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Keywords: lead alloys
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Journal Articles
Article Type: Research Papers
J. Appl. Mech. January 2010, 77(1): 011008.
Published Online: September 30, 2009
... ductility electronics packaging impact (mechanical) lead alloys reliability silver alloys solders stress-strain relations tensile strength tin alloys 22 07 2008 13 03 2009 30 09 2009 Young’s modulus ( E ) , yield stress ( σ y ) , ultimate tensile...
Journal Articles
Article Type: Technical Papers
J. Appl. Mech. January 2002, 69(1): 1–10.
Published Online: June 8, 2001
... of the paper itself in the ASME JOURNAL OF APPLIED MECHANICS . 07 March 2001 08 June 2001 lead alloys tin alloys soldering fatigue micromechanics crystal microstructure fracture mechanics microcracks percolation Solder connections in electronic packaging are expected...