The effects of dissolved air in the dielectric liquid FC-77 on flow boiling in a microchannel heat sink containing ten parallel channels, each wide and deep, were experimentally investigated. Experiments were conducted before and after degassing, at three flow rates in the range of . The dissolved air resulted in a significant reduction in wall temperature at which bubbles were first observed in the microchannels. Analysis of the results suggests that the bubbles observed initially in the undegassed liquid were most likely air bubbles. Once the boiling process is initiated, the wall temperature continues to increase for the undegassed liquid, whereas it remains relatively unchanged in the case of the degassed liquid. Prior to the inception of boiling in the degassed liquid, the heat transfer coefficients with the undegassed liquid were higher than for degassed liquid, depending on the flow rate. The heat transfer coefficients for both cases reach similar values at high heat fluxes once the boiling process with the degassed liquid was well established. The boiling process induced a significant increase in pressure drop relative to single-phase flow; the pressure drop for undegassed liquid was measured to be higher than for degassed liquid once the boiling process became well established in both cases. Flow instabilities were induced by the boiling process, and the magnitude of the instability was quantified using the standard deviation of the measured pressure drop at a given heat flux. It was found that the magnitude of flow instability increased with increasing heat flux in both the undegassed and degassed liquids, with greater flow instability noted in the undegassed liquid.
Skip Nav Destination
e-mail: sureshg@purdue.edu
Article navigation
December 2006
Research Papers
Effects of Dissolved Air on Subcooled Flow Boiling of a Dielectric Coolant in a Microchannel Heat Sink
Tailian Chen,
Tailian Chen
Cooling Technologies Research Center, School of Mechanical Engineering,
Purdue University
, West Lafayette, IN 47907-2088
Search for other works by this author on:
Suresh V. Garimella
Suresh V. Garimella
Cooling Technologies Research Center, School of Mechanical Engineering,
e-mail: sureshg@purdue.edu
Purdue University
, West Lafayette, IN 47907-2088
Search for other works by this author on:
Tailian Chen
Cooling Technologies Research Center, School of Mechanical Engineering,
Purdue University
, West Lafayette, IN 47907-2088
Suresh V. Garimella
Cooling Technologies Research Center, School of Mechanical Engineering,
Purdue University
, West Lafayette, IN 47907-2088e-mail: sureshg@purdue.edu
J. Electron. Packag. Dec 2006, 128(4): 398-404 (7 pages)
Published Online: February 1, 2006
Article history
Received:
July 11, 2005
Revised:
February 1, 2006
Citation
Chen, T., and Garimella, S. V. (February 1, 2006). "Effects of Dissolved Air on Subcooled Flow Boiling of a Dielectric Coolant in a Microchannel Heat Sink." ASME. J. Electron. Packag. December 2006; 128(4): 398–404. https://doi.org/10.1115/1.2351905
Download citation file:
Get Email Alerts
Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation
J. Electron. Packag (December 2024)
Special Issue on InterPACK2023
J. Electron. Packag
Related Articles
Transport Phenomena in Two-Phase Micro-Channel Heat Sinks
J. Electron. Packag (June,2004)
Surface Roughness Effects on Flow Boiling in Microchannels
J. Thermal Sci. Eng. Appl (December,2009)
Pool Boiling Using Thin Enhanced Structures Under Top-Confined Conditions
J. Heat Transfer (December,2006)
Flow Boiling in a Heat Sink Embedded With Hexagonally Linked Minichannels
J. Heat Transfer (August,2016)
Related Proceedings Papers
Related Chapters
Introduction
Thermal Management of Microelectronic Equipment
Thermal Interface Resistance
Thermal Management of Microelectronic Equipment
Thermal Interface Resistance
Thermal Management of Microelectronic Equipment, Second Edition