This paper reports on an area-selective adhesive wafer bonding, using photosensitive BCB from Dow Co. The strength of the fabricated bonds is characterized using the wedge-opening and tensile methods. The measured fracture toughness is with tensile strength up to 71 MPa. The potential application of BCB bonding is demonstrated on a concept of wafer-level chip-scale package for RF applications and microfilter array for microfluidic applications.
1.
Burghartz
, J. N.
, and Rejaei
, B.
, 2003
, “On the design of RF spiral inductors on silicon
,” IEEE Trans. Electron Devices
, 50
(3
), pp. 718
–729
.2.
Dekker
, R.
, Baltus
, P. G. M.
, and Maas
, H. G. R.
, 2003
, “Substrate transfer for RF technologies
,” IEEE Trans. Electron Devices
, 50
(3
), pp. 747
–757
.3.
vd Green, S. et al., 1997, “CMOS compatible wafer scale adhesive bonding for circuit transfer,” Proc. Transducers ’97, Chicago, Vol. 1, pp. 629–632.
4.
Garrou
, P. E.
et al., 1999
, “Stress-buffer and passivation processes for Si and GaAs IC’s and passive components using photosensitive BCB: process technology and reliability data
,” IEEE Trans. Adv. Packag.
, 22
(3
), pp. 487
–498
.5.
Law, S. P. C., and Chan, P. C. H., 2002, “Process issues on peripheral to area-array bond pad redistribution,” Proc. Adv. Pack. Materials, pp. 25–29.
6.
http://www.cyclotene.com/
7.
Nicklaus
, F.
et al., 2001
, “Low temperature full wafer adhesive bonding of structured wafers
,” Sens. Actuators, A
, 92
, pp. 235
–241
.8.
Oberhammer, J., and Stemme, G., 2003, “Incrementally etched electrical feedthroughs for wafer-level transfer of glass lid packages,” Proc. Transducers’03, Vol. 2, pp. 1832–1835.
9.
Chinoy
, P. B.
, 1997
, “Reactive ion etching of benzocyclobutene polymer films
,” IEEE Trans. Compon., Packag., Manuf. Technol., Part C
, 20
(3
), pp. 199
–206
.10.
Pardoen, T., Iker, F., Zhang, X. X., and Raskin, J. P., 2002, “Steady-state measurement of wafer bonding cracking resistance,” Proc. Eurosensors XVI, Prague, Czech Republic, pp. 294–297.
11.
Maszara
, W. P.
, Goetz
, G.
, Caviglia
, G.
, and McKitterick
, J. B.
, 1998
, “Bonding of silicon wafers for silicon-on-insulator
,” J. Appl. Phys.
, 64
(10
), p. 4943
4943
.12.
Suwito
, W.
, Dunna
, M. L.
, Cunningham
, S. J.
, and Read
, D. T.
, 1999
, “Elastic moduli, strength, and fracture initiation at sharp notches in etched single crystal silicon microstructures
,” J. Appl. Phys.
, 85
(7
), pp. 3519
–3533
.13.
Corning Co. product datasheet Pyrex 7740.
14.
Liu
, Z.
, and De Voe
, D. L.
, 2000
, “Micromechanism fabrication using silicon fusion bonding
,” Rob. Comput.-Integr. Manufact.
, 17
, pp. 131
–137
.15.
http://www.loctite.com/
16.
Im
, J.
, Shaffer
, E.
, Stokich
, T.
, Strandjord
, A.
, Hetzner
,Curphy
, J.
, Karas
, C.
, Meyers
, G.
, Hawn
, D.
, Chakrabarti
, A.
, and Froelicher
, S.
, 2000
, “On the mechanical reliability of photo-BCB-based Thin Film Dielectric Polymer for Electronic Packaging Applications
,” ASME J. Electron. Packag.
, 122
, pp. 28
–33
.17.
Pan
, C. T.
, Yang
, H.
, Shen
, S. C.
, Chou
, M. C.
, and Chou
, H. P.
, 2002
, “A low-temperature wafer bonding technique using patternable materials
,” J. Micromech. Microeng.
, 12
, pp. 611
–615
.18.
Go, J. S., and Cho, Y. H., 1998, “Experimental evaluation of anodic bonding process using taguchi method for maximum interfacial fracture toughness,” Proc. MEMS’98, pp. 318–321.
19.
Tsau
, C. T.
, Spearing
, S. M.
, and Schmidt
, M. A.
, 2002
, “Fabrication of wafer-level thermocompression bonds
,” J. MEMS
, 11
(6
), pp. 641
–647
.20.
Polyakov, A., Mendes, P. M., Sinaga, S. M., Bartek, M., Rejaei, B., Correia, J., and Burghartz, J. N., 2003, “Processability and Electrical Characteristics of Glass Substrates for RF Wafer-Level Chip-Scale Packages,” Proc. 53rd ECTC, New Orleans, LA.
21.
Pham, N. P., Scholtes, T. L. M., Klerks, R., Boellaard, E., Sarro, P. M., and Burghartz, J. N., 2002, “Direct spray coating of photoresist-a new method for patterning 3-D structures,” Proc. Eurosensors XVI, Prague, Czech Republic, pp. 182–185.
22.
Turmezei, P., Polyakov, A., Mollinger, J. R., Bartek, M., Bossche, A., and Burghartz, J. N., 2003, “Low-Cost Microfilter for Red Blood Cell Membrane Stiffness Measurement Using Photosensitive BCB,” Proc. Transducers’03, Vol. 1, pp. 107–110.
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