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Keywords: thermal expansion mismatch
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Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A022, October 7–9, 2019
Paper No: IPACK2019-6499
... Institute of Standards and Technology (NIST) property data as a proof of concept. Accurate thermal contraction data of materials at low temperatures are important in material selection and thermal design of engineered systems, such as, space electronic devices. Thermal expansion mismatch causes substantial...