To achieve reductions in the power consumption of the data center cooling infrastructure, the current strategy in data center design is to increase the inlet temperature to the rack, while the current strategy for energy-efficient system thermal design is to allow increased temperature rise across the rack. Either strategy, or a combination of both, intuitively provides enhancements in the coefficient of performance of the data center in terms of computing energy usage relative to cooling energy consumption. However, this strategy is currently more of an empirically based approach from practical experience, rather than a result of a good understanding of how the impact of varying temperatures and flow rates at rack level influences each component in the chain from the chip level to the cooling tower. The aim of this paper is to provide a model to represent the physics of this strategy by developing a modeling tool that represents the heat flow from the rack level to the cooling tower for an air cooled data center with chillers. This model presents the performance of a complete data center cooling system infrastructure. After detailing the model, two parametric studies are presented that illustrate the influence of increasing rack inlet air temperature, and temperature rise across the rack, on different components in the data center cooling architecture. By considering the total data center, and each component’s influence on the greater infrastructure, it is possible to identify the components that contribute most to the resulting inefficiencies in the heat flow from chip to cooling tower and thereby identify the components in need of possible redesign. For the data center model considered here it is shown that the strategy of increasing temperature rise across the rack may be a better strategy than increasing inlet temperature to the rack.
Skip Nav Destination
Article navigation
March 2011
Research Papers
From Chip to Cooling Tower Data Center Modeling: Influence of Server Inlet Temperature and Temperature Rise Across Cabinet
Ed J. Walsh,
Ed J. Walsh
Stokes Institute,
University of Limerick
, Limerick, Ireland
Search for other works by this author on:
Jeff Punch,
Jeff Punch
CTVR, Stokes Institute,
University of Limerick
, Limerick, Ireland
Search for other works by this author on:
Amip J. Shah,
Amip J. Shah
Hewlet-Packard Laboratories
, Palo Alto, CA 94304
Search for other works by this author on:
Cullen E. Bash
Cullen E. Bash
Hewlet-Packard Laboratories
, Palo Alto, CA 94304
Search for other works by this author on:
Thomas J. Breen
Ed J. Walsh
Stokes Institute,
University of Limerick
, Limerick, Ireland
Jeff Punch
CTVR, Stokes Institute,
University of Limerick
, Limerick, Ireland
Amip J. Shah
Hewlet-Packard Laboratories
, Palo Alto, CA 94304
Cullen E. Bash
Hewlet-Packard Laboratories
, Palo Alto, CA 94304J. Electron. Packag. Mar 2011, 133(1): 011004 (8 pages)
Published Online: March 9, 2011
Article history
Received:
April 7, 2010
Revised:
December 2, 2010
Online:
March 9, 2011
Published:
March 9, 2011
Citation
Breen, T. J., Walsh, E. J., Punch, J., Shah, A. J., and Bash, C. E. (March 9, 2011). "From Chip to Cooling Tower Data Center Modeling: Influence of Server Inlet Temperature and Temperature Rise Across Cabinet." ASME. J. Electron. Packag. March 2011; 133(1): 011004. https://doi.org/10.1115/1.4003274
Download citation file:
Get Email Alerts
Anand Model Constants of Sn–Ag–Cu Solders: What Do They Actually Mean?
J. Electron. Packag (June 2025)
Sequential Versus Concurrent Effects in Combined Stress Solder Joint Reliability
J. Electron. Packag (June 2025)
Related Articles
Using a Novel Phase Change Material-Based Cooling Tower for a Photovoltaic Module Cooling
J. Sol. Energy Eng (April,2020)
Analytical Modeling for Thermodynamic Characterization of Data Center Cooling Systems
J. Electron. Packag (June,2009)
From Chip to Cooling Tower Data Center Modeling: Influence of Chip Temperature Control Philosophy
J. Electron. Packag (September,2011)
Ultra-Compact Microscale Heat Exchanger for Advanced Thermal Management in Data Centers
J. Electron. Packag (June,2022)
Related Proceedings Papers
Related Chapters
Engineering and Physical Modeling of Power Plant Cooling Systems
Thermal Power Plant Cooling: Context and Engineering
Control and Operational Performance
Closed-Cycle Gas Turbines: Operating Experience and Future Potential
Thermal Interface Resistance
Thermal Management of Microelectronic Equipment, Second Edition