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Keywords: material properties analysis
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Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A022, October 7–9, 2019
Paper No: IPACK2019-6499
... is 1.35 10 6 1/K and 0.994 10 6 1/K for sapphire at 5.7 K. The results from this validation have a mean error percentage of less than 6 %. Keywords: cryogenics, thermal expansion mismatch, strain gauge method, silicon nitride, sapphire, material properties analysis NOMENCLATURE change of resistance...