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Issues
September 2017
ISSN 1043-7398
EISSN 1528-9044
In this Issue
Review Article
A Review on Laser Processing in Electronic and MEMS Packaging
J. Electron. Packag. September 2017, 139(3): 030801.
doi: https://doi.org/10.1115/1.4036239
Overview of Human Thermal Responses to Warm Surfaces of Electronic Devices
J. Electron. Packag. September 2017, 139(3): 030802.
doi: https://doi.org/10.1115/1.4037146
Topics:
Heat
,
Skin
,
Temperature
,
Testing
Research Papers
Influence of Secondary Impact on Printed Wiring Assemblies—Part II: Competing Failure Modes in Surface Mount Components
J. Electron. Packag. September 2017, 139(3): 031001.
doi: https://doi.org/10.1115/1.4036187
Modified Constitutive Creep Laws With Micromechanical Modeling of Pb-Free Solder Alloys
J. Electron. Packag. September 2017, 139(3): 031002.
doi: https://doi.org/10.1115/1.4035850
Effect of Packaging Architecture on the Optical and Thermal Performances of High-Power Light Emitting Diodes
J. Electron. Packag. September 2017, 139(3): 031003.
doi: https://doi.org/10.1115/1.4036066
Topics:
Bonding
,
Energy dissipation
,
Heat
,
Light-emitting diodes
,
Operating temperature
,
Packaging
,
Phosphors
,
Temperature
,
Thermal resistance
,
Light emission
Far Back End of Line Aluminum Stress Reduction Methods for Two-Dimensional/2.5D Fine Pitch Assemblies
J. Electron. Packag. September 2017, 139(3): 031004.
doi: https://doi.org/10.1115/1.4036368
Topics:
Aluminum
,
Stress
,
Solder joints
,
Design
Performance Assessment of Single and Multiple Jet Impingement Configurations in a Refrigeration-Based Compact Heat Sink for Electronics Cooling
J. Electron. Packag. September 2017, 139(3): 031005.
doi: https://doi.org/10.1115/1.4036817
Topics:
Compressors
,
Cooling
,
Heat
,
Heat sinks
,
Heat transfer
,
Refrigeration
,
Stress
,
Temperature
,
Flow (Dynamics)
,
Refrigerants
Bio-Based Epoxy Resins Derived From Eugenol With Low Dielectric Constant
J. Electron. Packag. September 2017, 139(3): 031006.
doi: https://doi.org/10.1115/1.4036818
Topics:
Epoxy resins
,
Nuclear magnetic resonance
The Effects of Silica Fillers on the Properties of Encapsulation Molding Compounds
J. Electron. Packag. September 2017, 139(3): 031007.
doi: https://doi.org/10.1115/1.4037145
Flow Boiling Heat Transfer and Pressure Drops of R1234ze(E) in a Silicon Micro-pin Fin Evaporator
J. Electron. Packag. September 2017, 139(3): 031008.
doi: https://doi.org/10.1115/1.4037152
Topics:
Boiling
,
Flow (Dynamics)
,
Heat flux
,
Heat transfer
,
Heat transfer coefficients
,
Pressure drop
,
Temperature
,
Vapors
,
Fins
,
Heat
Experimental Analysis of a Novel Piezoelectric Jetting System for Micrograms Deposition in Electronic Assemblies
J. Electron. Packag. September 2017, 139(3): 031009.
doi: https://doi.org/10.1115/1.4037144
Topics:
Adhesives
,
Drops
,
Nozzles
,
Pistons
,
Experimental design
,
Manufacturing
,
Experimental analysis
,
Fluids
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Anand Model Constants of Sn–Ag–Cu Solders: What Do They Actually Mean?
J. Electron. Packag (June 2025)
Sequential Versus Concurrent Effects in Combined Stress Solder Joint Reliability
J. Electron. Packag (June 2025)
