Topics: Bonding , Feature extraction , Signals , Wire bonding , Generators , Principal component analysis , Wire , Damping , Artificial neural networks , Shear strength

Time-Independent and Time-Dependent Inelastic Strain Analysis of Lead-Free Solder by Cyclic Loading Test Using Stepped Ramp Waves

Ken-ichi Ohguchi, Katsuhiko Sasaki

J. Electron. Packag. December 2010, 132(4): 041003. doi: https://doi.org/10.1115/1.4002897

Abstract

View articletitled, Time-Independent and Time-Dependent Inelastic Strain Analysis of Lead-Free Solder by Cyclic Loading Test Using Stepped Ramp Waves

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Topics: Creep , Deformation , Lead-free solders , Stress , Waves , Solders , Alloys

Solid-State Refrigeration Based on the Electrocaloric Effect for Electronics Cooling

Y. Sungtaek Ju

J. Electron. Packag. December 2010, 132(4): 041004. doi: https://doi.org/10.1115/1.4002896

Abstract

View articletitled, Solid-State Refrigeration Based on the Electrocaloric Effect for Electronics Cooling

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Topics: Cooling , Electrodes , Temperature , Thermal conductivity , Manufacturing

Application of a Taguchi Method Technique in Determining the Laminating Process Parameters for a Bonding Sheet

Yu-Tang Yen, Te-Hua Fang, Yu-Cheng Lin

J. Electron. Packag. December 2010, 132(4): 041005. doi: https://doi.org/10.1115/1.4002723

Abstract

View articletitled, Application of a Taguchi Method Technique in Determining the Laminating Process Parameters for a Bonding Sheet

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Topics: Bonding , Taguchi methods , Warping , Design

Multi-Objective Optimization of Thermo-Ultrasonic Flip-Chip Bonding Process for High-Brightness Light Emitting Diodes

Chung-Feng Jeffrey Kuo, Hui-Ta Chen, Te-Li Su, Jr-Da Huang

J. Electron. Packag. December 2010, 132(4): 041006. doi: https://doi.org/10.1115/1.4002727

Abstract

View articletitled, Multi-Objective Optimization of Thermo-Ultrasonic Flip-Chip Bonding Process for High-Brightness Light Emitting Diodes

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Topics: Bonding , Flip-chip , Light-emitting diodes , Leakage , Taguchi methods

The Effect of Thermal Contact Resistance at Porous-Solid Interfaces in Finned Metal Foam Heat Sinks

Christopher T. DeGroot, Derek Gateman, Anthony G. Straatman

J. Electron. Packag. December 2010, 132(4): 041007. doi: https://doi.org/10.1115/1.4002724

Abstract

View articletitled, The Effect of Thermal Contact Resistance at Porous-Solid Interfaces in Finned Metal Foam Heat Sinks

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Topics: Contact resistance , Heat sinks , Heat transfer , Metal foams , Fluids , Fins , Aluminum , Convection , Heat conduction , Epoxy adhesives

Fast Organic Conditioning of Patterned Surfaces for Capillary Part-to-Substrate Self-Assembly

M. Mastrangeli, K. Jans, T. Steylaerts, C. Van Hoof, J.-P. Celis

J. Electron. Packag. December 2010, 132(4): 041008. doi: https://doi.org/10.1115/1.4002725

Abstract

View articletitled, Fast Organic Conditioning of Patterned Surfaces for Capillary Part-to-Substrate Self-Assembly

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Topics: Coating processes , Coatings , Electronic packaging , Self-assembly , Fluids , Water , Hydrophobicity

An Investigation of Flat-Plate Oscillating Heat Pipes

Peng Cheng, Scott Thompson, Joe Boswell, H. B. Ma

J. Electron. Packag. December 2010, 132(4): 041009. doi: https://doi.org/10.1115/1.4002726

Abstract

View articletitled, An Investigation of Flat-Plate Oscillating Heat Pipes

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Topics: Diamonds , Flat plates , Fluids , Heat pipes , Heat transfer , Nanofluids , Temperature , Thermal resistance , Water , Operating temperature

Investigation of Effect of Creep Strain on Low-Cycle Fatigue of Lead-Free Solder by Cyclic Loading Using Stepped Ramp Waves

Ken-ichi Ohguchi, Katsuhiko Sasaki

J. Electron. Packag. December 2010, 132(4): 041010. doi: https://doi.org/10.1115/1.4002911

Abstract

View articletitled, Investigation of Effect of Creep Strain on Low-Cycle Fatigue of Lead-Free Solder by Cyclic Loading Using Stepped Ramp Waves

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Topics: Creep , Lead-free solders , Fatigue life , Compression , Fatigue testing , Waves , Stress

Successive Softening and Cyclic Damage in Viscoplastic Material

Leila J. Ladani

J. Electron. Packag. December 2010, 132(4): 041011. doi: https://doi.org/10.1115/1.4002722

Abstract

View articletitled, Successive Softening and Cyclic Damage in Viscoplastic Material

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Topics: Damage , Solders , Modeling , Finite element analysis , Cycles

Comparative Study of Phenolic-Based and Amine-Based Underfill Materials in Flip Chip Plastic Ball Grid Array Package

Z. Kornain, A. Jalar, R. Rasid, S. Abdullah

J. Electron. Packag. December 2010, 132(4): 041012. doi: https://doi.org/10.1115/1.4002741

Abstract

View articletitled, Comparative Study of Phenolic-Based and Amine-Based Underfill Materials in Flip Chip Plastic Ball Grid Array Package

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Topics: Absorption , Adhesion , Flip-chip , Flip-chip devices , Fracture toughness , Packaging , Reliability , Shear (Mechanics) , Temperature , Young's modulus

Translation Solder Self-Alignment Mechanics Modeling for a Flip Chip in the Presence of a Viscous Fluid

Brett Fennell, Sangil Lee, Daniel F. Baldwin

J. Electron. Packag. December 2010, 132(4): 041013. doi: https://doi.org/10.1115/1.4002825

Abstract

View articletitled, Translation Solder Self-Alignment Mechanics Modeling for a Flip Chip in the Presence of a Viscous Fluid

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Topics: Flip-chip devices , Flow (Dynamics) , Solders , Modeling , Springs , Surface tension , Viscosity , Fluids , Dampers

Surface Topographical Characterization of Gold Aluminide Compound for Thermosonic Ball Bonding

M. F. Rosle, S. Abdullah, M. A. A. Hamid, A. R. Daud, A. Jalar, Z. Kornain

J. Electron. Packag. December 2010, 132(4): 041014. doi: https://doi.org/10.1115/1.4002728

Abstract

View articletitled, Surface Topographical Characterization of Gold Aluminide Compound for Thermosonic Ball Bonding

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Topics: Bonding , Surface roughness

Thermal Conductivity of Diamond-Containing Grease

Hung-En Chou, Shang-Ray Yang, Sea-Fue Wang, James C. Sung

J. Electron. Packag. December 2010, 132(4): 041015. doi: https://doi.org/10.1115/1.4003002

Abstract

View articletitled, Thermal Conductivity of Diamond-Containing Grease

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Topics: Diamonds , Fillers (Materials) , Plasma desorption mass spectrometry , Thermal conductivity , Viscosity

Technical Briefs

Effects of the Thermocompression Bonding on the Microstructure and Contact Resistance for the Ultrafine Pitch Chip-on-Glass Packaging With Nonconductive Film

Jianhua Zhang, Jinsong Zhang, Lianqiao Yang

J. Electron. Packag. December 2010, 132(4): 044501. doi: https://doi.org/10.1115/1.4002898

Abstract

View articletitled, Effects of the Thermocompression Bonding on the Microstructure and Contact Resistance for the Ultrafine Pitch Chip-on-Glass Packaging With Nonconductive Film

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Topics: Bonding , Contact resistance , Packaging , Tin , Temperature , Pressure , Glass , High temperature , Melting point

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Research Papers

Determination of Spread Activation Energy and Assessment of Wetting Behavior of Solders on Metallic Substrates

On-Line Quality Detection of Ultrasonic Wire Bonding via Refining Analysis of Electrical Signal From Ultrasonic Generator

Time-Independent and Time-Dependent Inelastic Strain Analysis of Lead-Free Solder by Cyclic Loading Test Using Stepped Ramp Waves

Solid-State Refrigeration Based on the Electrocaloric Effect for Electronics Cooling

Application of a Taguchi Method Technique in Determining the Laminating Process Parameters for a Bonding Sheet

Multi-Objective Optimization of Thermo-Ultrasonic Flip-Chip Bonding Process for High-Brightness Light Emitting Diodes

The Effect of Thermal Contact Resistance at Porous-Solid Interfaces in Finned Metal Foam Heat Sinks

Fast Organic Conditioning of Patterned Surfaces for Capillary Part-to-Substrate Self-Assembly

An Investigation of Flat-Plate Oscillating Heat Pipes

Investigation of Effect of Creep Strain on Low-Cycle Fatigue of Lead-Free Solder by Cyclic Loading Using Stepped Ramp Waves

Successive Softening and Cyclic Damage in Viscoplastic Material

Comparative Study of Phenolic-Based and Amine-Based Underfill Materials in Flip Chip Plastic Ball Grid Array Package

Translation Solder Self-Alignment Mechanics Modeling for a Flip Chip in the Presence of a Viscous Fluid

Surface Topographical Characterization of Gold Aluminide Compound for Thermosonic Ball Bonding

Thermal Conductivity of Diamond-Containing Grease

Technical Briefs

Effects of the Thermocompression Bonding on the Microstructure and Contact Resistance for the Ultrafine Pitch Chip-on-Glass Packaging With Nonconductive Film

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