Modified Constitutive Creep Laws With Micromechanical Modeling of Pb-Free Solder Alloys

This paper explicitly establishes a modified creep model of a Sn–_3.8Ag–_0.7Cu alloy using a physical-based micromechanical modeling technique. Through experimentation and reformulation, steady-state creep behavior is analyzed with minimum strain rates for different temperatures 35 °C, 80 °C, and 125 °C. The new modified physical creep model is proposed, by understanding the respective precipitate strengthened deformation mechanism, seeing the dependency of the activation energy over the temperature along with stress and, finally, by integrating the subgrain-size dependency λ_ss. The new model is found to accurately model the creep behavior of lead-free solder alloy by combining the physical state variables. The features of the creep model can be explored further by changing the physical variable such as subgrain size to establish a structure–property relationship for a better solder joint reliability performance.