Skip Nav Destination
Issues
June 2010
ISSN 1043-7398
EISSN 1528-9044
In this Issue
Research Papers
Viscous Scaling Phenomena in Miniature Centrifugal Flow Cooling Fans: Theory, Experiments and Correlation
J. Electron. Packag. June 2010, 132(2): 021001.
doi: https://doi.org/10.1115/1.4001590
Topics:
Blades
,
Chords (Trusses)
,
Fans
,
Flow (Dynamics)
,
Pressure
,
Scaling laws (Mathematical physics)
,
Cooling
,
Reynolds number
,
Design
Numerical Modeling of Perforated Tile Flow Distribution in a Raised-Floor Data Center
J. Electron. Packag. June 2010, 132(2): 021002.
doi: https://doi.org/10.1115/1.4001589
Topics:
Computer simulation
,
Data centers
,
Flow (Dynamics)
,
Pipes
,
Tiles
,
Air flow
,
Modeling
,
Porosity
Evaluation of the Dominant Factor for Electromigration in Sputtered High Purity Al Films
J. Electron. Packag. June 2010, 132(2): 021003.
doi: https://doi.org/10.1115/1.4001687
Topics:
Current density
,
Diffusion (Physics)
,
Electrodiffusion
,
Grain boundary diffusion
,
Grain size
,
Temperature
,
Sputtering (Irradiation)
,
Circuits
,
Damage
,
Strips
Hygro-Thermo-Mechanical Reliability Assessment of a Thermal Interface Material for a Ball Grid Array Package Assembly
J. Electron. Packag. June 2010, 132(2): 021004.
doi: https://doi.org/10.1115/1.4001746
Topics:
Finite element analysis
,
Manufacturing
,
Model validation
,
Reliability
,
Temperature
,
Warping
,
Laminates
,
Weight (Mass)
,
Lasers
,
Thermomechanics
An Experimental Investigation in the Performance of Water-Filled Silicon Microheat Pipe Arrays
J. Electron. Packag. June 2010, 132(2): 021005.
doi: https://doi.org/10.1115/1.4001745
Topics:
Manufacturing
,
Pipes
,
Silicon
,
Testing
,
Thermal conductivity
,
Water
,
Temperature
,
Thermal resistance
Board-Level Solder Joint Reliability Study of Land Grid Array Packages for RF Application Using a Laser Ultrasound Inspection System
J. Electron. Packag. June 2010, 132(2): 021006.
doi: https://doi.org/10.1115/1.4001832
Topics:
Cycles
,
Inspection
,
Lasers
,
Reliability
,
Solder joints
,
Ultrasound
,
X-rays
,
Fracture (Materials)
Singularities at Solder Joint Interfaces and Their Effects on Fracture Models
J. Electron. Packag. June 2010, 132(2): 021007.
doi: https://doi.org/10.1115/1.4001588
Topics:
Fracture (Materials)
,
Stress
,
Solder joints
,
Finite element analysis
Multi-Objective Optimization to Improve Both Thermal and Device Performance of a Nonuniformly Powered Micro-Architecture
J. Electron. Packag. June 2010, 132(2): 021008.
doi: https://doi.org/10.1115/1.4001852
Topics:
Junctions
,
Temperature
,
Pareto optimization
,
Delays
,
Temperature gradient
,
Engines
Data Center Housing High Performance Supercomputer Cluster: Above Floor Thermal Measurements Compared To CFD Analysis
J. Electron. Packag. June 2010, 132(2): 021009.
doi: https://doi.org/10.1115/1.4001871
Topics:
Computational fluid dynamics
,
Data centers
,
Temperature
,
Cooling
,
Air flow
Technical Briefs
Experimental Analysis Model of an Active Cooling Method for 3D-ICs Utilizing Multidimensional Configured Thermoelectric Coolers
J. Electron. Packag. June 2010, 132(2): 024501.
doi: https://doi.org/10.1115/1.4001831
Topics:
Cooling
,
Thermal management
,
Temperature
,
Heat sinks
,
Reliability
,
Thermoelectric coolers
,
Air flow
Email alerts
RSS Feeds
Sequential Versus Concurrent Effects in Combined Stress Solder Joint Reliability
J. Electron. Packag
Anand Model Constants of Sn-Ag-Cu Solders: What Do They Actually Mean?
J. Electron. Packag
