Isothermal three-point and four-point cyclic bend fatigue test methods have been developed for Sn–Ag–Cu solder joints. Reported bend tests from the literature were conducted at room temperature (25°C) and there is lack of data for lead-free solder joints. In this study, very-thin quad flat no-lead (VQFN) assembly with Sn–Ag–Cu lead-free solder was tested under three-point and four-point cyclic bending loads at both room temperature (25°C) and high temperature (125°C). The correlation between three-point and four-point bend tests was developed. Two different board surface finishes of electroless Ni and immersion gold (ENIG) and organic solderability preservatives (OSP) were investigated. Bending fatigue resistance of VQFN with OSP finish is slightly better than ENIG finish case. The acceleration factor of failure at high temperature (125°C) is higher than that at room temperature (25°C). Finite element analysis modeling and simulation were performed for different test conditions to investigate the solder joint stress-strain behavior. Volume-averaged energy density was used as a fatigue damage parameter and energy-based bending fatigue models were developed for VQFN with Sn–Ag–Cu solder joint under cyclic bending load at both 25°C and 125°C.
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e-mail: mhlpang@ntu.edu.sg
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December 2007
Research Papers
Isothermal Cyclic Bend Fatigue Test Method for Lead-Free Solder Joints
John H. L. Pang,
John H. L. Pang
School of Mechanical and Aerospace Engineering,
e-mail: mhlpang@ntu.edu.sg
Nanyang Technological University
, 50 Nanyang Avenue, Singapore 639798, Singapore
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F. X. Che
F. X. Che
School of Mechanical and Aerospace Engineering,
Nanyang Technological University
, 50 Nanyang Avenue, Singapore 639798, Singapore
Search for other works by this author on:
John H. L. Pang
School of Mechanical and Aerospace Engineering,
Nanyang Technological University
, 50 Nanyang Avenue, Singapore 639798, Singaporee-mail: mhlpang@ntu.edu.sg
F. X. Che
School of Mechanical and Aerospace Engineering,
Nanyang Technological University
, 50 Nanyang Avenue, Singapore 639798, SingaporeJ. Electron. Packag. Dec 2007, 129(4): 496-503 (8 pages)
Published Online: August 27, 2007
Article history
Received:
January 23, 2007
Revised:
August 27, 2007
Citation
Pang, J. H. L., and Che, F. X. (August 27, 2007). "Isothermal Cyclic Bend Fatigue Test Method for Lead-Free Solder Joints." ASME. J. Electron. Packag. December 2007; 129(4): 496–503. https://doi.org/10.1115/1.2809442
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