Abstract
This study describes a novel and unconventional approach for embedding passive surface mounted device (SMD) components into printed circuit boards. Therefore, passive components whose package size is 0201 are embedded in two types of vias. On the final quality of an embedded passive component, the effects of various technological factors, including tin-lead and lead-free solder pastes, various types and dimensions of vias, various soldering techniques, and sample positions during the reflow process, have been investigated and described. The results show the impact of tin-lead solder paste and polymeric solder paste on the creation of electrical shorts in the embedding of passive components. The application of microvias for the embedding of passive components eliminates the fundamental issues, such as electrical shorts, component dislocation, and the low success rate for creating a reliable solder joint. The proposed method for miniaturizing printed circuit boards by embedding passive components in microvias was verified by experimental results. The reliability of the proposed methodology is further supported by electrical measurements. This study describes an approach suitable to printed circuit board (PCB) prototyping that makes a negligible contribution to hardware design and electronic technologies.
Issue Section:
Research Papers
References
1.
Jillek
,
W.
, and
Yung
,
W. K. C.
, 2005
, “
Embedded Components in Printed Circuit Boards: A Processing Technology Review
,” Int. J. Adv. Manuf. Technol.
,
25
(3–4
), pp. 350
–360
.10.1007/s00170-003-1872-y2.
Jones
,
G. D.
, and
Lauffer
,
J.
, 2002
, “
Embedded Passive Technology for Networking Systems
,” Circuit World
,
28
(4
), pp. 26
–32
.10.1108/030561202104315163.
David Gerke
,
R.
, 2005
, “Embedded Passives Technology—An Overview
,” National Aeronautics and Space Administration, Washington, DC, Report No. FY ’04.https://nepp.nasa.gov/docuploads/CDEFCBE7-6369-4A0B-A229B5632F364A89/Embedded%20Passives%20BOK.f.doc4.
Gerke
,
R. D.
, and
Ator
,
D.
, 2006
, “
Embedded Resistors and Capacitors in Organic and Inorganic Substrates
,” Proceedings of the 2006 IEEE Aerospace Conference
, Big Sky, MT, Mar. 4–11, pp. 1
–17
.10.1109/AERO.2006.16559665.
Manessis
,
D.
,
Pawlikowski
,
J.
,
Ostmann
,
A.
,
Schischke
,
K.
,
Aschenbrenner
,
R.
,
Schneider-Ramelow
,
M.
,
Krivec
,
T.
,
Podhradsky
,
G.
, and
Lang
,
K.
, 2017
, “
Embedding Technologies for Heterogeneous Integration of Components in PCBs—An Innovative Modularisation Approach With Environmental Impact
,” Proceedings of the 2017 21st European Microelectronics and Packaging Conference (EMPC
) and Exhibition, Warsaw, Poland, Sept. 10–13, pp. 1
–8
.10.23919/EMPC.2017.83468796.
Sampson
,
M. J.
, 2010
, “
Packaging and Embedded Electronics for the Next Generation
,” NEPP Electronic Technology Workshop
, NASA GSFC, Greenbelt, MD, June 22–24, pp. 1
–21
.https://nepp.nasa.gov/workshops/etw2010/talks/05_Sampson_Packaging%20and%20embedded%20electronics%20for%20the%20next%20generation.pdf7.
Suppa
,
M.
, 2008
, “
The Process and Pastes for the Via Hole Plugging of HDI PCBs
,” Circuit World
,
34
(1
), pp. 25
–31
.10.1108/030561208108487618.
Varadarajan
,
M. G.
,
Lee
,
K. J.
,
Bhattacharya
,
S. K.
,
Pucha
,
R.
,
Tummala
,
R. R.
, and
Sitaraman
,
S.
, 2006
, “
Printed Circuit Board (PCB) Miniaturization by Embedded Passives and Sequential Build-Up (SBU) Process Methodology
,” J. Indian Inst. Sci.
,
86
(6
), p. 639
.https://journal.iisc.ac.in/index.php/iisc/article/view/23339.
Shah
,
V. G.
, and
Hayes
,
D. J.
, 2002
, “
Trimming and Printing of Embedded Resistors Using Demand-Mode Ink-Jet Technology and Conductive Polymer
,” IPC Printed Circuit Expo 2002
, Long Beach, CA, Mar. 24–28, pp. 1
–5
.https://www.microfab.com/images/papers/IPC_02.pdf10.
Wang
,
S.
, 2013
, “
Embedded Resistors in Printed Circuit Board Assembly
,” Proceedings of the 2013 8th International Symposium on Advanced Topics in Electrical Engineering (ATEE
), Bucharest, Romania, May 23–25, pp. 1
–4
.10.1109/ATEE.2013.656346511.
Chen
,
C.-S.
,
Lin
,
Y.-S.
,
Chen
,
W.-T.
,
Shyu
,
C.-S.
,
Lay
,
S.-J.
, and
Lee
,
M.-L.
, 2008
, “
PCB Embedded Capacitor With Central Via Connection Structure for RF Application
,” Proceedings of the 2008 Electrical Design of Advanced Packaging and Systems Symposium
, Seoul, South Korea, Dec. 10–12, pp. 77
–80
.10.1109/EDAPS.2008.473600312.
Electronic Solutions Division,
2013
, “
3MTM Embedded Capacitance Material (ECM)
,” 3M Electronic Solutions Division, Austin, TX.13.
Kim
,
Y. J.
,
Hwang
,
J. S.
,
Yoo
,
Y. J.
,
Khuyen
,
B. X.
,
Rhee
,
J. Y.
,
Chen
,
X.
, and
Lee
,
Y.
, 2017
, “
Ultrathin Microwave Metamaterial Absorber Utilizing Embedded Resistors
,” J. Phys. D: Appl. Phys.
,
50
(40
), p. 405110
.10.1088/1361-6463/aa82f414.
Lee
,
H. F.
,
Chan
,
C. Y.
, and
Tang
,
C. S.
, 2008
, “
Embedding Capacitors and Resistors Into Printed Circuit Boards Using a Sequential Lamination Technique
,” J. Mater. Process. Technol.
,
207
(1–3
), pp. 72
–88
.10.1016/j.jmatprotec.2007.12.05115.
Rovensky
,
T.
,
Pietrikova
,
A.
, and
Vehec
,
I.
, 2017
, “
Possibility of PCBs' Miniaturization by Using Thick Film Polymer Resistors
,” Proceedings of the 2017 40th International Spring Seminar on Electronics Technology (ISSE
), Sofia, Bulgaria, May 10–14, pp. 1
–5
.10.1109/ISSE.2017.800088816.
Schiffmacher
,
A.
,
Wilde
,
J.
,
Litzenberger
,
L.
,
Huesgen
,
T.
, and
Polezhaev
,
V.
, 2019
, “
Silver Sintering on Organic Substrates for the Embedding of Power Semiconductor Devices
,” Proceedings of the 2019 IEEE 69th Electronic Components and Technology Conference (ECTC
), Las Vegas, NV, May 28–31, pp. 1443
–1450
.10.1109/ECTC.2019.0022217.
Pietrikova
,
A.
,
Lenger
,
T.
,
Fricova
,
O.
,
Popovic
,
L.
, and
Livovsky
,
L.
, 2020
, “
Properties of Glass/Epoxy Sandwich Structure for Electronic Boards
,” Microelectron. Int.
,
37
(3
), pp. 139
–146
.10.1108/MI-12-2019-008418.
Park
,
H.
,
Na
,
Y.
,
Choi
,
H.
,
Seo
,
D.
,
Oh
,
Y.
,
Suh
,
S.
, and
Yoon
,
J.
, 2018
, “
Via Reliability Evaluation of Embedded MLCC Through Pressure Cooker Test
,” Proceedings of the 2018 International Conference on Mechanical, Electronic and Information Technology (ICMEIT 2018
), Shanghai, China, Apr. 15–16, pp. 75
–78
.10.12783/dtetr/icmeit2018/2338419.
Janeczek
,
K.
,
Araźna
,
A.
,
Stęplewski
,
W.
,
Kościelski
,
M.
,
Lipiec
,
K.
,
Rafalik
,
I.
,
Karolewski
,
S.
,
Liszewska
,
D.
, and
Sitek
,
A.
, 2020
, “
Investigations of Temperature Sensor Embedded Into PCB
,” Microelectron. Int.
,
37
(4
), pp. 199
–204
.10.1108/MI-04-2020-001920.
Janeczek
,
K.
,
Araźna
,
A.
,
Stęplewski
,
W.
,
Kościelski
,
M.
,
Lipiec
,
K.
,
Liszewska
,
D.
, and
Sitek
,
A.
, 2021
, “
Reliability Investigations of a Sensor System Embedded Into Printed Circuits Boards
,” Phys. Status Solidi A
,
218
(4
), p. 2000622
.10.1002/pssa.20200062221.
Hadizadeh
,
R.
,
Laitinen
,
A.
,
Molinero
,
D.
,
Cunningham
,
S.
,
Vockerberger
,
C.
, and
Weis
,
G.
, 2019
, “
Embedded Component Packaging for Wafer-Level Encapsulated and Integrated RF Mems
,” Proceedings of the 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII
), Berlin, Germany, June 23–27, pp. 1615
–1618
.10.1109/TRANSDUCERS.2019.880880822.
Hou
,
F.
,
Wang
,
W.
,
Ma
,
R.
,
Li
,
Y.
,
Han
,
Z.
,
Su
,
M.
,
Li
,
J.
, et al., 2020
, “
Fan-Out Panel-Level PCB-Embedded SiC Power MOSFETs Packaging
,” IEEE J. Emerging Sel. Top. Power Electron.
,
8
(1
), pp. 367
–380
.10.1109/JESTPE.2019.295223823.
Wojcik
,
M.
,
Witek
,
D.
,
Klej
,
T.
, and
Ramotowski
,
E.
, 2016
, “
Embedding Components in Voltage Converter PCB for Size Reduction and Heat Management
,” Circuit World
,
42
(1
), pp. 17
–22
.10.1108/CW-10-2015-004824.
Kearney
,
D. J.
,
Kicin
,
S.
,
Bianda
,
E.
, and
Krivda
,
A.
, 2017
, “
PCB Embedded Semiconductors for Low-Voltage Power Electronic Applications
,” IEEE Trans. Compon., Packag., Manuf. Technol.
,
7
(3
), pp. 387
–395
.10.1109/TCPMT.2017.265164625.
Grubl
,
W.
,
Gross
,
S.
, and
Schuch
,
B.
, 2018
, “
Embedded Components for High Temperature Automotive Applications
,” Proceedings of the 2018 IEEE 68th Electronic Components and Technology Conference (ECTC
), San Diego, CA, May 29–June 1, pp. 1233
–1237
.10.1109/ECTC.2018.0019026.
Hofmann
,
T.
, 2017
, “
Sharing Experience in Embedding of Active and Passive Components in Organic PCBs for More Reliability and Miniaturization
,” HKPCA, Kowloon, Hong Kong, Report.27.
Schwerz
,
R.
,
Roellig
,
M.
,
Osmolovskyi
,
S.
, and
Wolter
,
K.-J.
, 2014
, “
Reliability Assessment of Discrete Passive Components Embedded Into PCB Core
,” Proceedings of the 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE
), Ghent, Belgium, Apr. 7–9, pp. 1
–7
.10.1109/EuroSimE.2014.681377628.
Naim Khan
,
M.
,
Arya
,
N.
, and
Singh
,
A. P.
, 2017
, “
A Comprehensive Testing Technique for Embedded System PCBA
,” Indian J. Sci. Technol.
,
10
(30
), pp. 1
–6
.10.17485/ijst/2017/v10i30/11552629.
Lukacs
,
P.
, and
Pietrikova
,
A.
, 2020
, “
Embedding of Passive SMD Components Into the Microvia
,” Proceedings of the 2020 43rd International Spring Seminar on Electronics Technology (ISSE
), Demanovska Valley, Slovakia, May 14–15, pp. 1
–4
.10.1109/ISSE49702.2020.912109230.
Klein Wassink
,
R. J.
, and
van Gerven
,
J. A. H.
, 1989
, “
Displacement of Components and Solder During Reflow Soldering
,” Soldering Surf. Mount Technol.
,
1
(1
), pp. 5
–10
.10.1108/eb037658Copyright © 2024 by ASME
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