaN HEMTs With a Transparent Indium Tin Oxide Gate
Click here to open pdf in another window PDF for Experimental Probing of the Bias Dependent Self-Heating in AlGaN/GaN HEMTs With a Transparent Indium Tin Oxide Gate
Topics: Gallium nitride, Gates (Closures), Heating, Reliability, Temperature, Transparency
Proceedings Papers

Experimental Investigation of the Impact of Improved Ducting and Chassis Re-Design of a Hybrid-Cooled Server

Himanshu Modi, Pardeep Shahi, Lochan Sai Reddy Chinthaparthy, Gautam Gupta, Pratik Bansode, Vibin Shalom Simon, Dereje Agonafer
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A019, October 25–27, 2022
Paper No: IPACK2022-97587
DOI: https://doi.org/10.1115/IPACK2022-97587
View Paper titled, Experimental Investigation of the Impact of Improved Ducting and Chassis Re-Design of a Hybrid-Cooled Server
Click here to open pdf in another window PDF for Experimental Investigation of the Impact of Improved Ducting and Chassis Re-Design of a Hybrid-Cooled Server
Topics: Cooling, Design, Air flow, Heat sinks, Temperature, Cloud computing, Energy consumption, Flow (Dynamics), Graphics processing units, Heat
Proceedings Papers

Mechanical and Electrical Properties of Additively Printed Circuits With Magnetically Orientated Anisotropic Conductive Adhesive Attachment for FHE Applications

Pradeep Lall, Jinesh Narangaparambil, Scott Miller
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A011, October 25–27, 2022
Paper No: IPACK2022-97456
DOI: https://doi.org/10.1115/IPACK2022-97456
View Paper titled, Mechanical and Electrical Properties of Additively Printed Circuits With Magnetically Orientated Anisotropic Conductive Adhesive Attachment for FHE Applications
Click here to open pdf in another window PDF for Mechanical and Electrical Properties of Additively Printed Circuits With Magnetically Orientated Anisotropic Conductive Adhesive Attachment for FHE Applications
Topics: Adhesives, Anisotropy, Circuits, Electrical properties, Failure, Reliability, Temperature, Electronics, Low temperature, Bonding
Proceedings Papers

RoHS – Compliant Indirectly Material Evaluation for Manufacturing Study

Fenny Liu, Sean Huang, Sheng Fong Yu, Chun Yen Li, Liang-Yih Hung, Yu Po Wang
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A004, October 25–27, 2022
Paper No: IPACK2022-97175
DOI: https://doi.org/10.1115/IPACK2022-97175
View Paper titled, RoHS – Compliant Indirectly Material Evaluation for Manufacturing Study
Click here to open pdf in another window PDF for RoHS – Compliant Indirectly Material Evaluation for Manufacturing Study
Topics: Hazardous substances, Manufacturing, Phthalate plasticizers, Electronic equipment, Plasticizers, Risk, Semiconductor industry, Temperature, Weight (Mass)
Proceedings Papers

Feasibility Demonstration of Server Chip Package With Direct-to-Chip Optical Transceivers

Shidong Li, Bakul Parikh, Chelsea Savoy, Daniel Kuchta, Guillaume Jutras, Harry Bagheri, Hilton Toy, Joe Ross, Ken-Ichi Akasofu, Mark Kapfhammer, Mark Schultz, Steven Ostrander, Thomas Wassick
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A004, October 25–27, 2022
Paper No: IPACK2022-97455
DOI: https://doi.org/10.1115/IPACK2022-97455
View Paper titled, Feasibility Demonstration of Server Chip Package With Direct-to-Chip Optical Transceivers
Click here to open pdf in another window PDF for Feasibility Demonstration of Server Chip Package With Direct-to-Chip Optical Transceivers
Topics: Cables, Construction, Copper, Cycles, Density, Elastomers, Fibers, Flat heat pipes, Flip-chip, Flip-chip devices
Proceedings Papers

Power Usage Effectiveness Analysis of a High-Density Air-Liquid Hybrid Cooled Data Center

Ali Heydari, Bahareh Eslami, Vahideh Radmard, Fred Rebarber, Tyler Buell, Kevin Gray, Sam Sather, Jeremy Rodriguez
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A014, October 25–27, 2022
Paper No: IPACK2022-97447
DOI: https://doi.org/10.1115/IPACK2022-97447
View Paper titled, Power Usage Effectiveness Analysis of a High-Density Air-Liquid Hybrid Cooled Data Center
Click here to open pdf in another window PDF for Power Usage Effectiveness Analysis of a High-Density Air-Liquid Hybrid Cooled Data Center
Topics: Cooling, Data centers, Density, Energy consumption, Temperature, Computational fluid dynamics, Design, Flow (Dynamics), Carbon, Cooling systems
Proceedings Papers

Thermal Optimization of a Silicon Carbide, Half-Bridge Power Module

Gilberto Moreno, Joshua Major, Douglas DeVoto, Faisal Khan, Sreekant Narumanchi, Xuhui Feng, Paul Paret
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A003, October 25–27, 2022
Paper No: IPACK2022-97283
DOI: https://doi.org/10.1115/IPACK2022-97283
View Paper titled, Thermal Optimization of a Silicon Carbide, Half-Bridge Power Module
Click here to open pdf in another window PDF for Thermal Optimization of a Silicon Carbide, Half-Bridge Power Module
Topics: Bridges (Structures), Electronics, Energy gap, Optimization, Silicon, Design, Thermal resistance, Computational fluid dynamics, Heat exchangers, Fluids
Proceedings Papers

Evolution of Propensity for Chip-UF FCBGA Interface Delamination Under Fatigue-Loading and Sustained High Automotive Temperatures

Pradeep Lall, Aathi Raja Ram Pandurangan, Jaimal Williamson
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A002, October 25–27, 2022
Paper No: IPACK2022-97424
DOI: https://doi.org/10.1115/IPACK2022-97424
View Paper titled, Evolution of Propensity for Chip-UF FCBGA Interface Delamination Under Fatigue-Loading and Sustained High Automotive Temperatures
Click here to open pdf in another window PDF for Evolution of Propensity for Chip-UF FCBGA Interface Delamination Under Fatigue-Loading and Sustained High Automotive Temperatures
Topics: Delamination, Fatigue, Fracture toughness, Temperature
Proceedings Papers

Effect of Aging on High Strain Rate Mechanical Properties of SAC+Bi Solders After Exposure to Isothermal Aging of 50°C Up To 120 Days

Pradeep Lall, Mrinmoy Saha, Jeff Suhling, Ken Blecker
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A013, October 25–27, 2022
Paper No: IPACK2022-97449
DOI: https://doi.org/10.1115/IPACK2022-97449
View Paper titled, Effect of Aging on High Strain Rate Mechanical Properties of SAC+Bi Solders After Exposure to Isothermal Aging of 50°C Up To 120 Days
Click here to open pdf in another window PDF for Effect of Aging on High Strain Rate Mechanical Properties of SAC+Bi Solders After Exposure to Isothermal Aging of 50°C Up To 120 Days
Topics: Mechanical properties, Solders, Temperature, Alloys, Storage, Aerospace industry, Automotive industry, Constitutive equations, Finite element analysis, Low temperature materials