Both transient and steady-state experiments are performed to study the single-phase heat transfer characteristics on an array of four in-line, flush-mounted simulated chips in a vertical rectangular channel. Water is the coolant media, and the flow covers the wide range of laminar regimes with the Reynolds number, based on heat source length, from 800 to 2625. The effect of heat fluxes, coolant flow rates, and geometric parameters (such as chip configuration number) are investigated. The operation is extended to study the transient natural convection during an accidental stoppage of coolant flow due to loss of pumping power. Results compare favorably with those obtained from three-dimensional numerical calculations. The transient correlation recommended is
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December 2004
Research Papers
Experimental and Numerical Thermal Transient Behavior of Chips in a Liquid Channel During Loss of Pumping Power
C. P. Tso,
C. P. Tso
Faculty of Engineering & Technology, Multimedia University, Jalan Ayer Keroh Lama, 75450 Melaka, Malaysia
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K. W. Tou,
K. W. Tou
School of Mechanical and Production Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore 639798
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H. Bhowmik
H. Bhowmik
School of Mechanical and Production Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore 639798
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C. P. Tso
Faculty of Engineering & Technology, Multimedia University, Jalan Ayer Keroh Lama, 75450 Melaka, Malaysia
K. W. Tou
School of Mechanical and Production Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore 639798
H. Bhowmik
School of Mechanical and Production Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore 639798
Manuscript received October 8, 2003; revision received June 14, 2004. Review conducted by: Z. Suo.
J. Electron. Packag. Dec 2004, 126(4): 546-553 (8 pages)
Published Online: January 24, 2005
Article history
Received:
October 8, 2003
Revised:
June 14, 2004
Online:
January 24, 2005
Citation
Tso, C. P., Tou , K. W., and Bhowmik, H. (January 24, 2005). "Experimental and Numerical Thermal Transient Behavior of Chips in a Liquid Channel During Loss of Pumping Power ." ASME. J. Electron. Packag. December 2004; 126(4): 546–553. https://doi.org/10.1115/1.1827270
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