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Issues
December 2017
ISSN 1043-7398
EISSN 1528-9044
In this Issue
Research Papers
Ultraminiaturized Three-Dimensional IPAC Packages With 100 μm Thick Glass Substrates for Radio Frequency Front-End Modules
J. Electron. Packag. December 2017, 139(4): 041001.
doi: https://doi.org/10.1115/1.4037221
Topics:
Glass
,
Manufacturing
,
Filters
Effects of Stacked Layers and Stacked Configurations on Wire Sweep and Wire Sag of Advanced Overhang/Pyramid Stacked Packages
J. Electron. Packag. December 2017, 139(4): 041002.
doi: https://doi.org/10.1115/1.4037276
Topics:
Wire
,
Deflection
Determination of Energy Release Rate Through Sequential Crack Extension
Scott McCann, Gregory T. Ostrowicki, Anh Tran, Timothy Huang, Tobias Bernhard, Rao R. Tummala, Suresh K. Sitaraman
J. Electron. Packag. December 2017, 139(4): 041003.
doi: https://doi.org/10.1115/1.4037334
Topics:
Fracture (Materials)
,
Thin films
,
Copper
Enhanced Bonding by Applied Current in Cu-to-Cu Joints Fabricated Using 20 μm Cu Microbumps
J. Electron. Packag. December 2017, 139(4): 041004.
doi: https://doi.org/10.1115/1.4037474
Topics:
Bonding
,
Contact resistance
,
Electrodiffusion
,
Shear strength
,
Temperature
,
Heating
,
Joules
Thermal Performance and Efficiency of a Mineral Oil Immersed Server Over Varied Environmental Operating Conditions
Richard Eiland, John Edward Fernandes, Marianna Vallejo, Ashwin Siddarth, Dereje Agonafer, Verrendra Mulay
J. Electron. Packag. December 2017, 139(4): 041005.
doi: https://doi.org/10.1115/1.4037526
Topics:
Cooling
,
Flow (Dynamics)
,
Mineral oil
,
Temperature
,
Energy consumption
,
Data centers
,
Testing
,
Fluids
Display Light Guide Swelling Due to Moisture Absorption
J. Electron. Packag. December 2017, 139(4): 041006.
doi: https://doi.org/10.1115/1.4037971
Topics:
Absorption
,
Diffusion (Physics)
,
Water
,
Water absorption
,
Polymers
Ball Grid Array Interconnection Properties of Solderable Polymer–Solder Composites With Low-Melting-Point Alloy Fillers
J. Electron. Packag. December 2017, 139(4): 041007.
doi: https://doi.org/10.1115/1.4038028
Airflow Management on the Efficiency Index of a Container Data Center Having Overhead Air Supply
J. Electron. Packag. December 2017, 139(4): 041008.
doi: https://doi.org/10.1115/1.4038114
Topics:
Air flow
,
Containers
,
Data centers
,
Temperature
,
Temperature distribution
,
Flow (Dynamics)
Embarked Quad Flat Nonlead 16, 32, and 64 Electronic Devices Subjected to Free Convection: Influence of the Adhesive Paste on the Junction Temperature
J. Electron. Packag. December 2017, 139(4): 041009.
doi: https://doi.org/10.1115/1.4038113
Topics:
Adhesives
,
Junctions
,
Natural convection
,
Reliability
,
Temperature
,
Thermal conductivity
,
Packaging
Solid-State Microjoining Mechanisms of Wire Bonding and Flip Chip Bonding
J. Electron. Packag. December 2017, 139(4): 041010.
doi: https://doi.org/10.1115/1.4038143
Topics:
Bonding
,
Vibration
,
Flip-chip
,
Flip-chip devices
Effectiveness of Rack-Level Fans—Part I: Energy Savings Through Consolidation
J. Electron. Packag. December 2017, 139(4): 041011.
doi: https://doi.org/10.1115/1.4038235
Topics:
Fans
,
Temperature
Effectiveness of Rack-Level Fans—Part II: Control Strategies and System Redundancy
J. Electron. Packag. December 2017, 139(4): 041012.
doi: https://doi.org/10.1115/1.4038014
Topics:
Failure
,
Fans
,
Stress
,
Redundancy (Engineering)
,
Cooling
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Optimization of Micro-Pillars Electroplating Bonding Processes and Additives
J. Electron. Packag
Microbead Encapsulation for Protection of Electronic Components
J. Electron. Packag
Performance Analysis of a Brazed Plate Heat Exchanger During Condensation of R1233zd(E)
J. Electron. Packag (June 2025)
Wideband Equivalent Circuit Modeling and Parameter Extraction Method for Through Via in Ceramic Package Substrate
J. Electron. Packag (June 2025)
