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Keywords: thermal expansion mismatch
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Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A022, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6499
... and thermal design of engineered systems, such as, space electronic devices. Thermal expansion mismatch causes substantial problems in space electronic device reliability because of the various stresses imposed on the joint materials undergoing extreme thermal cycles. Theory supports the advantage...