The compliant nature of flexible substrates subject to assembly forces can result in severe misregistration of the component leads and substrate bond pads, leading to assembly process defects. Specially dedicated tooling for fixturing thin flexible substrates in standard surface mount assembly equipment is gaining importance. This paper focuses on developing a theoretical foundation for implementing Smart Tooling of fixturing thin flexible substrates. The primary goals are to determine the impact of fixturing tooling on assembly process quality, to develop a displacement theory to predict transverse displacements, and to analyze the optimum perimeter fixturing configuration. The predictive capabilities of the transverse displacement model are verified.
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December 2001
Additional Technical Papers
Displacement Theory for Fixturing Design of Thin Flexible Circuit Board Assembly
Ruijun Chen, Assoc. Mem. ASME,
Ruijun Chen, Assoc. Mem. ASME
Advanced Assembly Process Technology—AdAPT Laboratory, The George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA 30332-0405
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Daniel F. Baldwin, Assoc. Mem. ASME
e-mail: daniel.baldwin@me.gatech.edu
Daniel F. Baldwin, Assoc. Mem. ASME
Advanced Assembly Process Technology—AdAPT Laboratory, The George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA 30332-0405
Search for other works by this author on:
Ruijun Chen, Assoc. Mem. ASME
Advanced Assembly Process Technology—AdAPT Laboratory, The George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA 30332-0405
Daniel F. Baldwin, Assoc. Mem. ASME
Advanced Assembly Process Technology—AdAPT Laboratory, The George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA 30332-0405
e-mail: daniel.baldwin@me.gatech.edu
Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received by the EPPD July 6, 2000; revised manuscript received November 2000. Associate Editor: B. Courtois.
J. Electron. Packag. Dec 2001, 123(4): 388-393 (6 pages)
Published Online: November 1, 2000
Article history
Received:
July 6, 2000
Revised:
November 1, 2000
Citation
Chen, R., and Baldwin, D. F. (November 1, 2000). "Displacement Theory for Fixturing Design of Thin Flexible Circuit Board Assembly ." ASME. J. Electron. Packag. December 2001; 123(4): 388–393. https://doi.org/10.1115/1.1371926
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