On January 1, 2000, the European project PROFIT commenced as a follow up to the successfully finished EC-funded projects DELPHI, SEED, and THERMINIC. PROFIT finished in March 2003. The project aimed at creating methods and tools to enable a sufficiently accurate measurement and prediction of temperature gradients in time and space required for a more accurate and timely assessment of cost, performance, safety, and reliability of electronic products in all stages of the product realization process. The PROFIT partners produced 55 deliverables and 83 conference and journal papers. The paper discusses some highlights of the project and indicates shortly their potential for small-scale applications.

Issue Section:
Technology Review
Keywords:
thermal management (packaging), semiconductor device packaging, product development, quality management, reliability, safety, electronics industry, Thermal Characterization, Compact Modeling, Dynamic Measurements, Test Dies, Reliability
Topics:
Modeling, Reliability, Safety, Steady state, Temperature, Computer software, Electronic products, Temperature gradient
1.
Lasance, C., 2003, “Final Report on the EC-Funded Thermal Project PROFIT,” Proc. 9th THERMINIC Workshop, Aix-en-Provence, pp. 283–290.
2.
Lasance, C., 2003, “Recent Progress in Thermal Compact Modelling,” Proc. SEMITHERM XIX, March, San Jose, pp. 290–299.
3.
Lasanc
,
C.
,
2001
, “
Two Benchmarks to Facilitate the Study of Compact Thermal Modeling Phenomena
,”
IEEE CPT
,
24
, pp.
559
–
565
.
4.
Lasance, C., 2002, “The Accuracy of BCI Compact Thermal Models for Non-Uniformly Distributed Boundary Conditions,” Proc. 8th THERMINIC Workshop, Madrid, pp. 251–259.
5.
Lasance
,
C.
,
2004
, “
The Influence of Various Common Assumptions on the Boundary-Condition-Independence of Compact Thermal Models
,”
IEEE CPT
,
27
, pp.
523
–
529
.
6.
Bosch, E., 2001, “Thermal Compact Models: An Alternative Approach,” Proc. 7th THERMINIC, Paris, pp. 191–196.
7.
Bosch, E., and Sabry, N., 2001, “Thermal Compact Models for Electronic Systems,” Proceedings of SEMI-THERM XVIII, San Jose, CA, pp. 21–29.
8.
Djadoenath, S., and Stehouwer, P., 2000, “Creation and Validation of Compact Thermal Models,” Proc. 6th THERMINIC, Budapest, pp. 217–222.
9.
Pape
,
H.
,
Schweitzer
,
D.
,
Janssen
,
J.
,
Morelli
,
A.
, and
Villa
,
C.
,
2003
, “
Thermal Transient Modeling And Experimental Validation In The European Project PROFIT
,”
IEEE CPT
,
27
, pp.
530
–
538
.
10.
Lasance, C., and Sabry, N., 2003, “The Use of Time-Dependent Temperature Response Curves for the Generation of (Dynamic) Compact Thermal Models,” Proc. Interpack, July.
11.
Farkas, G., Poppe, A., Kollar, E., and Stehouwer, P., 2003, “Dynamic Compact Models of Cooling Mounts for Fast Board Level Design,” Proc. SEMI-THERM XIX, 11–13 March, San Jose, CA, pp. 252–262.
12.
Bosch, E., and Lasance, C., 2000, “Accurate Measurement of Interface Thermal Resistance by Means of a Transient Method,” Proc. 16th SEMITHERM, San Jose CA, pp. 167–173.
13.
Bosch
,
E.
, and
Lasance
,
C.
,
2000
, “
High Accuracy Thermal Interface Measurement of Interface Thermal Resistance
,”
Electronics Cooling
,
6
(
3
), pp.
26
–
32
.
14.
Lasance, C., Nicole, C., and van Mil, M., 2003, “Test Equipment for the Measurement of Total Hemispherical Emissivity and Specific Heat,” Internal PROFIT report D5.2, 2003-04-08.
15.
Sze´kely
,
V.
,
Ress
,
S.
,
Poppe
,
A.
,
To¨ro¨k
,
S.
,
Magyari
,
D.
,
Benedek
,
Zs.
,
Torki
,
K.
,
Courtois
,
B.
, and
Rencz
,
M.
,
2000
, “
New Approaches in the Transient Thermal Measurements
,”
Microelectron. Eng.
,
31
, pp.
727
–
733
.
16.
Rencz
,
M.
,
2003
, “
New Possibilities in the Thermal Evaluation, Offered by Transient Testing
,”
Microelectron. Eng.
,
34
(
3
), pp.
171
–
177
.
17.
Szekely
,
V.
,
Rencz
,
M.
,
To¨ro¨k
,
S.
, and
Ress
,
S.
,
2001
, “
Calculating Effective Board Thermal Parameters from Transient Measurements
,”
IEEE Trans. Compon. Packag. Technol.
,
24
(
4
), pp.
605
–
610
.
18.
Rencz, M., Szekely, V., 2003, “Non-Linearity Issues in the Dynamic Compact Model Generation,” Proc. SEMI-THERM XIX, 11–13, March San Jose, pp. 263–270.
19.
Rencz, M., Poppe, A., Szekely, V., and Courtois, B., 2002, “Inclusion of RC Compact Models of Packages into Board Level Thermal Simulation Tools,” Proceedings SEMITHERM XVIII, 1–14 March, San Jose, CA, pp. 71–76.
20.
Warner, M, Parry, J., Bailey, C., Marooney, C., Reeves, H, and Pericleous, K., 2001, “FLO/STRESS: An Integrated Stress Solver for the CFD tool FLOTHERM,” Proceedings of IPACK 2001, 8–13 July, Kauai, Hawaii.
21.
Rencz, M., Szekely, V., Poppe, A., Torki, K., and Courtois, B., 2003, “Electro-Thermal Simulation for the Prediction of Chip Operation within the Package,” Proc. SEMI-THERM XIX, 11–13 March, San Jose, pp. 168–175.
22.
Lasance, C., 2003,“The Urgent Need for Widely Accepted Test Methods for Thermal Interface Materials,” Proc. SEMITHERM XIX, 11–13 March, San Jose, pp. 123–128.
23.
Benedek
,
Zs.
,
Courtois
,
B.
,
Farkas
,
G.
,
Kollar
,
E.
,
Mir
,
S.
,
Poppe
,
A.
,
Rencz
,
M.
,
Szekely
,
V.
, and
Torki
,
K.
,
2001
, “
A Scalable Multifunctional Thermal Test Chip Family: Design and Evaluation
,”
ASME J. Electron. Packag.
,
123
(
4
), pp.
323
–
330
.
24.
Radivojevic, Z., Abdul-Quadir, Y., Myllykoski, P. and Rantala, J., 2003, “Reliability Prediction for TFBGA Assemblies,” Proc. SEMI-THERM XIX, 11–13 March, San Jose, pp. 336–340.
25.
Lasance
,
C.
,
2003
, “
Thermally-Driven Reliability Issues in Microelectronic Systems: Status and Challenges
,”
Microelectron. Reliab.
,
43
, pp.
1969
–
1974
.
26.
van Spengen
,
M.
, “
MEMS Reliability from a Failure Mechanisms Perspective
,”
Microelectron. Reliab.
,
43
, pp.
1049
–
1060
.
Copyright © 2004
 by ASME
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