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Heterogeneous Integration: Micro-Systems With Diverse Functionality
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Proceedings Papers

Reduced Working Temperature of Quantum Dots-Light-Emitting Diodes Optimized by QDs@Silica-on-Chip Structure

Bin Xie, Haochen Liu, Xiao Wei Sun, Xingjian Yu, Kai Wang, Xiaobing Luo
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A006, August 27–30, 2018
Paper No: IPACK2018-8301
DOI: https://doi.org/10.1115/IPACK2018-8301
View Paper titled, Reduced Working Temperature of Quantum Dots-Light-Emitting Diodes Optimized by QDs@Silica-on-Chip Structure
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Topics: Temperature, Phosphors, Silicones, Light sources, Light-emitting diodes, Nanoparticles, Quantum dots, Rendering, Shells, Stability
Proceedings Papers

On Thermal Interface Materials With Polydisperse Fillers: Packing Algorithm and Effective Properties

Piyas Chowdhury, Kamal Sikka, Anuja De Silva, Indira Seshadri
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A007, August 27–30, 2018
Paper No: IPACK2018-8337
DOI: https://doi.org/10.1115/IPACK2018-8337
View Paper titled, On Thermal Interface Materials With Polydisperse Fillers: Packing Algorithm and Effective Properties
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Topics: Algorithms, Fillers (Materials), Packing (Shipments), Packings (Cushioning), Design, Elastic moduli, Heat, Thermal conductivity, Viscosity, Errors
Proceedings Papers

Cylindrical Tuber Encapsulant Layer Realization by Patterned Surface for COB-LEDs Packaging

Xingjian Yu, Run Hu, Ruikang Wu, Bin Xie, Xiaoyu Zhang, Xiaobing Luo
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A001, August 27–30, 2018
Paper No: IPACK2018-8211
DOI: https://doi.org/10.1115/IPACK2018-8211
View Paper titled, Cylindrical Tuber Encapsulant Layer Realization by Patterned Surface for COB-LEDs Packaging
Click here to open pdf in another window PDF for Cylindrical Tuber Encapsulant Layer Realization by Patterned Surface for COB-LEDs Packaging
Topics: Light-emitting diodes, Packaging, Silicones, Wetting, Coating processes, Coatings, Phosphors, Domes (Structural elements), Geometry, Particulate matter
Proceedings Papers

Creep Response of Assemblies Bonded With Pressure Sensitive Adhesive (PSA)

Hao Huang, Qian Jiang, Abhijit Dasgupta, Ehsan Mirbagheri, Krishna Darbha
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A008, August 27–30, 2018
Paper No: IPACK2018-8345
DOI: https://doi.org/10.1115/IPACK2018-8345
View Paper titled, Creep Response of Assemblies Bonded With Pressure Sensitive Adhesive (PSA)
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Topics: Adhesives, Creep, Pressure, Stress, Bonding, Hydrostatics, Temperature, Cavitation, Cavities, Design
Proceedings Papers

Effect of Interfacial Thermal Conductance Between the Nanoparticles

Anil Yuksel, Edward T. Yu, Michael Cullinan, Jayathi Murthy
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A002, August 27–30, 2018
Paper No: IPACK2018-8212
DOI: https://doi.org/10.1115/IPACK2018-8212
View Paper titled, Effect of Interfacial Thermal Conductance Between the Nanoparticles
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Topics: Nanoparticles, Thermal conductivity, Heat, Heat transfer, Heat conduction, Radiation (Physics), Thermal management
Proceedings Papers

Low Temperature Fabrication of Three-Dimensional Ceramic Substrate by Using Inorganic Alkali Activated Aluminosilicate Cement Paste for UV-LED Packaging

Hao Cheng, Zi Zhou Yang, Yang Peng, Yun Mou, Ming Xiang Chen
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A003, August 27–30, 2018
Paper No: IPACK2018-8226
DOI: https://doi.org/10.1115/IPACK2018-8226
View Paper titled, Low Temperature Fabrication of Three-Dimensional Ceramic Substrate by Using Inorganic Alkali Activated Aluminosilicate Cement Paste for UV-LED Packaging
Click here to open pdf in another window PDF for Low Temperature Fabrication of Three-Dimensional Ceramic Substrate by Using Inorganic Alkali Activated Aluminosilicate Cement Paste for UV-LED Packaging
Topics: Cements (Adhesives), Ceramics, Low temperature, Manufacturing, Packaging, Ultraviolet radiation, Shear strength, Hardening (Curing), Heat, Light-emitting diodes
Proceedings Papers

Quantification of Underfill Influence to Chip Packaging Interactions of WLCSP

Huayan Wang, Shuai Shao, Vanlai Pham, Panju Shang, Cheng Zhong, Seungbae Park
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A004, August 27–30, 2018
Paper No: IPACK2018-8257
DOI: https://doi.org/10.1115/IPACK2018-8257
View Paper titled, Quantification of Underfill Influence to Chip Packaging Interactions of WLCSP
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Topics: Packaging, Corners (Structural elements), Finite element analysis, Deformation, Delamination, Fracture (Materials), Fracture (Process), Reliability, Damage, Electronics
Proceedings Papers

Lidded vs. Lidless: A Thermal Study

Xiaopeng Huang, Vadim Gektin
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A005, August 27–30, 2018
Paper No: IPACK2018-8294
DOI: https://doi.org/10.1115/IPACK2018-8294
View Paper titled, Lidded vs. Lidless: A Thermal Study
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Topics: Design, Junctions, Packaging, Thermal resistance
Proceedings Papers

Is the Heterogeneous Microstructure of SnAgCu (SAC) Solders Going to Pose a Challenge for Heterogeneous Integration?

Qian Jiang, Abhishek Deshpande, Abhijit Dasgupta
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A009, August 29–September 1, 2017
Paper No: IPACK2017-74133
DOI: https://doi.org/10.1115/IPACK2017-74133
View Paper titled, Is the Heterogeneous Microstructure of SnAgCu (SAC) Solders Going to Pose a Challenge for Heterogeneous Integration?
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Topics: Solders, Anisotropy, Tin, Solder joints, Ball-Grid-Array packaging, Crystals, Temperature, Alloys, Composite materials, Cooling
Proceedings Papers

Preliminary Results on the Fabrication of Interconnect Structures Using Microscale Selective Laser Sintering

Nilabh Roy, Obehi Dibua, Chee Seng Foong, Michael Cullinan
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A001, August 29–September 1, 2017
Paper No: IPACK2017-74173
DOI: https://doi.org/10.1115/IPACK2017-74173
View Paper titled, Preliminary Results on the Fabrication of Interconnect Structures Using Microscale Selective Laser Sintering
Click here to open pdf in another window PDF for Preliminary Results on the Fabrication of Interconnect Structures Using Microscale Selective Laser Sintering
Topics: Lasers, Manufacturing, Microscale devices, Sintering, Fluence (Radiation measurement), Additive manufacturing, Copper, Density, Design, Energy dissipation
Proceedings Papers

Advanced Cooling of 3D ICs With Nanoparticle Packings

Anil Yuksel, Paul S. Ho, Jayathi Murthy
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A025, August 29–September 1, 2017
Paper No: IPACK2017-74137
DOI: https://doi.org/10.1115/IPACK2017-74137
View Paper titled, Advanced Cooling of 3D ICs With Nanoparticle Packings
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Topics: Cooling, Nanoparticles, Packings (Cushioning), Energy dissipation, Heat, Thermal management, Dimensions, High temperature, Phonons, Polaritons
Proceedings Papers

Effect of Alloy Composition and Aging on the Survivability of Leadfree Solders in High Temperature Vibration in Automotive Environments

Pradeep Lall, Vikas Yadav, Di Zhang, Jeff Suhling
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A017, August 29–September 1, 2017
Paper No: IPACK2017-74233
DOI: https://doi.org/10.1115/IPACK2017-74233
View Paper titled, Effect of Alloy Composition and Aging on the Survivability of Leadfree Solders in High Temperature Vibration in Automotive Environments
Click here to open pdf in another window PDF for Effect of Alloy Composition and Aging on the Survivability of Leadfree Solders in High Temperature Vibration in Automotive Environments
Topics: Alloys, High temperature, Lead-free solders, Vibration, Temperature, Electronics, Vehicles, Solder joints, Solders, Automotive industry
Proceedings Papers

Numerical and Experimental Determination of Temperature Distribution in 3D Stacked Power Devices

Adam Morgan, Leila Choobineh, David Fresne, Douglas C. Hopkins
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A002, August 29–September 1, 2017
Paper No: IPACK2017-74222
DOI: https://doi.org/10.1115/IPACK2017-74222
View Paper titled, Numerical and Experimental Determination of Temperature Distribution in 3D Stacked Power Devices
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Topics: Temperature distribution, Electronic packaging, Packaging, Power density, Power semiconductor devices, Power conversion systems, Temperature, Computer simulation, Density, Gallium nitride
Proceedings Papers

Investigation of Aging Induced Evolution of the Microstructure of SAC305 Lead Free Solder

Nianjun Fu, Jing Wu, Sudan Ahmed, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A010, August 29–September 1, 2017
Paper No: IPACK2017-74266
DOI: https://doi.org/10.1115/IPACK2017-74266
View Paper titled, Investigation of Aging Induced Evolution of the Microstructure of SAC305 Lead Free Solder
Click here to open pdf in another window PDF for Investigation of Aging Induced Evolution of the Microstructure of SAC305 Lead Free Solder
Topics: Lead-free solders, Tin, Cross section (Physics), Microscopy, Particulate matter, Cooling, Intermetallic compounds, Nanoindentation, Polishing, Scanning electron microscopy
Proceedings Papers

The Effect of Surface Texture on Thermal Sensation and Comfort

Han Zhang, Alan Hedge
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A026, August 29–September 1, 2017
Paper No: IPACK2017-74179
DOI: https://doi.org/10.1115/IPACK2017-74179
View Paper titled, The Effect of Surface Texture on Thermal Sensation and Comfort
Click here to open pdf in another window PDF for The Effect of Surface Texture on Thermal Sensation and Comfort
Topics: Computers, Heat, Surface roughness, Surface texture, Surfaces (Materials), Temperature
Proceedings Papers

Effect of Corner Staking on the Fatigue Life of BGA Under Thermal Cycling

Deng Yun Chen, Michael Osterman
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A018, August 29–September 1, 2017
Paper No: IPACK2017-74249
DOI: https://doi.org/10.1115/IPACK2017-74249
View Paper titled, Effect of Corner Staking on the Fatigue Life of BGA Under Thermal Cycling
Click here to open pdf in another window PDF for Effect of Corner Staking on the Fatigue Life of BGA Under Thermal Cycling
Topics: Ball-Grid-Array packaging, Corners (Structural elements), Fatigue life, Solder joints, Solders, Adhesives, Failure, Materials properties, Stress, Temperature
Proceedings Papers

Analysis for Evaluation of Threshold Current Density of Electromigration Damage in Taper-Shaped Metal Line

Hiroki Kikuchi, Kazuhiko Sasagawa, Kazuhiro Fujisaki
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A003, August 29–September 1, 2017
Paper No: IPACK2017-74059
DOI: https://doi.org/10.1115/IPACK2017-74059
View Paper titled, Analysis for Evaluation of Threshold Current Density of Electromigration Damage in Taper-Shaped Metal Line
Click here to open pdf in another window PDF for Analysis for Evaluation of Threshold Current Density of Electromigration Damage in Taper-Shaped Metal Line
Topics: Current density, Damage, Electrodiffusion, Metals, Evaluation methods, Atoms, Circuit design, Computer simulation, Density, Electrons
Proceedings Papers

An Investigation of Moisture-Induced Interfacial Delamination in Plastic IC Package During Solder Reflow

Jing Wang, Yuling Niu, Seungbae Park
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A011, August 29–September 1, 2017
Paper No: IPACK2017-74017
DOI: https://doi.org/10.1115/IPACK2017-74017
View Paper titled, An Investigation of Moisture-Induced Interfacial Delamination in Plastic IC Package During Solder Reflow
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Topics: Delamination, Reflow soldering, Fracture (Materials), Stress, Vapor pressure, Ball-Grid-Array packages, Displacement, Finite element analysis, Fracture mechanics, Lead-free solders
Proceedings Papers

Optimization of Filling Mass Fraction for Composite PCMs Based Thermal Management System

Bofeng Shang, Jinyan Hu, Xingjian Yu, Bin Xie, Ruikang Wu, Xiaobing Luo
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A027, August 29–September 1, 2017
Paper No: IPACK2017-74196
DOI: https://doi.org/10.1115/IPACK2017-74196
View Paper titled, Optimization of Filling Mass Fraction for Composite PCMs Based Thermal Management System
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Topics: Composite materials, Optimization, Phase change materials, Thermal management, Thermal conductivity, Latent heat, Temperature, Heat flux, Cooling, Graphite
Proceedings Papers

Relationship Between Threshold Current Density of Electromigration Damage Considering Void and Hillock Formation and Reservoir Shape in Interconnect Line

Ryuji Takaya, Kazuhiko Sasagawa, Kazuhiro Fujisaki, Takeshi Moriwaki
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A004, August 29–September 1, 2017
Paper No: IPACK2017-74092
DOI: https://doi.org/10.1115/IPACK2017-74092
View Paper titled, Relationship Between Threshold Current Density of Electromigration Damage Considering Void and Hillock Formation and Reservoir Shape in Interconnect Line
Click here to open pdf in another window PDF for Relationship Between Threshold Current Density of Electromigration Damage Considering Void and Hillock Formation and Reservoir Shape in Interconnect Line
Topics: Current density, Damage, Electrodiffusion, Reservoirs, Shapes, Density, Anodes, Computer simulation