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Proceedings Papers

Quantitative Characterization of Sapphire and Silicon Nitride for Space Applications Circuit Subassemblies Using Cryogenic Cycling

Kirsten Lovelace, Sonya Smith
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A022, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6499
https://doi.org/10.1115/IPACK2019-6499
... Abstract This research investigates the effects of thermal cycling from room to cryogenic temperatures (300K–4K) on the thermal expansion coefficient of two ceramic substrates of Silicon Nitride (Si 3 N 4 ) and alpha-Alumina/Sapphire (α-Al 2 O 3 ). Due to the shortage of available data...
View Paper titled, Quantitative Characterization of Sapphire and <span class="search-highlight">Silicon</span> <span class="search-highlight">Nitride</span> for Space Applications Circuit Subassemblies Using Cryogenic Cycling
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Topics: Circuits, Sapphire, Silicon nitride ceramics, Thermal expansion