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Keywords: silicon nitrideClose
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A022, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6499
... Abstract This research investigates the effects of thermal cycling from room to cryogenic temperatures (300K–4K) on the thermal expansion coefficient of two ceramic substrates of Silicon Nitride (Si 3 N 4 ) and alpha-Alumina/Sapphire (α-Al 2 O 3 ). Due to the shortage of available data...