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Journal Articles

Effect of Microstructure on Electromigration-Induced Stress

Antoinette M. Maniatty, Jiamin Ni, Yong Liu, Hongqing Zhang
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Research-Article
J. Appl. Mech. January 2016, 83(1): 011010.
Paper No: JAM-15-1376
https://doi.org/10.1115/1.4031837
Published Online: November 9, 2015
View Article titled, Effect of Microstructure on Electromigration-Induced Stress
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Topics: Diffusion (Physics), Electrodiffusion, Solder joints, Stress, Tin, Current density, Crystals, Finite element analysis, Strain measurement
Journal Articles

Strain Rate Effects and Rate-Dependent Constitutive Models of Lead-Based and Lead-Free Solders

Fei Qin, Tong An, Na Chen
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Research Papers
J. Appl. Mech. January 2010, 77(1): 011008.
https://doi.org/10.1115/1.3168600
Published Online: September 30, 2009
View Article titled, Strain Rate Effects and Rate-Dependent Constitutive Models of Lead-Based and Lead-Free Solders
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Topics: Constitutive equations, Lead-free solders, Solder joints, Solders, Stress, Tensile strength, Stress-strain curves, Mechanical properties, Reliability, Ductility
Journal Articles

Quantitative Characterization of a Flip-Chip Solder Joint

S. K. Patra, S. S. Sritharan, Y. C. Lee
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Technical Papers
J. Appl. Mech. June 1995, 62(2): 390–397.
https://doi.org/10.1115/1.2895943
Published Online: June 1, 1995
View Article titled, Quantitative Characterization of a Flip-Chip Solder Joint
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Topics: Flip-chip, Solder joints, Solders, Computer simulation, Design, Energy conservation, Numerical analysis, Shapes
Journal Articles

Axisymmetric Elastic Deformations of a Finite Circular Cylinder With Application to Low Temperature Strains and Stresses in Solder Joints

E. Suhir
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Research Papers
J. Appl. Mech. June 1989, 56(2): 328–333.
https://doi.org/10.1115/1.3176087
Published Online: June 1, 1989
View Article titled, Axisymmetric Elastic Deformations of a Finite Circular Cylinder With Application to Low Temperature Strains and Stresses in Solder Joints
Open the PDF for Axisymmetric Elastic Deformations of a Finite Circular Cylinder With Application to Low Temperature Strains and Stresses in Solder Joints in another window
Topics: Circular cylinders, Deformation, Low temperature, Solder joints, Stress, Solders, Alloys, Failure, Thermal expansion, Thermomechanics