Thermal stress is a significant contributor to a component’s failure during manufacturing processes. In the electronic industry, for example, it is very common that components experience an extensive number of nonuniform, local heating cycles throughout its life time. In order to promote reliability, components are put through burn-in which creates a very nonuniform temperature distribution. In order to reduce cost, reworkability is considered to be a necessary option for the manufacturing processes to achieve high yield; these rework processes usually require localized heating. In addition, due to certain functionality requirements, materials with different coefficients of thermal expansion are cast together. The thermal mismatch caused by nonuniform temperature and/or different coefficients of thermal expansion will create thermal stress which could result in the cracking of the components. The fracture often initiates on the interface between the different materials or at the free edge of the surface. To make the problems mathematically tractable, the problems here are simplified as linear thermo-elastic and axisymmetric. It is concluded that the displacement distribution is one order higher than the temperature distribution if the temperature is a polynominal function of the radial distance from the center of a disk. The solutions also show the effect of the edge boundary conditions on the stress level; namely a certain degree of constrained edge support will reduce the tensile stress around the edge of the plate. This will reduce the failure rate of the plate, particularly for a brittle material. Finally, a numerical finite element solution for a square plate with a localized heating source is given to demonstrate the applications of the analytical solutions to fixture design during the process development.
Skip Nav Destination
Article navigation
June 1993
Research Papers
Analytical Solutions of Stresses in a Cylindrical Plate Due to Polynomial Radial Temperature Distributions
Frank F. H. Wu
Frank F. H. Wu
IBM TP, East Fishkill, Hopewell Junction, New York
Search for other works by this author on:
Frank F. H. Wu
IBM TP, East Fishkill, Hopewell Junction, New York
J. Electron. Packag. Jun 1993, 115(2): 214-218 (5 pages)
Published Online: June 1, 1993
Article history
Received:
April 12, 1993
Online:
April 28, 2008
Citation
Wu, F. F. H. (June 1, 1993). "Analytical Solutions of Stresses in a Cylindrical Plate Due to Polynomial Radial Temperature Distributions." ASME. J. Electron. Packag. June 1993; 115(2): 214–218. https://doi.org/10.1115/1.2909320
Download citation file:
11
Views
Get Email Alerts
Cited By
Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation
J. Electron. Packag (December 2024)
Special Issue on InterPACK2023
J. Electron. Packag
Extreme Drop Durability of Sintered Silver Traces Printed With Extrusion and Aerosol Jet Processes
J. Electron. Packag (December 2024)
Related Articles
Nonlinear Viscoelastic Finite Element Analysis of Physical Aging in an Encapsulated Transformer
J. Electron. Packag (March,2009)
Thermoelastic Stresses in an Axisymmetric Thick-Walled Tube Under an Arbitrary Internal Transient
J. Pressure Vessel Technol (August,2004)
Approximate Direct and Inverse Relationships for Thermal and Stress States in Thick-Walled Vessels Under Thermal Shock
J. Pressure Vessel Technol (February,2007)
Thermal Stresses in an Infinite Slab Under an Arbitrary Thermal Shock
J. Appl. Mech (September,2003)
Related Proceedings Papers
Related Chapters
Subsection NB—Class 1 Components
Companion Guide to the ASME Boiler & Pressure Vessel Codes, Volume 1 Sixth Edition
Understanding the Problem
Design and Application of the Worm Gear
Design for Displacement Strains
Process Piping: The Complete Guide to ASME B31.3, Fourth Edition