This paper focuses on the effect on rack inlet air temperatures as a result of maldistribution of airflows exiting the perforated tiles located adjacent to the fronts of the racks. The flow distribution exiting the perforated tiles was generated from a computational fluid dynamics (CFD) tool called Tileflow (trademark of Innovative Research, Inc.). Both raised floor heights and perforated tile-free areas were varied in order to explore the effect on rack inlet temperatures. The flow distribution exiting the perforated tiles was used as boundary conditions to the above-floor CFD model. A CFD model was generated for the room with electronic equipment installed on a raised floor. Forty racks of data processing (DP) equipment were arranged in rows in a data center cooled by chilled air exhausting from perforated floor tiles. The chilled air was provided by four A/C units placed inside a room 12.1 m wide×13.4 m long. Because the arrangement of the racks in the data center was symmetric, only half of the data center was modeled. The numerical modeling for the area above the raised floor was performed using a commercially available finite control volume computer code called Flotherm (trademark of Flomerics, Inc.). The flow was modeled using the k-e turbulence model. Results are displayed to provide some guidance on the design and layout of a data center.

Issue Section:
Research Paper
Keywords:
electronics packaging, HVAC, heat transfer, computational fluid dynamics, compressible flow, flow simulation, turbulence, numerical analysis
Topics:
Data centers, Flow (Dynamics), Temperature, Tiles, Computers
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