This paper represents my personal recapitulation of my 4 decades of continuous involvement in all phases of electronic cooling, from conceptual design, through engineering development to product implementation. The cooling designs that we applied successfully in the past are reviewed chronologically. The challenges we are currently facing are also discussed and an attempt is made to forecast the challenges that will confront the electronics cooling community in the near and distant future. The paper includes a summary of IBM sponsored research spanning a period of 25 years at 12 universities on a wide range of topics related to electronic cooling technology.
Issue Section:
Research Paper
Keywords:
thermal management (packaging),
integrated circuit packaging,
modules,
heat exchangers,
product development,
cooling
Topics:
Cooling
1.
Bergles
, A. E.
, 1986
, “The Evolution of Cooling Technology for Electrical, Electronic, and Microelectronic Equipment
,” ASME HTD
, 57
, pp. 1
–9
.2.
Hanson, D., 1982, The New Alchemists, Avon, New York.
3.
Seely, J. H., and Chu, R. C., 1972, Heat Transfer in Microelectronic Equipment, Dekker, New York.
4.
Antonetti, V. W., Chu, R. C., and Seely, J. H., 1967, “Thermal Design for IBM System/360 Model 91,” Proceedings of the Eight International Electronic Circuit Packaging Symposium, San Francisco, CA.
5.
Antonetti
, V. W.
, Simons
, R. E.
, and Arent
, G. R.
, 1973
, “Cooling A Hot Computer
,” Electro Mechanical Design
, 17
(9
), pp. 34
–37
.6.
Hwang, U. P., and Simons, R. E., 1980, “Dual-Pull Air Cooling for Computer Frame,” U.S. Patent 4,233,644.
7.
Oktay, D., Dessauer, B., and Horvath, J. L., 1983, “New Internal and External Cooling Enhancements for the Air-Cooled IBM 4381 Module,” presented at IEEE International Conference on Computer Design: VLSI in Computers, Port Chester, NY.
8.
Chu, R. C., Gupta, O. R., Hwang, U. P., and Simons, R. E., 1976, “Gas Encapsulated Cooling Module,” U.S. Patent 3,741,292.
9.
Singh
, P.
, Becker
, D.
, Cozzolino
, V.
, Ellsworth
, M.
, Schmidt
, R.
, and Seminaro
, E.
, 1998
, “System Packaging for a CMOS Mainframe
,” Adv. Microelectron.
, 25
, No. (7
), pp. 12
–17
.10.
Bergles
, A. E.
, 1988
, “High Heat Flux Boiling Applied to Micro-electronics Thermal Control
,” Int. Commun. Heat Mass Transfer
, 15
, pp. 509
–531
.11.
Pugh, E., Johnson, L., and Palmer, J., 1991, IBM’s 360 and Early 370 Systems, MIT, Cambridge.
12.
Chu, R. C., Gupta, O. R., Hwang, U. P., Moran, K. P., and Simons, R. E., 1969, “Liquid Cooling Technology for High-Performance Packages and Systems,” IBM TR 00.1945.
13.
Chu, R. C., Gupta, O. R., Hwang, U. P., Moran, K. P., and Simons, R. E., 1971, “Cooling System for Data Processing Equipment,” U.S. Patent 3,568,101.
14.
Aakalu, N. G., Chu, R. E., and Simons, R. E., 1973, “Liquid Encapsulated Air Cooled Module,” U.S. Patent 3,741,292.
15.
Chu, R. C., and Simons, R. E., 1996, “Review of Boiling Heat Transfer for Cooling of High-Power Density Integrated Circuit Chips,” in Process, Enhanced, and Multiphase Heat Transfer: A Festschrift for A. E. Bergles, Bergles, A. E., Manglik, R. M., and Kraus, A. D., eds., Begell House, New York.
16.
Sperry, C., Claybaker, P., Cree, R., Gill, J., Ing, P., Philstrom, R., and Webster, J., 1993, “SS-1 Supercomputer Cooling System,” Proceedings of the 43rd Electronic Components and Technology Conference.
17.
Chrysler
, G. M.
, Chu
, R. C.
, and Simons
, R. E.
, 1995
, “Jet Impingement Boiling of a Dielectric Coolant in Narrow Gaps
,” IEEE Trans. Compon., Packag. Manuf. Technol., Part A
, 18
(3
), pp. 527
–533
.18.
Vader
, D. T.
, Chrysler
, G. M.
, Chu
, R. C.
, and Simons
, R. E.
, 1995
, “Experimental Investigation of Subcooled Liquid Nitrogen Impingement Cooling of a Silicon Chip
,” IEEE Trans. Compon., Packag. Manuf. Technol., Part A
, 18
(4
), pp. 788
–794
.19.
Schmidt, R. R., 2000, “Low Temperature Electronics Cooling,” Electronics Cooling, 6, No. 3, pp. 18–24.
20.
Schmidt
, R. R.
, and Notohardjono
, B.
, 2002
, “High-End Server Low Temperature Cooling
,” IBM J. Res. Dev.
, 46
(2
), pp. 739
–751
.21.
Chu, R. C., and Simons, R. E., 1994, “Cooling Technology for High Performance Computers: IBM Sponsored University Research,” Cooling of Electronic Systems, Kakac, S., Yuncu, H., and Hijikata, K., eds., K. Luwer Academic, Dordrecht.
22.
Chu, R. C., 1999, “A Review of IBM Sponsored Research and Development Projects for Computer Cooling,” Proceedings of the 15th Semiconductor Thermal Measurement and Management Symposium, pp. 151–165.
23.
“Thermal Management,” National Electronics Manufacturing Technology Roadmaps, Chu, R. C. and Joshi, Y., co-chairs, 2002, National Electronics Manufacturing Initiative, Herndon, VA.
Copyright © 2004
by ASME
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