This paper presents a simulation method to evaluate the thermal fatigue life of a power module. A coupled electrical-thermal analysis was performed to obtain the nonuniform temperature distribution of electric current. Then, a thermomechanical analysis was carried out based on the temperature distribution from the electrical-thermal analysis. Since crack propagation can change the route of heat transfer, a crack path simulation technique was used to investigate the fracture behavior of the power module. The crack initiates in the solder joint below the Al bonding wire of the insulated gate bipolar transistor module and propagates by increasing the diameter. The effect of the bonding type on power cycling fatigue life is also discussed. The fracture process was found to depend on the type of bonding. Lead frame bonding was found to be more effective than wire bonding.
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September 2010
Research Papers
Reliability Evaluation on Deterioration of Power Device Using Coupled Electrical-Thermal-Mechanical Analysis
Takashi Anzawa,
Takashi Anzawa
Department of Mechanical Engineering and Materials Science,
Yokohama National University
, 79-5 Tokiwadai, Hodogaya-ku, Yokohama 240-8501, Japan
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Qiang Yu,
Qiang Yu
Department of Mechanical Engineering and Materials Science,
Yokohama National University
, 79-5 Tokiwadai, Hodogaya-ku, Yokohama 240-8501, Japan
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Masanori Yamagiwa,
Masanori Yamagiwa
Department of Mechanical Engineering and Materials Science,
Yokohama National University
, 79-5 Tokiwadai, Hodogaya-ku, Yokohama 240-8501, Japan; Electric Propulsion Laboratory, Nissan Research Center, Nissan Motor Co., Ltd.
, 1-Morinosatoaoyama, Atsugi-shi, Kanagawa 243-0123, Japan
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Tadahiro Shibutani,
Tadahiro Shibutani
Department of Safety Management,
Yokohama National University
, 79-7 Tokiwadai, Hodogaya-ku, Yokohama 240-8501, Japan
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Masaki Shiratori
Masaki Shiratori
Department of Mechanical Engineering and Materials Science,
Yokohama National University
, 79-5 Tokiwadai, Hodogaya-ku, Yokohama 240-8501, Japan
Search for other works by this author on:
Takashi Anzawa
Department of Mechanical Engineering and Materials Science,
Yokohama National University
, 79-5 Tokiwadai, Hodogaya-ku, Yokohama 240-8501, Japan
Qiang Yu
Department of Mechanical Engineering and Materials Science,
Yokohama National University
, 79-5 Tokiwadai, Hodogaya-ku, Yokohama 240-8501, Japan
Masanori Yamagiwa
Department of Mechanical Engineering and Materials Science,
Yokohama National University
, 79-5 Tokiwadai, Hodogaya-ku, Yokohama 240-8501, Japan; Electric Propulsion Laboratory, Nissan Research Center, Nissan Motor Co., Ltd.
, 1-Morinosatoaoyama, Atsugi-shi, Kanagawa 243-0123, Japan
Tadahiro Shibutani
Department of Safety Management,
Yokohama National University
, 79-7 Tokiwadai, Hodogaya-ku, Yokohama 240-8501, Japan
Masaki Shiratori
Department of Mechanical Engineering and Materials Science,
Yokohama National University
, 79-5 Tokiwadai, Hodogaya-ku, Yokohama 240-8501, JapanJ. Electron. Packag. Sep 2010, 132(3): 031012 (6 pages)
Published Online: September 30, 2010
Article history
Received:
November 29, 2009
Revised:
August 8, 2010
Online:
September 30, 2010
Published:
September 30, 2010
Citation
Anzawa, T., Yu, Q., Yamagiwa, M., Shibutani, T., and Shiratori, M. (September 30, 2010). "Reliability Evaluation on Deterioration of Power Device Using Coupled Electrical-Thermal-Mechanical Analysis." ASME. J. Electron. Packag. September 2010; 132(3): 031012. https://doi.org/10.1115/1.4002451
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