Topics: Heat , Metamaterials , Thermal management , Cooling , Temperature , Thermal conductivity , Electronic packaging , Design , Packaging , Anisotropy

Research Papers

A Hybrid Finite Element Modeling: Artificial Neural Network Approach for Predicting Solder Joint Fatigue Life in Wafer-Level Chip Scale Packages

Zhiwen Chen, Zhao Zhang, Fang Dong, Sheng Liu, Li Liu

J. Electron. Packag. March 2021, 143(1): 011001. doi: https://doi.org/10.1115/1.4047227

Abstract

View articletitled, A Hybrid Finite Element Modeling: Artificial Neural Network Approach for Predicting Solder Joint Fatigue Life in Wafer-Level Chip Scale Packages

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Topics: Artificial neural networks , Fatigue life , Finite element analysis , Modeling , Solder joints , Creep , Finite element model

Detection of Sealant Delamination in Integrated Circuit Package Using Nondestructive Evaluation

Guoyi Li, Hyunseong Lee, Aditi Chattopadhyay, Rajesh Kumar Neerukatti, Kuang C. Liu

J. Electron. Packag. March 2021, 143(1): 011002. doi: https://doi.org/10.1115/1.4047228

Abstract

View articletitled, Detection of Sealant Delamination in Integrated Circuit Package Using Nondestructive Evaluation

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Topics: Delamination , Inspection , Sealants , Signals , Waves , Nondestructive evaluation , Excitation , Integrated circuits

Thermal Analysis and Optimization of Light-Emitting Diodes Filament Lamp

Jie Liu, Jinglong Zou, Sheng Liu

J. Electron. Packag. March 2021, 143(1): 011003. doi: https://doi.org/10.1115/1.4046762

Abstract

View articletitled, Thermal Analysis and Optimization of Light-Emitting Diodes Filament Lamp

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Topics: Energy dissipation , Heat , Light-emitting diodes , Optimization , Phosphors , Temperature , Junctions , Natural convection , Thermal analysis , Fins

Interfacial Behavior of Flux Residues and Its Impact on Copper/Underfill Adhesion in Microelectronic Packaging

John S. Andre, Nathan Ulrich, Karen Ji, Zhan Chen

J. Electron. Packag. March 2021, 143(1): 011004. doi: https://doi.org/10.1115/1.4047338

Abstract

View articletitled, Interfacial Behavior of Flux Residues and Its Impact on Copper/Underfill Adhesion in Microelectronic Packaging

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Topics: Adhesion , Copper , Flux (Metallurgy) , Shear (Mechanics)

An Overview of Thermal and Mechanical Design, Control, and Testing of the World's Most Powerful and Fastest Supercomputer

Anil Yuksel, Vic Mahaney, Chris Marroquin, Shurong Tian, Mark Hoffmeyer, Mark Schultz, Todd Takken

J. Electron. Packag. March 2021, 143(1): 011005. doi: https://doi.org/10.1115/1.4046847

Abstract

View articletitled, An Overview of Thermal and Mechanical Design, Control, and Testing of the World's Most Powerful and Fastest Supercomputer

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Topics: Design , Graphics processing units , Manufacturing , Water , Flow (Dynamics) , Testing , Cooling

Thermal Performance of Metal Foam Heat Sink With Pin Fins for Nonuniform Heat Flux Electronics Cooling

Yongtong Li, Liang Gong, Minghai Xu, Yogendra Joshi

J. Electron. Packag. March 2021, 143(1): 011006. doi: https://doi.org/10.1115/1.4046756

Abstract

View articletitled, Thermal Performance of Metal Foam Heat Sink With Pin Fins for Nonuniform Heat Flux Electronics Cooling

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Topics: Heat flux , Heat sinks , Metal foams , Heat transfer , Temperature , Fluids

An Investigation Into the Optothermal Behavior of a High Power Red Light Emitting Diode: Impact of an Optical Path

Ahmet Mete Muslu, Burak Ozluk, Mehmet Arik

J. Electron. Packag. March 2021, 143(1): 011007. doi: https://doi.org/10.1115/1.4047381

Abstract

View articletitled, An Investigation Into the Optothermal Behavior of a High Power Red Light Emitting Diode: Impact of an Optical Path

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Topics: Domes (Structural elements) , Heat , Junctions , Light-emitting diodes , Temperature , Currents , Imaging , Temperature measurement

Fatigue Properties and Microstructure of SnAgCu Bi-Based Solder Joint

Minghong Jian, Sinan Su, Sa'd Hamasha, Mohammad M. Hamasha, Atif Alkhazali

J. Electron. Packag. March 2021, 143(1): 011008. doi: https://doi.org/10.1115/1.4047341

Abstract

View articletitled, Fatigue Properties and Microstructure of SnAgCu Bi-Based Solder Joint

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Topics: Alloys , Fatigue , Fatigue life , Solder joints , Solders , Stress , Cycles , Energy dissipation , Fatigue properties , Reliability

Effects of High-Temperature Storage on the Glass Transition Temperature of Epoxy Molding Compound

Ruifeng Li, Daoguo Yang, Ping Zhang, Fanfan Niu, Miao Cai, G. Q. Zhang

J. Electron. Packag. March 2021, 143(1): 011009. doi: https://doi.org/10.1115/1.4047475

Abstract

View articletitled, Effects of High-Temperature Storage on the Glass Transition Temperature of Epoxy Molding Compound

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Topics: Epoxy resins , Glass transition , High temperature , Molding , Storage , Temperature , Epoxy adhesives

Development and Application of a Thin Flat Heat Pipe Design Optimization Tool for Small Satellite Systems

Steven A. Isaacs, Caelan Lapointe, Peter E. Hamlington

J. Electron. Packag. March 2021, 143(1): 011010. doi: https://doi.org/10.1115/1.4047576

Abstract

View articletitled, Development and Application of a Thin Flat Heat Pipe Design Optimization Tool for Small Satellite Systems

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Topics: Design , Heat pipes , Optimization , Vapors , Flat heat pipes , Temperature , Condensers (steam plant) , Computational fluid dynamics , Heat , Satellites

Principal Component Analysis and Independent Component Analysis-Based Prognostic Health Monitoring of Electronic Assemblies Subjected to Simultaneous Temperature-Vibration Loads

Pradeep Lall, Tony Thomas

J. Electron. Packag. March 2021, 143(1): 011011. doi: https://doi.org/10.1115/1.4047577

Abstract

View articletitled, Principal Component Analysis and Independent Component Analysis-Based Prognostic Health Monitoring of Electronic Assemblies Subjected to Simultaneous Temperature-Vibration Loads

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Topics: Signals , Vibration

Technical Brief

A New Correlation for Subcooled Flow Boiling Heat Transfer in a Vertical Narrow Microchannel

Zengchao Chen, Wei Li, Junye Li, Kan Zhou, Zhaozan Feng

J. Electron. Packag. March 2021, 143(1): 014501. doi: https://doi.org/10.1115/1.4046755

Abstract

View articletitled, A New Correlation for Subcooled Flow Boiling Heat Transfer in a Vertical Narrow Microchannel

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Topics: Boiling , Flow (Dynamics) , Fluids , Heat transfer , Microchannels , Subcooling , Water

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Research Papers

A Hybrid Finite Element Modeling: Artificial Neural Network Approach for Predicting Solder Joint Fatigue Life in Wafer-Level Chip Scale Packages

Detection of Sealant Delamination in Integrated Circuit Package Using Nondestructive Evaluation

Thermal Analysis and Optimization of Light-Emitting Diodes Filament Lamp

Interfacial Behavior of Flux Residues and Its Impact on Copper/Underfill Adhesion in Microelectronic Packaging

An Overview of Thermal and Mechanical Design, Control, and Testing of the World's Most Powerful and Fastest Supercomputer

Thermal Performance of Metal Foam Heat Sink With Pin Fins for Nonuniform Heat Flux Electronics Cooling

An Investigation Into the Optothermal Behavior of a High Power Red Light Emitting Diode: Impact of an Optical Path

Fatigue Properties and Microstructure of SnAgCu Bi-Based Solder Joint

Effects of High-Temperature Storage on the Glass Transition Temperature of Epoxy Molding Compound

Development and Application of a Thin Flat Heat Pipe Design Optimization Tool for Small Satellite Systems

Principal Component Analysis and Independent Component Analysis-Based Prognostic Health Monitoring of Electronic Assemblies Subjected to Simultaneous Temperature-Vibration Loads

Technical Brief

A New Correlation for Subcooled Flow Boiling Heat Transfer in a Vertical Narrow Microchannel

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