Research Papers

Molecular Dynamics Simulation Study of Tool Wear in Vibration Assisted Nano-Impact-Machining by Loose Abrasives

[+] Author and Article Information
Sagil James

Department of Mechanical and
Materials Engineering,
University of Cincinnati,
Cincinnati, OH 45221
e-mail: jamess5@mail.uc.edu

Murali M. Sundaram

Department of Mechanical
and Materials Engineering,
University of Cincinnati,
Cincinnati, OH 45221
e-mail: murali.sundaram@uc.edu

1Corresponding author.

Contributed by the Manufacturing Engineering Division of ASME for publication in the JOURNAL OF MICRO AND NANO-MANUFACTURING. Manuscript received September 25, 2013; final manuscript received October 3, 2014; published online October 30, 2014. Assoc. Editor: Bin Wei.

J. Micro Nano-Manuf 3(1), 011001 (Oct 30, 2014) (7 pages) Paper No: JMNM-13-1071; doi: 10.1115/1.4028782 History: Received September 25, 2013; Revised October 03, 2014

Vibration assisted nano-impact-machining by loose abrasives (VANILA) is a novel target specific nano-abrasive machining process wherein, nano-abrasives, injected in slurry between the workpiece and the vibrating atomic force microscope probe, impact the workpiece causing nanoscale material removal. In this study, a molecular dynamics (MD) based simulation approach is used to investigate the tool wear mechanism. The simulation results reveal that the tool wear is influenced by the impact velocity of the abrasive grains and the effective tool tip radius. It is seen that based on the process conditions, the wear process could happen through distinctive mechanisms such as atom-by-atom loss, plastic deformation, and brittle fracture. Experimental results show evidences of tool wear by aforementioned mechanisms in VANILA process.

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Sundaram, M. M., and James, S., 2011, “Vibration Assisted Nano Abrasive Machining,” 7th International Conference on Precision, Meso, Micro and Nano Engineering (COPEN), College of Engineering, Pune, India, Dec. 10–11, pp. 20–25.
James, S., and Sundaram, M. M., 2012, “A Feasibility Study of Vibration-Assisted Nano-Impact Machining by Loose Abrasives Using Atomic Force Microscope,” ASME J. Manuf. Sci. Eng., 134(6), p. 061014. [CrossRef]
James, S., and Sundaram, M. M., 2013, “A Molecular Dynamics Study of the Effect of Impact Velocity, Particle Size and Angle of Impact of Abrasive Grain in the Vibration Assisted Nano Impact-Machining by Loose Abrasives,” Wear, 303(1), pp. 510–518. [CrossRef]
Agrawal, R., Moldovan, N., and Espinosa, H., 2009, “An Energy-Based Model to Predict Wear in Nanocrystalline Diamond Atomic Force Microscopy Tips,” J. Appl. Phys., 106(6), p. 064311. [CrossRef]
Robinson, G. M., Jackson, M. J., and Whitfield, M. D., 2007, “A Review of Machining Theory and Tool Wear With a View to Developing Micro and Nano Machining Processes,” J. Mater. Sci., 42(6), pp. 2002–2015. [CrossRef]
Lane, B. M., 2012, “Material Effects and Tool Wear in Vibration Assisted Machining,” Ph.D. dissetation, North Carolina State University, Raleigh, NC.
Cai, M., Li, X., and Rahman, M., 2007, “Characteristics of Dynamic Hard Particles in Nanoscale Ductile Mode Cutting of Monocrystalline Silicon With Diamond Tools in Relation to Tool Groove Wear,” Wear, 263(7), pp. 1459–1466. [CrossRef]
Liu, J., Notbohm, J. K., Carpick, R. W., and Turner, K. T., 2010, “Method for Characterizing Nanoscale Wear of Atomic Force Microscope Tips,” ACS Nano, 4(7), pp. 3763–3772. [CrossRef] [PubMed]
Bhaskaran, H., Gotsmann, B., Sebastian, A., Drechsler, U., Lantz, M. A., Despont, M., Jaroenapibal, P., Carpick, R. W., Chen, Y., and Sridharan, K., 2010, “Ultralow Nanoscale Wear Through Atom-By-Atom Attrition in Silicon-Containing Diamond-Like Carbon,” Nat. Nanotechnol., 5(3), pp. 181–185. [CrossRef] [PubMed]
Kim, H. J., Yoo, S. S., and Kim, D. E., 2012, “Nano-Scale Wear: A Review,” Int. J. Precis. Eng. Manuf., 13(9), pp. 1709–1718. [CrossRef]
Bassani, R., and D'Acunto, M., 2000, “Nanotribology: Tip–Sample Wear Under Adhesive Contact,” Tribol. Int., 33(7), pp. 443–452. [CrossRef]
Colaço, R., 2009, “An AFM Study of Single-Contact Abrasive Wear: The Rabinowicz Wear Equation Revisited,” Wear, 267(11), pp. 1772–1776. [CrossRef]
D'Acunto, M., 2004, “Theoretical Approach for the Quantification of Wear Mechanisms on the Nanoscale,” Nanotechnology, 15(7), pp. 795–801. [CrossRef]
Cleveland, J., Anczykowski, B., Schmid, A., and Elings, V., 1998, “Energy Dissipation in Tapping-Mode Atomic Force Microscopy,” Appl. Phys. Lett., 72(20), pp. 2613–2615. [CrossRef]
Chung, K. H., Lee, Y. H., and Kim, D. E., 2005, “Characteristics of Fracture During the Approach Process and Wear Mechanism of a Silicon AFM Tip,” Ultramicroscopy, 102(2), pp. 161–171. [CrossRef] [PubMed]
Bloo, M., Haitjema, H., and Pril, W., 1999, “Deformation and Wear Of Pyramidal, Silicon–Nitride AFM Tips Scanning Micrometre-Size Features in Contact Mode,” Measurement, 25(3), pp. 203–211. [CrossRef]
Bhushan, B., and Kwak, K. J., 2007, “Platinum-Coated Probes Sliding at up to 100 Mm S1 Against Coated Silicon Wafers for AFM Probe-Based Recording Technology,” Nanotechnology, 18(34), p. 345504. [CrossRef]
Khurshudov, A., and Kato, K., 1995, “Wear of the Atomic Force Microscope Tip Under Light Load, Studied by Atomic Force Microscopy,” Ultramicroscopy, 60(1), pp. 11–16. [CrossRef]
Chung, K. H., and Kim, D. E., 2007, “Wear Characteristics of Diamond-Coated Atomic Force Microscope Probe,” Ultramicroscopy, 108(1), pp. 1–10. [CrossRef] [PubMed]
Skårman, B., Wallenberg, L. R., Jacobsen, S. N., Helmersson, U., and Thelander, C., 2000, “Evaluation of Intermittent Contact Mode AFM Probes by HREM and Using Atomically Sharp CeO2 Ridges as Tip Characterizer,” Langmuir, 16(15), pp. 6267–6277. [CrossRef]
Wong, T., Kim, W., and Kwon, P., 2004, “Experimental Support for a Model-Based Prediction of Tool Wear,” Wear, 257(7), pp. 790–798. [CrossRef]
Cheng, K., Luo, X., Ward, R., and Holt, R., 2003, “Modeling and Simulation of the Tool Wear in Nanometric Cutting,” Wear, 255(7–12), pp. 1427–1432. [CrossRef]
Maekawa, K., and Itoh, A., 1995, “Friction and Tool Wear in Nano-Scale Machining—A Molecular Dynamics Approach,” Wear, 188(1), pp. 115–122. [CrossRef]
Lu, C., Gao, Y., Michal, G., Huynh, N., Zhu, H., and Tieu, A., 2009, “Atomistic Simulation of Nanoindentation of Iron With Different Indenter Shapes,” Proc. Inst. Mech. Eng., Part J, 223(7), pp. 977–984. [CrossRef]
Komvopoulos, K., and Yan, W., 1997, “Molecular Dynamics Simulation of Single and Repeated Indentation,” J. Appl. Phys., 82(10), pp. 4823–4830. [CrossRef]
Zhu, P., Hu, Y., Wang, H., and Ma, T., 2011, “Study of Effect of Indenter Shape in Nanometric Scratching Process Using Molecular Dynamics,” Mater. Sci. Eng. A, 528(13), pp. 4522–4527. [CrossRef]
Mylvaganam, K., and Zhang, L. C., 2009, “Scale Effect of Nano-Indentation of Silicon—A Molecular Dynamics Investigation,” Key Eng. Mater., 389, pp. 521–526. [CrossRef]
Gotsmann, B., and Lantz, M. A., 2008, “Atomistic Wear in a Single Asperity Sliding Contact,” Phys. Rev. Lett., 101(12), p. 125501. [CrossRef] [PubMed]
Goel, S., Luo, X., and Reuben, R. L., 2012, “Molecular Dynamics Simulation Model for the Quantitative Assessment of Tool Wear During Single Point Diamond Turning of Cubic Silicon Carbide,” Comput. Mater. Sci., 51(1), pp. 402–408. [CrossRef]
Cheong, W. C. D., and Zhang, L., 2000, “Effect of Repeated Nano-Indentations on the Deformation in Monocrystalline Silicon,” J. Mater. Sci. Lett., 19(5), pp. 439–442. [CrossRef]
Kang, K., and Cai, W., 2007, “Brittle and Ductile Fracture of Semiconductor Nanowires—Molecular Dynamics Simulations,” Philos. Mag., 87(14–15), pp. 2169–2189. [CrossRef]
Tersoff, J., 1989, “Modeling Solid-State Chemistry: Interatomic Potentials for Multicomponent Systems,” Phys. Rev. B, 39(8), pp. 5566–5568. [CrossRef]
Inamura, T., Shishikura, Y., and Takezawa, N., 2010, “Mechanism of Ring Crack Initiation in Hertz Indentation of Monocrystalline Silicon Analyzed by Controlled Molecular Dynamics,” CIRP Ann. Manuf. Technol., 59(1), pp. 559–562. [CrossRef]
Cai, M., Li, X., Rahman, M., and Tay, A., 2007, “Crack Initiation in Relation to the Tool Edge Radius and Cutting Conditions in Nanoscale Cutting of Silicon,” Int. J. Mach. Tools Manuf., 47(3), pp. 562–569. [CrossRef]
Luo, X., Goel, S., and Reuben, R. L., 2012, “A Quantitative Assessment of Nanometric Machinability of Major Polytypes of Single Crystal Silicon Carbide,” J. Eur. Ceram. Soc, 32(12), pp. 3423–3434. [CrossRef]
Tanaka, H., Shimada, S., and Anthony, L., 2007, “Requirements for Ductile-Mode Machining Based on Deformation Analysis of Mono-Crystalline Silicon by Molecular Dynamics Simulation,” CIRP Ann. Manuf. Technol., 56(1), pp. 53–56. [CrossRef]
Komanduri, N. C. L. M. R., 2001, “Molecular Dynamics Simulation of the Nanometric Cutting of Silicon,” Plant Ecol. Diversity, 81(12), pp. 1989–2019. [CrossRef]
Inamura, T., Takezawa, N., and Shimada, S., 2002, “Importance of Micro/Macro Interaction in the Mechanism of Brittle Mode Cutting,” CIRP Ann. Manuf. Technol., 51(1), pp. 487–490. [CrossRef]
Cheong, W., and Zhang, L., 2000, “Molecular Dynamics Simulation of Phase Transformations in Silicon Monocrystals Due to Nano-Indentation,” Nanotechnology, 11(3), pp. 173–180. [CrossRef]
Mattoni, A., Ippolito, M., and Colombo, L., 2007, “Atomistic Modeling of Brittleness in Covalent Materials,” Phys. Rev. B, 76(22), p. 224103. [CrossRef]
Buehler, M. J., 2008, Atomistic Modeling of Materials Failure, Springer, New York.
Holland, D. J. M., and Marder, M., 1999, “Cracks and Atoms,” Adv. Mater., 11(10), pp. 793–806. [CrossRef]
Plimpton, S., 1995, “Fast Parallel Algorithms for Short-Range Molecular Dynamics,” J. Comput. Phys., 117(1), pp. 1–19. [CrossRef]
Abdel-Al, H. A., and Smith, S. T., “Thermal Modeling of Silicon Machining—Issues and Challenges,” Proceedings of the ASPE Spring Topical Meeting: Silicon Machining, Carmel-by-the Sea, CA, Apr. 13–16, pp. 27–31.
Rhee, Y. W., Kim, H. W., Deng, Y., and Lawn, B. R., 2001, “Brittle Fracture Versus Quasi Plasticity in Ceramics: A Simple Predictive Index,” J. Am. Ceram. Soc., 84(3), pp. 561–565. [CrossRef]
Johnson, K. L., 1987, Contact Mechanics, Cambridge University, Cambridge, MA.


Grahic Jump Location
Fig. 1

Schematic of the VANILA process: (a) Tool striking the abrasive particle, (b) abrasive particle impacting workpiece surface, and (c) material removal from the workpiece.

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Fig. 2

VANILA process machining results: (a) Pattern design, (b) AFM image of nanocavities machined on silicon substrate [2], (c) pattern design, and (d) AFM image of nanocavities machined on borosilicate glass substrate.

Grahic Jump Location
Fig. 3

Schematic of MD simulation model used to study tool tip wear during VANILA process

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Fig. 4

MD simulation of tool wear in VANILA process: (a) before impact and (b) after impact

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Fig. 5

Possible mechanisms of tool wear during VANILA process: (a) Atom-by-atom attrition, (b) ductile mode, and (c) radial cracking

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Fig. 6

Tool wear mechanism map

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Fig. 7

Number of atoms removed versus impact velocity

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Fig. 8

Number of atoms removed versus abrasive grain size

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Fig. 9

Number of atoms removed versus effective tip radius

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Fig. 10

Tool tip showing wear zones

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Fig. 11

SEM images showing tool wear of silicon tips used in VANILA process: (a) Side view before machining, (b) bottom view before machining, (c) side view atom-by-atom loss, (d) bottom view atom-by-atom loss, (e) side view plastic deformation, (f) bottom view plastic deformation, (g) side view brittle fracture, and (h) bottom view brittle fracture.



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